Patents by Inventor Chun-hung Cheng

Chun-hung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12165867
    Abstract: Embodiments are directed to a method for minimizing electrostatic charges in a semiconductor substrate. The method includes depositing photoresist on a semiconductor substrate to form a photoresist layer on the semiconductor substrate. The photoresist layer is exposed to radiation. The photoresist layer is developed using a developer solution. The semiconductor substrate is cleaned with a first cleaning liquid to wash the developer solution from the photoresist layer. A tetramethylammonium hydroxide (TMAH) solution is applied to the semiconductor substrate to reduce charges accumulated in the semiconductor substrate.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Lin Chang, Chih-Chien Wang, Chihy-Yuan Cheng, Sz-Fan Chen, Chien-Hung Lin, Chun-Chang Chen, Ching-Sen Kuo, Feng-Jia Shiu
  • Publication number: 20240397828
    Abstract: Various embodiments of the present disclosure are directed towards a piezoelectric device including a piezoelectric structure over a substrate. A first conductive structure is disposed on a lower surface of the piezoelectric structure. The first conductive structure includes one or more first movable elements directly contacting the piezoelectric structure. A second conductive structure is disposed on an upper surface of the piezoelectric structure. The second conductive structure includes one or more second movable elements directly contacting the piezoelectric structure. The one or more second movable elements directly overlie the one or more first movable elements.
    Type: Application
    Filed: May 22, 2023
    Publication date: November 28, 2024
    Inventors: Ching-Hui Lin, Yi-Hsien Chang, Chun-Ren Cheng, Shih-Fen Huang, Fu-Chun Huang, Chao-Hung Chu, Po-Chen Yeh
  • Publication number: 20240379589
    Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.
    Type: Application
    Filed: July 21, 2024
    Publication date: November 14, 2024
    Inventors: Wei-Han CHIANG, Chun-Hung CHEN, Ching-Ho CHENG, Ching-Wen Hsiao, Hong-Seng SHUE, Ming-Da CHENG, Wei Sen CHANG
  • Publication number: 20240379713
    Abstract: The present disclosure relates to an image sensor having a photodiode surrounded by a back-side deep trench isolation (BDTI) structure, and an associated method of formation. In some embodiments, a plurality of pixel regions is disposed within an image sensing die and respectively comprises a photodiode configured to convert radiation into an electrical signal. The photodiode comprises a photodiode doping column with a first doping type surrounded by a photodiode doping layer with a second doping type that is different than the first doping type. A BDTI structure is disposed between adjacent pixel regions and extending from the back-side of the image sensor die to a position within the photodiode doping layer. The BDTI structure comprises a doped liner with the second doping type and a dielectric fill layer. The doped liner lines a sidewall surface of the dielectric fill layer.
    Type: Application
    Filed: July 24, 2024
    Publication date: November 14, 2024
    Inventors: Yu-Hung Cheng, Chun-Tsung Kuo, Jiech-Fun Lu, Min-Ying Tsai, Chiao-Chun Hsu, Ching I Li
  • Patent number: 12142582
    Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: November 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Wei-Han Chiang, Chun-Hung Chen, Ching-Ho Cheng, Hsiao Ching-Wen, Hong-Seng Shue, Ming-Da Cheng, Wei Sen Chang
  • Patent number: 12127488
    Abstract: A resistive random access memory structure includes a first inter-layer dielectric layer; a bottom electrode disposed in the first inter-layer dielectric layer; a capping layer disposed on the bottom electrode and on the first inter-layer dielectric layer; and a through hole disposed in the capping layer. The through hole partially exposes a top surface of the bottom electrode. A variable resistance layer is disposed within the through hole. A top electrode is disposed within the through hole and on the variable resistance layer. A second inter-layer dielectric layer covers the top electrode and the capping layer.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: October 22, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240342745
    Abstract: A method of preventing drippage in a liquid dispensing system includes generating at least a first proxy signal representing at least a first indirect measure of a position of a first automatic control valve (ACV), wherein the first ACV has positions ranging from fully closed to fully open. The method further includes recognizing, based on at least the first proxy signal, whether a failure state exists in which the first ACV has failed to close. The method further includes causing a second ACV to close when the failure state exists, wherein the second ACV is fluidically connected to the first ACV, and the second ACV has positions ranging from fully closed to fully open.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Inventors: Chien-Hung WANG, Chun-Chih LIN, Chi-Hung LIAO, Yung-Yao LEE, Wei Chang CHENG
  • Publication number: 20240334850
    Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming the resistive random access memory (RRAM) structure is also provided.
    Type: Application
    Filed: June 13, 2024
    Publication date: October 3, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240315615
    Abstract: A detection element of biological subcutaneous features and a wearable device thereof are provided. The element for detecting biological subcutaneous features has a substrate, a light-detecting semiconductor chip, a grid structure, and a cover. The light-detecting semiconductor chip is located on the substrate for detecting red light or near-infrared light signals. The grid structure including a plurality of opaque light-absorbing blocking walls is located on the light-detecting semiconductor chip for blocking side light and increasing the proportion of near-vertical incident light. The cover is located on the grid structure and serves as a protection lid. The wearable device for detecting biological subcutaneous features has more than one light source of red light or near-infrared light and a plurality of detection elements. The arrangement of the opaque light-absorbing blocking walls that are parallel to each other are substantially parallel to the light-emitting directions of the light source.
