Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: An organic interposer includes interconnect-level dielectric material layers embedding redistribution interconnect structures, at least one dielectric capping layer overlying a topmost interconnect-level dielectric material layer, a bonding-level dielectric layer overlying the at least one dielectric capping layer, and a dual-layer inductor structure, which may include a lower conductive coil embedded within the topmost interconnect-level dielectric material layer, a conductive via structure vertically extending through the at least one dielectric capping layer, and an upper conductive coil embedded within the bonding-level dielectric layer and comprising copper.

Abstract: Structures and methods for reducing process charging damages are disclosed. In one example, a silicon-on-insulator (SOI) structure is disclosed. The SOI structure includes: a substrate, a polysilicon region and an etch stop layer. The substrate includes: a handle layer, an insulation layer arranged over the handle layer, and a buried layer arranged over the insulation layer. The polysilicon region extends downward from an upper surface of the buried layer and terminates in the handle layer. The etch stop layer is located on the substrate. The etch stop layer is in contact with both the substrate and the polysilicon region.

Abstract: A method includes forming a first electrode, and depositing a dielectric layer over the first electrode. The dielectric layer has a first dielectric constant and a first thickness. A dielectric capping layer is deposited over the dielectric layer. The dielectric capping layer has a second dielectric constant higher than the first dielectric constant, and a second thickness smaller than the first thickness. The method further includes forming a second electrode over the dielectric capping layer, forming a first contact plug electrically connecting to the first electrode, and forming a second contact plug electrically connecting to the second electrode.

Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.

Abstract: Structures and methods for reducing process charging damages are disclosed. In one example, a silicon-on-insulator (SOI) structure is disclosed. The SOI structure includes: a substrate, a polysilicon region and an etch stop layer. The substrate includes: a handle layer, an insulation layer arranged over the handle layer, and a buried layer arranged over the insulation layer. The polysilicon region extends downward from an upper surface of the buried layer and terminates in the handle layer. The etch stop layer is located on the substrate. The etch stop layer is in contact with both the substrate and the polysilicon region.

Abstract: The present invention discloses an automatic signal deployer, a signal deployment system, an automatic signal path deployment method, and a behavior control signal generation method of a deployment agent. The signal deployment system includes an automatic signal deployer, a deployment agent and a base station. The deployment agent receives signal quality data, generates a behavior control signal according to the signal quality data, and sends out the behavior control signal to the automatic signal deployer. The automatic signal deployer receives the behavior control signal and a source signal coming from the base station, performs deployment according to the behavior control signal, whereby the automatic signal deployer can transmit the source signal toward a signal path allocation direction and complete automatic deployment of signal paths.

Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.

Abstract: To prevent arcing discharge of a liquid crystal device. Provided is a liquid crystal device including a liquid crystal layer, a first substrate, a second substrate and an insulating film, wherein the liquid crystal layer is arranged between the first substrate and the second substrate, the first substrate includes electrode 1, the second substrate includes electrode 2, the insulating film is arranged between electrode 1 and electrode 2, and the insulating film is a cured product of a thermosetting polymer composition.

Abstract: To prevent arcing discharge of a liquid crystal device. Provided is a liquid crystal device including a liquid crystal layer, a first substrate, a second substrate and an insulating film, wherein the liquid crystal layer is arranged between the first substrate and the second substrate, the first substrate includes electrode 1, the second substrate includes electrode 2, the insulating film is arranged between electrode 1 and electrode 2, and the insulating film is a cured product of a thermosetting polymer composition.

Abstract: A manufacturing apparatus for liquid crystal (LC) panels, including a temperature control device, an LC status monitor, a backlight source and an ultraviolet set. The temperature control device, on which an LC panel is placed, provides temperature control and is perforated to pass light therethrough. The LC status monitor is operative to observe the LC panel while the light is emitted from the backlight source and transmitted through the LC panel and the temperature control device as back-lights of the LC panel. The ultraviolet set is operative to expose the LC panel to ultraviolet light. The relative position between the temperature control device and the backlight source is adjustable, to switch the operating state of the apparatus. In the first operating state, the LC panel can be observed by the LC status monitor. In the second operating state, the LC panel can be exposed to ultraviolet light.

Abstract: A liquid crystal display panel including several first electrode portions, several second electrode portions, and a smectic liquid crystal layer is provided. The first electrode portions and the second electrode portions are disposed on a first substrate. When an AC voltage is applied on the first electrode portions and the second electrode portions, the direction of a horizontal electrical field formed between each first electrode portion and the adjacent second electrode portion is parallel to the surface of the first substrate. The smectic liquid crystal layer is interposed between the first substrate and a second substrate. During the phase change of a liquid crystal molecule of the smectic liquid crystal layer, the horizontal electrical field generated by applying the AC voltage on the first electrode portions and the second electrode portions facilitates the alignment of the liquid crystal molecule of the smectic liquid crystal layer.

