Patents by Inventor Chun Huang

Chun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134193
    Abstract: The present specification describes examples of position-based switching of display devices. An example augmented reality (AR) device includes an AR display device to render display data. The example AR device also includes a wireless communication device to transmit and receive wireless signals. The example AR device further includes a processor to: 1) determine a position of the AR device relative to a computing device based on wireless signals communicated with the computing device; and 2) switch an activity state of the AR display device based on the determined position of the AR device relative to the computing device.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chung-Chun CHEN, Ming-Shien TSAI, Chih-Ming HUANG
  • Publication number: 20240136117
    Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 25, 2024
    Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HANG-CHUN LU, YA-WEN YANG, YU-TING HSU, WEI-ZHI HUANG
  • Patent number: 11966374
    Abstract: The present invention discloses a medical clinical data quality analysis system based on big data, which relates to the field of medical big data technologies. The present invention is used to solve the technical problems that multi-link classified acquisition cannot be carried out on medical behaviors, and the quality of clinical data cannot be analyzed and reflected at the front end, middle link, and tail end of management. In the present invention, authenticity data, compliance data, process data and conclusive data are comprehensively acquired in admission, hospitalization, and discharge links of medical clinical data quality management, which is conducive to implementing multi-link classified acquisition of clinical medical behaviors, thereby facilitating subsequent dynamic and orderly quality analysis and control of clinical data.
    Type: Grant
    Filed: July 11, 2023
    Date of Patent: April 23, 2024
    Assignee: SERV MEDICAL PTE. LTD.
    Inventors: Chun-Chieh Hsu, Shiyu Zhang, Jiangjiu Huang, Yingxi Wang, Rashaad Nawaz Tawquir
  • Patent number: 11967772
    Abstract: An antenna rotation structure includes a rotating shaft member rotatably disposed through a perforated groove of a housing, an annular member, and an elastic member. The rotating shaft member has a holding portion located in an accommodating space of the housing, a connecting portion connected to the holding portion and with an annular groove, and a gripping portion with one end connected to the connecting portion and the other end protruded from the housing. The annular member is disposed in the annular groove and abuts the perforated groove. The elastic member is sleeved on the one end of the gripping portion. The connecting portion and the one end of the gripping portion are disposed in the perforated groove. The gripping portion is turned to drive the rotating shaft member to rotate, thereby adjusting an angle of the antenna.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: April 23, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Chih-Feng Yang, Chao-Chun Lin, Shih Fong Huang
  • Publication number: 20240123034
    Abstract: The disclosure features lipid nanoparticle (LNP) compositions comprising mRNA molecules encoding human granulocyte macrophage colony stimulating factor (GM-CSF) polypeptides and uses thereof in the treatment of Parkinson's Disease. The LNP compositions of the present disclosure comprise mRNA therapeutics encoding human GM-CSF for use in such treatment.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 18, 2024
    Inventors: Eric Yi-Chun Huang, Jared Iacovelli, Seymour De Picciotto, Sze-Wah Tse, Laurie Kenney, Katherine Olson, Howard Gendelman, Lee R. Mosley
  • Publication number: 20240128216
    Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Ching-Chun Wang, Hsiao-Hui Tseng, Chen-Jong Wang, Dun-Nian Yaung
  • Publication number: 20240124350
    Abstract: A quantum dot composite structure and a method for forming the same are provided. The quantum dot composite structure includes: a glass particle including a glass matrix and a plurality of quantum dots located in the glass matrix, wherein at least one of the plurality of quantum dots includes an exposed surface in the glass matrix; and an inorganic protective layer disposed on the glass particle and covering the exposed surface.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: Ching LIU, Wen-Tse HUANG, Ru-Shi LIU, Pei Cong YAN, Chai-Chun HSIEH, Hung-Chun TONG, Yu-Chun LEE, Tzong-Liang TSAI
  • Patent number: 11962949
    Abstract: A method of performing air pollution estimation is provided. The method is to be implemented using a processor of a computer device and includes: generating a spectral image based on an original color image of an environment under test using a spectral transformation matrix; supplying the spectral image as an input into an estimating model for air pollution estimation; and obtaining an estimation result from the estimating model indicating a degree of air pollution of the environment under test.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 16, 2024
    Assignee: National Chung Cheng University
    Inventors: Hsiang-Chen Wang, Chia-Cheng Huang, Ting-Chun Men
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240121899
    Abstract: An electronic device includes a substrate, a plurality of flexible circuit boards, a plurality of ICs and an insulator. The flexible circuit boards are disposed on the substrate. In a top view of the electronic device, the flexible circuit boards are overlapped with an edge of the substrate. The ICs are disposed on the substrate. The insulator is disposed on the flexible circuit boards and contacted the ICs, wherein the insulator has a first side and a second side opposite to the first side and the first side is closer to the edge than the second side. Along a first direction perpendicular to an extension direction of the edge, a first minimum distance between the second side and one of the ICs is less than a second minimum distance between the second side and one of the flexible circuit boards.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Chin-Cheng Kuo, Chia-Chun Yang, Wen-Cheng Huang
