Abstract: A lens driving apparatus includes a holder, a cover, a carrier, a first magnet, a coil, a spring, two second magnets and a hall sensor. The holder includes an opening hole. The cover is made of metal material and coupled to the holder. The carrier is movably disposed in the cover, and for coupling to a lens. The first magnet is connected to an inner side of the cover. The coil is wound around an outer side of the carrier, and adjacent to the first magnet. The spring is coupled to the carrier. The second magnets are disposed on one end of the carrier which is toward the holder. The hall sensor is for detecting a magnetic field of any one of the second magnets, wherein the magnetic field is varied according to a relative displacement between the hall sensor and the second magnet which is detected.

Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.

Abstract: A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.

Abstract: Electrostatic discharge (ESD) structures are provided. An ESD structure includes a semiconductor substrate, a first epitaxy region with a first type of conductivity over the semiconductor substrate, a second epitaxy region with a second type of conductivity over the semiconductor substrate, and a plurality of semiconductor layers. The semiconductor layers are stacked over the semiconductor substrate and between the first and second epitaxy regions. A first conductive feature is formed over the first epitaxy region and outside an oxide diffusion region. A second conductive feature is formed over the second epitaxy region and outside the oxide diffusion region. A third conductive feature is formed over the first epitaxy region and within the oxide diffusion region. A fourth conductive feature is formed over the second epitaxy region and within the oxide diffusion region. The oxide diffusion region is disposed between the first and second conductive features.

Abstract: A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier thereby enhancing the mechanical strength of the assembly carrier.

Abstract: The present invention relates to a semi-finished package and a method for making a package. The semi-finished package includes a carrier and at least one molding compound. The molding compound is disposed on a surface of the carrier, and has a body and a plurality of outer protrusions. The outer protrusions are disposed at the periphery of the body, and the height of the outer protrusions is greater than that of the body. Thus, by utilizing the outer protrusions, the rigidity of the semi-finished package is increased, so as to overcome the warpage of the semi-finished package caused by different coefficients of thermal expansion of the molding compound and the carrier. Therefore, the yield rate of the package unit is increased.

Abstract: The present invention relates to a semi-finished package and a method for making a package. The semi-finished package includes a carrier and at least one molding compound. The molding compound is disposed on a surface of the carrier, and has a body and a plurality of outer protrusions. The outer protrusions are disposed at the periphery of the body, and the height of the outer protrusions is greater than that of the body. Thus, by utilizing the outer protrusions, the rigidity of the semi-finished package is increased, so as to overcome the warpage of the semi-finished package caused by different coefficients of thermal expansion of the molding compound and the carrier. Therefore, the yield rate of the package unit is increased.

Abstract: A reinforced assembly carrier is provided. A supporting frame made of molding compound is formed on the edge area of the upper surface and/or on the edge area of the lower surface of the assembly carrier thereby enhancing the mechanical strength of the assembly carrier.