Abstract: A method of forming a semiconductor device structure is provided. The method includes forming semiconductor fins at a first conductivity type region and a second conductivity type region of a substrate, forming a sacrificial gate structure across a portion of the semiconductor fins, wherein the sacrificial gate structure comprises a sacrificial gate dielectric layer and a sacrificial gate electrode layer over the sacrificial gate dielectric layer, and the sacrificial gate dielectric layer on the semiconductor fins of the first conductivity type region is asymmetrical in thickness between a top and a sidewall of the semiconductor fins. The method also includes forming a gate spacer on opposite sidewalls of the sacrificial gate structure, recessing the semiconductor fins not covered by the sacrificial gate structure and the gate spacer, forming source/drain feature on the recessed semiconductor fins, and removing the sacrificial gate structure to expose the top of the semiconductor fins.

Abstract: A communication apparatus and a bracket device thereof are provided. The bracket device includes a base, a rotary shaft, a connecting member, and an elastic member. The base includes a bottom portion, a connecting portion, and a base engaging portion. The rotary shaft is rotatably disposed in the connecting portion and includes a base wall and a connecting section. The connecting member connects to the rotary shaft. The elastic member includes a body and an elastic member engaging portion. The body connects to the base wall of the rotary shaft, and the elastic member engaging portion is positioned at the body. In an engagement state, the elastic member engaging portion is engaged to the base engaging portion.

Abstract: The present application provides an aperture assembly. The aperture assembly is used in an optical lens system. The aperture assembly includes a plate including a hollow portion and a non-hollow portion. The hollow portion is configured to define an aperture of the optical lens system, wherein the contour of the hollow portion has a non-circular shape. The aperture assembly can prevent the size of the aperture from being reduced as the size of the plate is reduced in a case that a circular aperture is applied to the plate. The present application also realizes an aperture adjustment for a non-circular aperture.

Abstract: A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group consisting of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group blocked by a blocking agent. The polymer has a functional group reacting with the polyfunctional crosslinker.

Abstract: A lens module includes a plurality of lenses, an annular body and a reflective element. The reflective element, the lenses and the annular are sequentially arranged along an optical axis from an object side to an image side. The lenses include a first lens that is disposed closest to the object side, and a second lens that is disposed closest to the image side. The reflective element is disposed between the object side and the first lens. The annular body is disposed between the object side and the first lens, between the lenses, or between the second lens and the image side. The lens module satisfies 0.5 mm<EPA/PL<5.5 mm where EPA is an area of an entrance pupil of the lens module, and PL is a length of the reflective element.

Abstract: A lens device includes a lens group unit, a guiding unit, a transmission unit and a driving unit. The guiding unit is connected to the lens group unit for guiding the lens group unit to move in a first direction or in a second direction. The transmission unit includes a fixing element. The driving unit is connected to the transmission unit so as to output power for driving the lens group unit through the transmission unit to move in the first direction X or in the second direction. The fixing element includes a body portion and a bent portion, and the bent portion extends from the body portion to form a space between the fixing element and the lens group unit.

Abstract: An anti-theft plastic bottle cap contains a body and an anti-theft ring. The body is connected on an opening of a bottle. The anti-theft ring is mounted on a bottom of the body, and multiple equidistant connection teeth are formed between the body and the anti-theft ring. The body includes a first protrusion extending to the anti-theft ring from a bottom of the body, and the anti-theft ring includes two second protrusions extending to the body. The first protrusion is engaged with the two second protrusions when the body is rotated clockwise, such that the anti-theft plastic bottle cap is not rotated overly by using the first protrusion and the two second protrusions to avoid a removal of the anti-theft ring from the body and the anti-theft ring before a user detaches the anti-theft plastic bottle cap from the bottle.

Abstract: An orientation-adjustment mechanism is provided, which is adapted to be affixed to a mounting surface. The orientation-adjustment mechanism includes a base, a rod, a joint unit, and a mounted member. The base is adapted to be affixed to the mounting surface. The rod includes a first section and a second section. The first section of the rod pivots on the base. The joint unit is disposed on the second section of the rod. The joint unit includes a plurality of joint-positioning portions. The joint-positioning portions include a first joint-positioning portion and a second joint-positioning portion. The mounted member is connected to the joint unit and is adapted to be rotated relative to the joint unit. The mounted member includes a member housing. The member housing includes at least one member-positioning portion.

Abstract: A method of forming a semiconductor device structure is provided. The method includes forming semiconductor fins at a first conductivity type region and a second conductivity type region of a substrate, forming a sacrificial gate structure across a portion of the semiconductor fins, wherein the sacrificial gate structure comprises a sacrificial gate dielectric layer and a sacrificial gate electrode layer over the sacrificial gate dielectric layer, and the sacrificial gate dielectric layer on the semiconductor fins of the first conductivity type region is asymmetrical in thickness between a top and a sidewall of the semiconductor fins. The method also includes forming a gate spacer on opposite sidewalls of the sacrificial gate structure, recessing the semiconductor fins not covered by the sacrificial gate structure and the gate spacer, forming source/drain feature on the recessed semiconductor fins, and removing the sacrificial gate structure to expose the top of the semiconductor fins.