  • Patent number: 11953719
    Abstract: An optical device is provided. The optical device includes a substrate, a first optical layer; a high k layer, and a second optical layer. The first optical layer is disposed on the substrate. The first optical layer comprises a top surface, a first sidewall, and a second side-wall opposite thereto. The high k layer is disposed on the top surface of the first optical layer. The second optical layer is disposed on the high k layer. The second optical layer includes a top surface, a third sidewall, and a fourth sidewall opposite thereto. The first sidewall of the first optical layer is misaligned with the third sidewall of the second optical layer. The second sidewall of the first optical layer is coplanar with the fourth sidewall of the second optical layer.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Tai-Chun Huang, Stefan Rusu
  • Patent number: 11954951
    Abstract: A data collecting system including a component assembled in an electric vehicle, a data collector connected to the component through a bus of the electric vehicle, and a debug server connected to the data collector is disclosed. The component collects different data from the electric vehicle and performs different sending procedures respectively under different situations including: a regular sending-procedure sends regular data to the bus based on a regular frequency; a high-speed sending-procedure starts collecting high-speed data and sending the same to the bus based on a high-speed frequency after a condition is satisfied; and a high-resolution sending-procedure sends high-resolution data to the bus after an error occurs, wherein the high-resolution data is collected within a period of time before and after the error occurs. The data collector collects these data from the bus. The debug server analyzes the data collected by the data collector.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 9, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Sheng-Chi Huang, Yun-Chun Lu
  • Patent number: 11955370
    Abstract: A system and methods of forming a dielectric material within a trench are described herein. In an embodiment of the method, the method includes introducing a first precursor into a trench of a dielectric layer, such that portions of the first precursor react with the dielectric layer and attach on sidewalls of the trench. The method further includes partially etching portions of the first precursor on the sidewalls of the trench to expose upper portions of the sidewalls of the trench. The method further includes introducing a second precursor into the trench, such that portions of the second precursor react with the remaining portions of the first precursor to form the dielectric material at the bottom of the trench.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Bo-Cyuan Lu, Ting-Gang Chen, Sung-En Lin, Chunyao Wang, Yung-Cheng Lu, Chi On Chui, Tai-Chun Huang, Chieh-Ping Wang
  • Patent number: 11955338
    Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Ru-Gun Liu, Chin-Hsiang Lin, Yu-Tien Shen
  • Patent number: 11955154
    Abstract: A sense amplifier circuit includes a sense amplifier, a switch and a temperature compensation circuit. The temperature compensation circuit provides a control signal having a positive temperature coefficient, based on which the switch provides reference impedance for temperature compensation. The sense amplifier includes a first input end coupled to a target bit and a second input end coupled to the switch. The sense amplifier outputs a sense amplifier signal based on the reference impedance and the impedance of the target bit.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Cheng-Tung Huang, Jen-Yu Wang, Po-Chun Yang, Yi-Ting Wu, Yung-Ching Hsieh, Jian-Jhong Chen, Chia-Wei Lee
  • Patent number: 11955199
    Abstract: A memory chip, a memory device and an operation method are disclosed. The memory chip includes a number of memory units and a control logic circuit. The memory units could be configured as TLC, MLC or SLC. The control logic circuit is configured to use TLC programming approach to program MLC and SLC.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: April 9, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Yung-Chun Li, Yu-Ming Huang
  • Patent number: 11955484
    Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
  • Publication number: 20240114631
    Abstract: A protecting method for preventing solder crack failure in an electronic product is provided. Firstly, a step (a) is performed to confirm that a crack incidence rate of a metallic solder material in a printed circuit board is high. In a step (b), a protecting mechanism of controlling the electronic product to enter an idle mode and leave the idle mode is activated. Consequently, an operating temperature of the electronic product decreases at a first average drop rate.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 4, 2024
    Inventors: Tsung-Lung LIN, Kuan-Yu CHEN, Yi-Chun HUANG
  • Publication number: 20240112323
    Abstract: A method for detecting defects on a wafer including the steps of obtaining a reference image of a chip pattern formed on a reference wafer, using a computer algorithm to analyze the reference image to produce a division map for the chip pattern; setting respective thresholds for divisions of the division map, obtaining a comparison data between a test image of the chip pattern formed on a test wafer and the reference image, using the division map and the thresholds to examine the comparison data to identify a defect in the test image.
    Type: Application
    Filed: November 17, 2022
    Publication date: April 4, 2024
    Applicant: United Semiconductor (Xiamen) Co., Ltd.
    Inventors: Yu Peng Hong, QINGRONG CHEN, Kai Ping Huang, Chin-Chun Huang, WEN YI TAN
  • Patent number: D1021804
    Type: Grant
    Filed: October 9, 2021
    Date of Patent: April 9, 2024
    Assignees: JESS-LINK PRODUCTS CO., LTD., TARNG YU ENTERPRISE CO., LTD.
    Inventors: Min-Chun Chiu, Chieh-Ming Cheng, Mu-Jung Huang