Abstract: A manufacturing apparatus for liquid crystal (LC) panels, including a temperature control device, an LC status monitor, a backlight source and an ultraviolet set. The temperature control device, on which an LC panel is placed, provides temperature control and is perforated to pass light therethrough. The LC status monitor is operative to observe the LC panel while the light is emitted from the backlight source and transmitted through the LC panel and the temperature control device as back-lights of the LC panel. The ultraviolet set is operative to expose the LC panel to ultraviolet light. The relative position between the temperature control device and the backlight source is adjustable, to switch the operating state of the apparatus. In the first operating state, the LC panel can be observed by the LC status monitor. In the second operating state, the LC panel can be exposed to ultraviolet light.

Abstract: A method for manufacturing a transflective LCD panel having a transmissive region and a reflective region includes steps of providing an upper substrate and a lower substrate in parallel, forming a first alignment film on the upper substrate, forming a reflective layer on the reflective region of the lower substrate, forming an first insulating layer to cover the reflective layer and the lower substrate, forming a second insulating layer to cover the first insulating layer, forming positive and negative driving electrodes wrapped in the second insulating layer, forming a coplanar second alignment film to cover the second insulating layer, packaging the upper substrate and the lower substrate, and filling liquid crystal molecules.

Abstract: A method for manufacturing a transflective LCD panel having a transmissive region and a reflective region includes steps of providing an upper substrate and a lower substrate in parallel, forming a first alignment film on the upper substrate, forming a reflective layer on the reflective region of the lower substrate, forming an first insulating layer to cover the reflective layer and the lower substrate, forming a second insulating layer to cover the first insulating layer, forming positive and negative driving electrodes wrapped in the second insulating layer, forming a coplanar second alignment film to cover the second insulating layer, packaging the upper substrate and the lower substrate, and filling liquid crystal molecules.

Abstract: A liquid crystal display with transmissive region and reflective region is provided. The display comprises an upper substrate and a lower substrate, which is settled in parallel with the upper substrate. A reflective layer is located on the reflective region of the lower substrate and an insulation layer covers the reflective layer and the lower substrate. Positive and negative driving electrodes are chiastically settled on the insulation layer. A first alignment film is positioned on the inner surface of the upper substrate, and the alignments of the first alignment film on the transmissive region and reflective region are different. A second alignment film covers the insulation layer, the positive and negative electrodes. A liquid crystal layer is located between the first alignment film and the second alignment film.

Abstract: A liquid crystal display panel including several first electrode portions, several second electrode portions, and a smectic liquid crystal layer is provided. The first electrode portions and the second electrode portions are disposed on a first substrate. When an AC voltage is applied on the first electrode portions and the second electrode portions, the direction of a horizontal electrical field formed between each first electrode portion and the adjacent second electrode portion is parallel to the surface of the first substrate. The smectic liquid crystal layer is interposed between the first substrate and a second substrate. During the phase change of a liquid crystal molecule of the smectic liquid crystal layer, the horizontal electrical field generated by applying the AC voltage on the first electrode portions and the second electrode portions facilitates the alignment of the liquid crystal molecule of the smectic liquid crystal layer.

Abstract: A liquid crystal display panel including several first electrode portions, several second electrode portions, and a smectic liquid crystal layer is provided. The first electrode portions and the second electrode portions are disposed on a first substrate. When an AC voltage is applied on the first electrode portions and the second electrode portions, the direction of a horizontal electrical field formed between each first electrode portion and the adjacent second electrode portion is parallel to the surface of the first substrate. The smectic liquid crystal layer is interposed between the first substrate and a second substrate. During the phase change of a liquid crystal molecule of the smectic liquid crystal layer, the horizontal electrical field generated by applying the AC voltage on the first electrode portions and the second electrode portions facilitates the alignment of the liquid crystal molecule of the smectic liquid crystal layer.

Abstract: A transflective liquid crystal panel includes a first substrate, a second substrate, a first polarizer disposed on the first substrate, a second polarizer disposed on the second substrate having a transmission axis perpendicular to that of the first polarizer and a polymer dispersed liquid crystal layer sandwiched between the substrates. The polymer dispersed liquid crystal layer includes a plurality of liquid crystal molecules and at least one polymer network. When a voltage difference between the substrates is equal to 0V, the liquid crystal molecules do not reflect incident light beams and are not pervious to incident light beams. When the voltage difference between the substrates is not equal to 0V, the crystal molecules reflect incident light beams and are pervious to incident light beams.

Abstract: A transflective liquid crystal panel includes a first substrate, a second substrate, a first polarizer disposed on the first substrate, a second polarizer disposed on the second substrate having a transmission axis perpendicular to that of the first polarizer and a polymer dispersed liquid crystal layer sandwiched between the substrates. The polymer dispersed liquid crystal layer includes a plurality of liquid crystal molecules and at least one polymer network. When a voltage difference between the substrates is equal to 0V, the liquid crystal molecules do not reflect incident light beams and are not pervious to incident light beams. When the voltage difference between the substrates is not equal to 0V, the crystal molecules reflect incident light beams and are pervious to incident light beams.