Abstract: An orientation-adjustment mechanism is provided, which is adapted to be affixed to a mounting surface. The orientation-adjustment mechanism includes a base, a rod, a joint unit, and a mounted member. The base is adapted to be affixed to the mounting surface. The rod includes a first section and a second section. The first section of the rod pivots on the base. The joint unit is disposed on the second section of the rod. The joint unit includes a plurality of joint-positioning portions. The joint-positioning portions include a first joint-positioning portion and a second joint-positioning portion. The mounted member is connected to the joint unit and is adapted to be rotated relative to the joint unit. The mounted member includes a member housing. The member housing includes at least one member-positioning portion.

Abstract: Embodiments provide a greening module, a greening device, a greening body and a method for installing the greening module. In the embodiments, the greening device includes at least one greening module including plants, a plant culture layer, an adhering part, and a waterproof layer, wherein: one side of the plant culture layer is configured for cultivating the plants, and at least part of a surface of an other side is provided with the adhering part; the waterproof layer is provided between the plant culture layer and the adhering part.

Abstract: A communication apparatus and a bracket device thereof are provided. The bracket device includes a base, a rotary shaft, a connecting member, and an elastic member. The base includes a bottom portion, a connecting portion, and a base engaging portion. The rotary shaft is rotatably disposed in the connecting portion and includes a base wall and a connecting section. The connecting member connects to the rotary shaft. The elastic member includes a body and an elastic member engaging portion. The body connects to the base wall of the rotary shaft, and the elastic member engaging portion is positioned at the body. In an engagement state, the elastic member engaging portion is engaged to the base engaging portion.

Abstract: A lens module includes a plurality of lenses, an annular body and a reflective element. The reflective element, the lenses and the annular are sequentially arranged along an optical axis from an object side to an image side. The lenses include a first lens that is disposed closest to the object side, and a second lens that is disposed closest to the image side. The reflective element is disposed between the object side and the first lens. The annular body is disposed between the object side and the first lens, between the lenses, or between the second lens and the image side. The lens module satisfies 0.5 mm<EPA/PL<5.5 mm where EPA is an area of an entrance pupil of the lens module, and PL is a length of the reflective element.

Abstract: The present application provides an aperture assembly. The aperture assembly is used in an optical lens system. The aperture assembly includes a plate including a hollow portion and a non-hollow portion. The hollow portion is configured to define an aperture of the optical lens system, wherein the contour of the hollow portion has a non-circular shape. The aperture assembly can prevent the size of the aperture from being reduced as the size of the plate is reduced in a case that a circular aperture is applied to the plate. The present application also realizes an aperture adjustment for a non-circular aperture.

Abstract: The present invention provides a driving method applied to the CH-LCD active matrix, which uses a plurality of gates or drains to control a single CH-LCD pixel unit, respectively controls the CH-LCD pixel unit in the resetting stage and the determining stage to increase a charging time for the CH-LCD pixel unit. Besides, the method further divides the plurality of scan lines and data lines into a plurality of groups to control each group of CH-LCD pixel units at the same time. Therefore, the charging time for the CH-LCD pixel unit may be increased for a fixed frame rate and a fixed resolution.

Abstract: A temporary bonding composition is provided. The temporary bonding composition includes a polyfunctional crosslinker, a polymer and a solvent. The polyfunctional crosslinker includes a compound containing at least two functional groups selected from the group of blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. Each of the blocked isocyanate groups is an isocyanate group protected by a blocking agent. The polymer has a functional group reacting to the polyfunctional crosslinker.

Abstract: A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.

Abstract: An optical lens makes object light rays transmit from an object side to an image side on an optical axis and form an image on an image plane. The optical lens comprises a lens group establishing the optical axis, comprising a first lens and a second lens arranged in order from the image side to the object side, wherein the first lens has an image-side surface which is a concave face and has a point of inflection arranged thereon; and a first aperture stop and a second aperture stop separately located on the optical axis. The optical lens meets the thinning tendency.

Abstract: A camera device is packaged inside an external shell of an electronic apparatus. The external shell has an opening. The camera device has a transparent plate, a part of which is adjacent to the opening of the external shell. The transparent plate forms an accommodating space for accommodating other components of the camera device. Thus, the dust can be prevented from falling into a shutter blade room of the camera device. The camera device also includes a shutter blade, a driver, and a plate. The plate has an aperture, and the aperture of the camera device is defined thereby. The aperture of the plate is completely pervious to light when the shutter blade is at a first position, and the aperture of the plate is partially pervious to light when the shutter blade is at a second position, thereby changing the aperture of the camera device.

Abstract: The present invention provides a LCD device, comprising: a backlight module, comprising a light emitting surface and an opposite back surface; a liquid crystal panel, on the light emitting surface, wherein a signal binding end is disposed on a front surface, away from the backlight module, of the liquid crystal panel; and a COF, comprising a flexible circuit board, and a binding part and a driver chip on a first surface of the flexible circuit board, wherein the flexible circuit board is connected to the signal binding end through the binding part and is bent extendedly to the back surface of the backlight module; and in the region of the flexible circuit board at the back surface of the backlight module, the first surface of the flexible circuit board comprises a first area facing away from the backlight module, and the driver chip is connected to the first area.