Patents by Inventor Chun-Hsiung Hwang

Chun-Hsiung Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935951
    Abstract: The present disclosure provides a semiconductor device structure in accordance with some embodiments. In some embodiments, the semiconductor device structure includes a semiconductor substrate of a first semiconductor material and having first recesses. The semiconductor device structure further includes a first gate stack formed on the semiconductor substrate and being adjacent the first recesses. In some examples, a passivation material layer of a second semiconductor material is formed in the first recesses. In some embodiments, first source and drain (S/D) features of a third semiconductor material are formed in the first recesses and are separated from the semiconductor substrate by the passivation material layer. In some cases, the passivation material layer is free of chlorine.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: March 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun Hsiung Tsai, Yuan-Ko Hwang
  • Patent number: 6091247
    Abstract: The present invention relates to a calibration method for step attenuator that is utilized in wide-band RF instruments, wherein the step attenuator comprises a plurality of single-stage attenuators connected in series. Use of the method disclosed in this invention allows one to obtain attenuation of the attenuator under various circumstances by computing measurements of single-stage attenuation. As opposed to the conventional calibration method, this invention is advantageous in reducing time for taking measurements, in elevating total attenuation of the object to be tested, and in simplifying the method of calibration and testing.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: July 18, 2000
    Assignee: Industrial Technology Research Institute
    Inventors: Woo-Yang Liu, Chun-Hsiung Hwang, Ming-Ho Hung