Patents by Inventor Chun-Hua K. Chuang

Chun-Hua K. Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6069278
    Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a relatively high glass transition temperature and improved mechanical properties at useful temperature ranges.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: May 30, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Chun-Hua K. Chuang
  • Patent number: 6037499
    Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.
    Type: Grant
    Filed: December 24, 1998
    Date of Patent: March 14, 2000
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Chun-Hua K. Chuang
  • Patent number: 5939521
    Abstract: This invention relates the novel diamines, the polyimide oligomers and the polyimides derived therefrom and to the method of preparing the diamines, oligomers and the polyimides. The thermoplastic polyimides derived from the aromatic diamines of this invention are characterized as having a high glass transition temperature, good mechanical properties and improved processability in the manufacture of adhesives, electronic and composite materials for use in the automotive and aerospace industry. The distinction of the novel aromatic diamines of this invention is the 2,2',6,6'-substituted biphenyl radicals which exhibit noncoplanar conformation that enhances the solubility of the diamine as well as the processability of the polyimides, while retaining a realatively high glass transition temperature and improved mechanical properties at useful temperature ranges.
    Type: Grant
    Filed: January 23, 1998
    Date of Patent: August 17, 1999
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Chun-Hua K. Chuang
  • Patent number: 5863651
    Abstract: A new class of pyrylium salts and process for the manufacture, as well as the use of the new pyrylium salts as polycondensation components for a new class of polypyridinium salts and a new class of conducting polypyridinium salts manufactured by doping the polypyridinium salts with a conducting dopant is described. The new polypyridinium salts and their conducting doped analogs according to this invention are stable positively charged polymers resistant to base attack and are distinguished by water insolubility making them ideally suited as a metal anti-corrosion coating, stable in basic media making them ideally suited for separation membranes for anions, and as excellent, thermally and chemically stable conducting polymers when doped ideally suited for making electrically conducting materials and as redox catalysts.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: January 26, 1999
    Assignee: The University of Akron
    Inventors: Frank Harris, Chun Hua K. Chuang
  • Patent number: 5763563
    Abstract: A new class of pyrylium salts and process for the manufacture, as well as the use of the new pyrylium salts as polycondensation components for a new class of polypyridinium salts and a new class of conducting polypyridinium salts manufactured by doping the polypyridinium salts with a conducting dopant is described. The new polypyridinium salts and their conducting doped analogs according to this invention are stable positively charged polymers resistant to base attack and are distinguished by water insolubility making them ideally suited as a metal anti-corrosion coating, stable in basic media making them ideally suited for separation membranes for anions, and as excellent, thermally and chemically stable conducting polymers when doped ideally suited for making electrically conducting materials and as redox catalysts.
    Type: Grant
    Filed: August 19, 1994
    Date of Patent: June 9, 1998
    Assignee: The University of Akron
    Inventors: Frank Harris, Chun Hua K. Chuang
  • Patent number: 5322924
    Abstract: Addition polyimide resins having improved thermo-oxidative stability and enhanced processability are prepared by the reaction of a mixture of monomers comprising a non-planar polyphenyl diamine (a), a diester of tetracarboxylic acid or the corresponding dianhydride (b) and an end-capping agent (c), or a diamine (d), a non-planar polyphenyl diester or dianhydride of a tetracarboxylic acid (e) and an end-capping agent (c).
    Type: Grant
    Filed: October 7, 1991
    Date of Patent: June 21, 1994
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventors: Chun-Hua K. Chuang, Raymond D. Vannucci