Abstract: A bokeh filter membrane, which is disposed on a surface of a substrate, includes a gradient thickness absorbing membrane and an anti-reflection membrane. The anti-reflection membrane includes a high-and-low refraction membrane and a gradient refraction membrane. A transmittance of the substrate at a center thereof is greater than a transmittance of the substrate at a peripheral region thereof. The high-and-low refraction membrane includes a first high-and-low refraction membrane and a second high-and-low refraction membrane, the gradient thickness absorbing membrane is farther away from the substrate than the first high-and-low refraction membrane, the second high-and-low refraction membrane is farther away from the substrate than the gradient thickness absorbing membrane, and the gradient refraction membrane is farther away from the substrate than the second high-and-low refraction membrane. The gradient refraction membrane includes a plurality of pores.

Abstract: A catadioptric optical membrane, which is disposed on a surface of a substrate, includes a reflection membrane and a matting membrane. The reflection membrane is disposed on an effective optical path area of the substrate and includes a reflection metal membrane and a reflection oxidation membrane. The reflection oxidation membrane includes a first reflection oxidation membrane and a second reflection oxidation membrane. The reflection metal membrane is farther away from the substrate than the first reflection oxidation membrane. The second reflection oxidation membrane is farther away from the substrate than the reflection metal membrane. The matting membrane is disposed on a non-effective optical path area of the substrate. The matting membrane includes a deep-color membrane and a first anti-reflection membrane. The deep-color membrane includes a deep-color metal membrane and a deep-color oxidation membrane. The deep-color membrane is farther away from the substrate than the first anti-reflection membrane.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.

Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.

Abstract: A bonding apparatus for attaching an adhering pad to a base component includes a feeding and holding frame for feeding and holding the base component in a conveying route, a suspending carrier mounted above the conveying route, and a bonding device disposed on and movable with the suspending carrier. The bonding device has a feeding reel on which the tape assembly is disposed and from which the tape assembly is pulled and fed along a feeding route, and an attaching head which is disposed at said feeding route to divide the pulled section into an input side and an output side. When the attaching head is moved toward the input side, the adhering pad is removed from the carrier tape while attached to the base component.

Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.

Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.

Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.

Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.

Abstract: A plurality of BIOS default configurations may be is stored in a BIOS of the computer system. A particular BIOS default configuration may be selected from the plurality of BIOS default configurations based at least in part on a server identification (ID) of the computer system or a user command. The computer system is initialized with the particular BIOS default configuration.