Patents by Inventor Chun-Hsiung Wu

Chun-Hsiung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124528
    Abstract: The present invention relates to an antagonist of interleukin-17B receptor (IL-17RB) which features interruption of the interaction of IL-17RB and MLK4. The present invention also relates to use of such antagonist for treatment of diseases or disorders associated with IL-17RB activation. Further disclosed is a phosphorylated IL-17RB as a biomarker for predicting prognosis and/or monitoring progression of cancer.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 18, 2024
    Applicant: Academia Sinica
    Inventors: Wen-Hwa LEE, Heng-Hsiung WU, Chun-Mei HU, Chun-Kai HUANG
  • Patent number: 11961892
    Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Carlos H. Diaz, Chung-Cheng Wu, Chia-Hao Chang, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin, Wai-Yi Lien, Ying-Keung Leung
  • Patent number: 11942376
    Abstract: Methods of manufacturing a semiconductor structure are provided. One of the methods includes: receiving a substrate including a first conductive region of a first transistor and a second conductive region of a second transistor, wherein the first transistor and the second transistor have different conductive types; performing an amorphization on the first conductive region and the second conductive region; performing an implantation over the first conductive region of the first transistor; forming a contact material layer over the first conductive region and the second conductive region; performing a thermal anneal on the first conductive region and the second conductive region; and performing a laser anneal on the first conductive region and the second conductive region.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun Hsiung Tsai, Cheng-Yi Peng, Ching-Hua Lee, Chung-Cheng Wu, Clement Hsingjen Wann
  • Patent number: 11929417
    Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Carlos H. Diaz, Chung-Cheng Wu, Chia-Hao Chang, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin, Wai-Yi Lien, Ying-Keung Leung
  • Publication number: 20170297287
    Abstract: A production method of glueless pasted integrally modeling sole comprising the following steps: taking a rubber outsole compound in a mold to perform partial vulcanization; taking a midsole compound in the mold to simultaneously perform pressurizing and heating together with the rubber outsole compound that has been partially vulcanized to simultaneously generate more vulcanization of the rubber outsole compound and foaming reaction of the midsole compound and occurring adhesion; and completing glueless adhering and pasting for the rubber outsole and the foaming midsole after the mold is cooled down so as to obtain a sole finished product. Accordingly, it can greatly reduce the procedure of forming soles, decrease labor force at great quantity and energy use, and reduce the proportion of producing waste and also achieves the efficacies of reducing costs and energy saving and carbon reduction at the same time.
    Type: Application
    Filed: April 19, 2016
    Publication date: October 19, 2017
    Inventor: CHUN-HSIUNG WU
  • Publication number: 20160340488
    Abstract: A composition of thermoplastic elastomer composite material applicable to in-mold foaming includes a thermoplastic elastomer, a blowing agent group which is P,P-oxybis benzene sulfonyl hydrazide, and a micro-capsule blowing agent. After the thermoplastic elastomer and the blowing agent group are melt-mixed, granulated, or milled, the composition may be used for in-mold foaming to achieve the effects of controlling the foam size, lowering the defective rate, reducing the waste of materials and the weight, adhering different types of materials, and saving time and material effectively.
    Type: Application
    Filed: May 23, 2015
    Publication date: November 24, 2016
    Inventor: CHUN-HSIUNG WU
  • Patent number: 8192091
    Abstract: An optical fiber connector adapter has a housing, a front sleeve holder, a rear sleeve holder, a sleeve and detachable positioning member. The housing has a cavity, two limiting protrusions and two positioning slots. The cavity and positioning slots are defined in the housing. The limiting protrusions are formed in the cavity. The front and sleeve holders are mounted in the cavity and each has a tube and a mount abutting the limiting protrusions. The sleeve is mounted in the tubes. The detachable positioning member is mounted on the housing and has two stoppers extending respectively the positioning slots to make the mounts clamped between the limiting protrusions and the stoppers. The optical fiber connector adapter with the detachable positioning member may be detached easily to facilitate rework.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: June 5, 2012
    Assignee: Advanced Connectek Inc.
    Inventors: Min-Chao Hsu, Chun-Hsiung Wu, Shang-Yi Tung
  • Publication number: 20100278497
    Abstract: An optical fiber connector adapter has a housing, a front sleeve holder, a rear sleeve holder, a sleeve and detachable positioning member. The housing has a cavity, two limiting protrusions and two positioning slots. The cavity and positioning slots are defined in the housing. The limiting protrusions are formed in the cavity. The front and sleeve holders are mounted in the cavity and each has a tube and a mount abutting the limiting protrusions. The sleeve is mounted in the tubes. The detachable positioning member is mounted on the housing and has two stoppers extending respectively the positioning slots to make the mounts clamped between the limiting protrusions and the stoppers. The optical fiber connector adapter with the detachable positioning member may be detached easily to facilitate rework.
