Abstract: A testing substrate includes a substrate and a first build-up structure. The substrate has a first surface and a second surface opposite to each other. The substrate includes a first conductive pattern. The first conductive pattern includes a plurality of conductive connectors, and each conductive connector penetrates the substrate from the first surface to the second surface of the substrate. The first build-up structure is arranged on the first surface. The first build-up structure has a second conductive pattern. The first conductive pattern is electrically connected to the second conductive pattern, and the size of the first conductive pattern is larger than or equal to the size of the second conductive pattern. A manufacturing method of the testing substrate and a probe card are also provided.

Abstract: A testing substrate includes a first build-up structure and a ceramic substrate. The ceramic substrate is arranged on the first build-up structure. The first bonding interface between the first build-up structure and the ceramic substrate includes a dielectric-to-dielectric bonding interface and a metal-to-metal bonding interface. A manufacturing method of a testing substrate and a probe card are also provided.

Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.

Abstract: A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

Abstract: A probe card device includes a probe head including a plurality of pins, wherein each of the pins includes a body, a first metal layer formed on the body, and a second metal layer covering the first metal layer; a multi-layered flexible board electrically connected to the pins; a support plate, the multi-layered flexible board disposed on a first surface of the support plate; and a circuit board electrically connected to the multi-layered flexible board.

Abstract: A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

Abstract: An electrical connector includes an insulative housing defining a front cavity for receiving and a rear cavity, a terminal assembly assembled in the rear cavity, and a ground member. The terminal assembly includes an upper terminal module, a lower terminal module sandwiching a shielding module therebetween. Said The upper terminal module includes a pair of upper ground terminals. Said The lower terminal module includes a plurality of lower ground terminals. Said The shielding module includes a metallic shielding plate. The ground member is associated with the shielding module to mechanically and electrically connect at least one of the upper ground terminals and the lower ground terminals with the shielding plate.