Abstract: A method of manufacturing chip resistors has steps of cutting grooves in a substrate, forming through holes, defining chip regions, forming main electrodes, forming resistor layers, forming first protective layers, forming stripped protective layers, forming inner electrodes, removing the stripped protective layers, plating outer electrodes and cutting the substrate. The step of cutting grooves on a substrate includes forming multiple parallel grooves on a substrate. The step of forming through holes includes forming multiple through holes between and across two adjacent grooves on the substrate, and each through hole has smooth inner walls. The step of plating outer electrodes includes plating outer electrodes on the inner electrodes by rack plating. The step of cutting the substrate includes cutting the substrate along the grooves to obtain individual chip resistors.

Abstract: A method of manufacturing chip resistors has steps of cutting grooves on a substrate, forming through holes, defining chip regions, forming main electrodes, forming resistor layers, forming primary protective layers, dividing the substrate into multiple strips, forming inner electrodes, cutting the strips into multiple chip resistor units and plating outer electrodes. The step of cutting grooves on a substrate includes forming multiple grooves parallel to each other on a substrate. The step of forming through holes includes forming multiple through holes between and across each two adjacent grooves on the substrate, and each through hole has smooth inner walls. The step of dividing the substrate into multiple strips includes cutting the substrate along and perpendicular to the through holes. The step of cutting the strips into multiple chip resistor units includes cutting the strips along the grooves into multiple chip resistor units.

Abstract: A substrate for forming passive elements in chip type has a top surface, a thickness, multiple parallel grooves, multiple through holes and multiple chip regions. The parallel grooves are formed on the top surface of the substrate. The through holes are formed between and across two adjacent parallel grooves, and each through hole is separated from other through holes and has smooth inner walls. The chip regions are defined between adjacent through holes and parallel grooves and are arranged in a matrix.

Abstract: A supplementary teaching instrument based on mathematical basic theories and principles as well as child psychology. The invention employs a number of rectangular blocks of a prescribed shape which occupy a predetermined area when assembled together, and a corresponding area of triangular shaped blocks of various sizes and shapes. In addition to creating artistic designs by different arrangements of the blocks which may be of different colors, the rectangular blocks can be used in the fashion of a domino game, and the dimensional relationship between the triangular blocks and the rectangular blocks teach the basic concepts of mathematics including addition, substraction, multiplication, fractions, areas, and the like.