    Type: Application
    Filed: June 22, 2009
    Publication date: November 4, 2010
    Applicant: ADVANCED CONNECTEK INC.
    Inventors: Min-Chao HSU, Chun-Hsiung WU, Shang-Yi TUNG
  • Patent number: 7658551
    Abstract: An optical fiber connector has a rear housing, a reinforcing sleeve and a front housing. The rear housing has a front end, a rear end, a top, a bottom, two opposite sides and two slits longitudinally defined respectively through the top and the bottom at the front end. The reinforcing sleeve is mounted in the rear housing. The front housing is mounted around and the rear housing from the front end of the rear housing and completely covers the slits of the rear housing. The optical fiber connector with the slits has high resistance to the external transverse pulling force and is excellently durable.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: February 9, 2010
    Assignee: Advanced Connectek Inc.
    Inventors: Chun-Hsiung Wu, Chih-Min Wang, Min-Chao Hsu, Jin Wu, Chia-Chu Lin
  • Publication number: 20060213600
    Abstract: An open-cell foam manufacturing method uses a thermoplastic elastomer material as a substrate and adds composites, foaming agents and crosslinking agents to produce a first external sheet and a second external sheet, and then forms a sandwich structure having the first external sheet, a reinforced layer and the second external sheet aligned and stacked in sequence to produce open-cell foam sheets with a sandwich structure. Threads are pressed on the surface of the foam sandwich structure by a roller to improve the slippery resistance of the foam material, which not only has high elasticity and slippery resisting property, but also creates a high tensile strength due to the fibers of the reinforced layer.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 28, 2006
    Applicant: MICROCELL COMPOSITE COMPANY
    Inventors: Chun-Hsiung Wu, Ruey-Sheng Shih
  • Publication number: 20050282920
    Abstract: The present invention is to provide a high multiple foam manufacturing method, which uses a thermoplastic elastomer as a substrate, adds a foaming agent and a cross-linker having different functions, and uses traditional devices for a kneading and a laminating processes to produce laminates of an appropriate size. The laminates are stacked with each other and then sent into the first section of a hot compression mold for the first-time compression molding and foaming. The pre-foaming cast so obtained is sent into a second section of the hot compression mold for a second-time compression mold foaming or a normal pressure foaming to produce the high multiple foam having the advantages of general plastic and rubber foams at the same time.
    Type: Application
    Filed: May 3, 2005
    Publication date: December 22, 2005
    Applicant: MICROCELL COMPOSITE COMPANY
    Inventor: Chun-Hsiung Wu
  • Publication number: 20050029696
    Abstract: The present invention is to provide a method of manufacturing continuous foam from a thermoplastic elastomeric composite in atmosphere, which comprises the steps of using thermoplastic elastomer as a raw material, adding different composing agent, foaming agent, and crosslinking agent into the raw material, kneading and rolling the raw material for forming a continuous sheet by means of a conventional rubber continuous foaming device, baking the sheet in an oven, foaming the heated sheet in a normal pressure, and cooling the foamed sheet to produce the foam material of the present invention.
    Type: Application
    Filed: April 15, 2004
    Publication date: February 10, 2005
    Applicant: MICROCELL COMPOSITE COMPANY
    Inventors: Chun-Hsiung Wu, Ruey-Sheng Shih
  • Publication number: 20050029697
    Abstract: The present invention is to provide a method of manufacturing a foam from a thermoplastic elastomeric material, which comprises the steps of using thermoplastic elastomer as a raw material, adding foaming agent and crosslinking agent into the raw material, kneading and rolling the materials for forming a continuous sheet by means of conventional devices, and cutting the continuous sheet and then conveying to a hot-press mold for foaming.
    Type: Application
    Filed: April 15, 2004
    Publication date: February 10, 2005
    Applicant: MICROCELL COMPOSITE COMPANY
    Inventors: Chun-Hsiung Wu, Ruey-Sheng Shih
  • Patent number: D783618
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: April 11, 2017
    Assignee: ADVANCED-CONNECTEK INC.
    Inventors: Chun-Hsiung Wu, Chin-Huang Chiu
  • Patent number: D815043
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: April 10, 2018
    Assignee: Advanced-Connectek Inc.
    Inventors: Chun-Hsiung Wu, Chin-Huang Chiu