    Type: Application
    Filed: March 19, 2024
    Publication date: September 26, 2024
    Inventors: Kai-Hung CHENG, Ku-Cheng LIN, Chun-Min LIN, Ke-Wei LIU
  • Publication number: 20240308465
    Abstract: A retrofit system for the monitoring of seatbelt status in mass transit vehicles is adapted for retrofitting in different existing vehicles and includes a plurality of non-contact position sensors each associated with the buckle and tongue of a seatbelt, and a seat pan upholstery module with a seat occupancy sensor fixed to its inner side. The sensor of the non-contact position sensors is adapted to be fixed to an external surface of the buckle housing. A monitoring unit is coupled to the non-contact position sensors and occupancy sensors and to a display of seatbelt status comprising an indication that, when each of the seats is occupied, whether the respective seatbelt is in the fastened positioned or a released position.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 19, 2024
    Inventors: Chun Hung Cheng, Ho Lam, Shiu Kee Luk
  • Publication number: 20240314526
    Abstract: The invention provides a drainage network monitoring system. The system comprises a sensing module for detecting one or more conditions at a location in the drainage network; a processing module for processing data received from the sensing module; a wireless communications module for communicating the processed data substantially in real-time to one or more wireless devices including a wireless notification device configured to issue notification information to users, wherein the wireless communications module utilizes a narrow bandwidth, low power wireless communications protocol to communicate processed data to the wireless notification device, and wherein the sensing module has a standalone power supply.
    Type: Application
    Filed: March 15, 2023
    Publication date: September 19, 2024
    Inventors: Chun Hung CHENG, Ho LAM, Shiu Kee LUK, Kwong Tim CHAN, Hoi Shun TAM
  • Publication number: 20240312217
    Abstract: An object tracking system for use in traffic flow analytics and a traffic flow analytic method. The system comprises: an image processing module arranged to receiving a sequence of images capturing at least one object moving along a predetermined path in an area; an object detection module arranged to detect the at least one object including identifying a predetermined category of the detected object; and an object tracking module arranged to track the at least one object travelling from an entrance to an exit of the predetermined path based on coordinates of the object in the sequence of images being detected.
    Type: Application
    Filed: March 16, 2023
    Publication date: September 19, 2024
    Inventors: Chun Hung CHENG, Kwong Tim CHAN, Cheuk Wai KUNG
  • Patent number: 12048944
    Abstract: A method of preventing drippage in a fluid dispensing system. The fluid dispensing system includes a first automatic control valve (ACV), an input of the first ACV connected to fluid-source of fluid, the first ACV having positions ranging from fully closed to fully open, and a second ACV, an input of the second ACV being connected to an output of the first ACV, and an output of the second ACV being connected to a nozzle, the second ACV having positions ranging from fully closed to fully open. The method includes generating a first proxy signal representing at least a first indirect measure of a position of the first ACV. The method includes recognizing, based on at least the first proxy signal that a failure state exists in which the first ACV has failed to close. The method includes causing the second ACV to close when the failure state exists.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien-Hung Wang, Chun-Chih Lin, Chi-Hung Liao, Yung-Yao Lee, Wei Chang Cheng
  • Patent number: 12041863
    Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming said resistive random access memory (RRAM) structure is also provided.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: July 16, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Patent number: 12025770
    Abstract: A system (100) for monitoring stability of trees (10) in an area includes a server (101), one or more sensor modules (102, 202) being attached to each of the trees (10) in a network of trees, configured for obtaining tilt angle data pertaining to inclination of at least a portion of the tree (10), and relaying the tilt angle data to the server (101), a weather observing device (103, 203) connected to the server (101), for obtaining localized environmental variables representing a local weather condition in the area, and a monitoring platform (20) connected with the server (101), configured for storing and processing the data. The system is configured for monitoring, based on the data and the environmental variables, the tilt angle data of each of the trees (10), and identifying one or more abnormalities of one or more of the trees (10), and indicating through the monitoring platform (20) the one or more abnormalities.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: July 2, 2024
    Assignee: Logistics and Supply Chain MultiTech R&D Centre Limited
    Inventors: Kwong Yeung Simon Wong, Ho Lam, Wing Pong Ngai, Shiu Kee Luk, Chun Hung Cheng, Kwong Tim Chan
  • Patent number: 11997935
    Abstract: A resistive random-access memory (RRAM) device, including a bottom electrode, a high work function layer, a resistive material layer and a top electrode sequentially stacked on a substrate, wherein the resistive material layer includes a bottom part and a top part, first spacers covering sidewalls of the top part and the top electrode, and second spacers covering sidewalls of the bottom part, thereby constituting a RRAM cell.
    Type: Grant
    Filed: September 27, 2022
    Date of Patent: May 28, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Hung Yu, Chun-Hung Cheng, Chuan-Fu Wang
  • Patent number: 11950521
    Abstract: A resistive random-access memory (RRAM) device includes a bottom electrode, a high work function layer, a resistive material layer, a top electrode and high work function spacers. The bottom electrode, the high work function layer, the resistive material layer and the top electrode are sequentially stacked on a substrate, wherein the resistive material layer includes a bottom part and a top part. The high work function spacers cover sidewalls of the bottom part, thereby constituting a RRAM cell. The present invention also provides a method of forming a RRAM device.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: April 2, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Hung Yu, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240107901
    Abstract: Provided is a resistive random access memory (RRAM). The resistive random access memory includes a plurality of unit structures disposed on a substrate. Each of the unit structures includes a first electrode, and a first metal oxide layer. The first electrode is disposed on the substrate. The first metal oxide layer is disposed on the first electrode. In addition, the resistive random access memory includes a second electrode. The second electrode is disposed on the plurality of unit structures and connected to the plurality of unit structures.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Kai Jiun Chang, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240074338
    Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming the resistive random access memory (RRAM) structure is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Patent number: D1038113
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: August 6, 2024
    Assignee: Acer Incorporated
    Inventors: I-Lun Li, Kai-Teng Cheng, Szu-Wei Yang, Fang-Ying Huang, Chun-Hung Wen