Patents by Inventor Chun-Hua Lin
Chun-Hua Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152880Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.Type: ApplicationFiled: February 13, 2023Publication date: May 9, 2024Applicant: OBOOK INC.Inventors: Chun-Kai Wang, Chung-Han Hsieh, Chun-Jen Chen, Po-Hua Lin, Wei-Te Lin, Pei-Hsuan Weng, Mei-Su Wang, I-Cheng Lin, Cheng-Wei Chen
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Patent number: 11978678Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.Type: GrantFiled: August 5, 2022Date of Patent: May 7, 2024Assignee: INNOLUX CORPORATIONInventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang
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Patent number: 11955579Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.Type: GrantFiled: April 21, 2022Date of Patent: April 9, 2024Assignee: INNOLUX CORPORATIONInventors: Kai Cheng, Tsau-Hua Hsieh, Fang-Ying Lin, Tung-Kai Liu, Hui-Chieh Wang, Chun-Hsien Lin, Jui-Feng Ko
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Patent number: 11949040Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.Type: GrantFiled: April 21, 2022Date of Patent: April 2, 2024Assignee: INNOLUX CORPORATIONInventors: Kai Cheng, Tsau-Hua Hsieh, Fang-Ying Lin, Tung-Kai Liu, Hui-Chieh Wang, Chun-Hsien Lin, Jui-Feng Ko
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Publication number: 20240087986Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.Type: ApplicationFiled: November 15, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
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Publication number: 20240072115Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.Type: ApplicationFiled: February 13, 2023Publication date: February 29, 2024Inventors: Wei-Xiang You, Wei-De Ho, Hsin Yang Hung, Meng-Yu Lin, Hsiang-Hung Huang, Chun-Fu Cheng, Kuan-Kan Hu, Szu-Hua Chen, Ting-Yun Wu, Wei-Cheng Tzeng, Wei-Cheng Lin, Cheng-Yin Wang, Jui-Chien Huang, Szuya Liao
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Patent number: 8211695Abstract: The invention is to provide an isolated transgenic mammalian neural cell, which comprises at least one heterologous vector expressing AhR/ARNT. Also provided is methods the detection of a sample containing a chemical substance damage to the nervous system and the selection of drugs for treating neurodegenerative disorders.Type: GrantFiled: March 31, 2010Date of Patent: July 3, 2012Assignee: Taipei Medical UniversityInventors: Yi-Hsuan Lee, Cheng-Yu Wang, Shu-Hui Juan, Wen-Liang Chen, Kuo-Sheng Hung, Chun-Hua Lin
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Patent number: 8146440Abstract: A stress sensor includes a circuit board having a stress sensitive structure, a pointing stick and a metallic back plate. The stress sensitive structure includes a stress deformation region and multiple resistors located on the stress deformation region. The pointing stick is disposed on a top of the circuit board and connected to the stress sensitive structure. The metallic back plate includes at least one fixing material coating region, and thus the fixing edges of the circuit board are fixed on the corresponding fixing material coating region. An assembly method for the stress sensor is also provided.Type: GrantFiled: July 26, 2009Date of Patent: April 3, 2012Assignee: Elan Microelectronics Corp.Inventors: Chun-Hua Lin, Fumiaki Karasawa, Chun-Chieh Huang, Shih-Lang Huang
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Publication number: 20110244470Abstract: The invention is to provide an isolated transgenic mammalian neural cell, which comprises at least one heterologous vector expressing AhR/ARNT. Also provided is methods the detection of a sample containing a chemical substance damage to the nervous system and the selection of drugs for treating neurodegenerative disorders.Type: ApplicationFiled: March 31, 2010Publication date: October 6, 2011Applicant: TAIPEI MEDICAL UNIVERSITYInventors: Yi-Hsuan Lee, Cheng-Yu Wang, Shu-Hui Juan, Wen-Liang Chen, Kuo-Sheng Hung, Chun-Hua Lin
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Publication number: 20110000305Abstract: A stress sensor includes a circuit board having a stress sensitive structure, a pointing stick and a metallic back plate. The stress sensitive structure includes a stress deformation region and multiple resistors located on the stress deformation region. The pointing stick is disposed on a top of the circuit board and connected to the stress sensitive structure. The metallic back plate includes at least one fixing material coating region, and thus the fixing edges of the circuit board are fixed on the corresponding fixing material coating region. An assembly method for the stress sensor is also provided.Type: ApplicationFiled: July 26, 2009Publication date: January 6, 2011Inventors: Chun-Hua Lin, Fumiaki Karasawa, Chun-Chieh Huang, Shih-Lang Huang
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Publication number: 20090008162Abstract: An input device of capacitive touchpad is capable of generating an inducing capacitance through holding by a user. The claimed input device includes a pen nib which is made of/from an electric-conductive material, a pen body providing wider holding area for the user and a connect part for holding by the user. The pen nib and the connect part have an inlaying component in pairs such as mortise to lodged in or inset into each other. The pen nib may be made of/from an elastic or soft electric-conductive material which is made of/from a polyester compound doped or mixed with a metal powder or having metallic covering stuffed with the elastic or soft electric-conductive material for increasing the contact surface area. Accordingly, the present invention solves the available pad area shortening problem and the capacitance sensing variation result from the sweat of finger.Type: ApplicationFiled: January 22, 2008Publication date: January 8, 2009Inventors: Wei-Wen Yang, Chun-Hua Lin