Abstract: A method of semiconductor die singulation is provided. The method includes forming a first trench along a singulation lane of a semiconductor wafer. A second trench is formed extending from a bottom of the first trench. A portion of the semiconductor wafer remains between a bottom of the second trench and a backside of the semiconductor wafer. A cut is formed by way of a laser to singulate die of the semiconductor wafer. The cut extends through the portion of the semiconductor wafer remaining between the bottom of the second trench and the backside of the semiconductor wafer.

Abstract: The present invention relates to an innovated anti-robbery handbag/box, having wires that are spaced onto the interior of the bag/box or container; each wire being connected with the high voltage discharge unit; in the master control box are a central processing device and other components; the master control box may be placed on the bottom of the bag/box; the central processing device comprises a central processing unit in a circuit board; the central processing device is respectively connected to the battery set, the security pull pin, the discharge unit, the buzzer, the chemical pouch, the radio frequency signal receiver and the timer; so designed that when the security pull pin starts the activation, it will discharge high voltage current onto the bag/box, and the buzzer will start to sound, and the chemical pouch will spray smoke onto the money notes inside the bag/box, to execute a longer period of discharge followed by a minimum period of current interruption, to allow the switching-off signal from the