Abstract: A bonding method for using a bonding apparatus includes: transporting and reeling a carrier tape which is packaged with an adhering component, on a pressing assembly, and bending the carrier tape through a bending member to be divided into an input section and an output section; driving a roller to indirectly press and abut a front end of the adhering component to bring the adhering component into contact with a bonding start point a base component; and rolling the roller over the carrier tape to attach the adhering component to the bonding area while moving the bending member to indirectly scrape the adhering component from the carrier tape so as to firmly attach the adhering component to the base component without generation of air bubbles.

Abstract: A bonding device includes a first carrying module for a tape assembly to be disposed thereon and reeling a carrier tape and a cover tape, a driving module disposed to drive an up-down movement and a rotation of the first carrying module, a second carrying module movably disposed on the first carrying module, and a bonding module disposed on the second carrying module. The bonding module includes a bending member on and through which a carrier tape is reeled and bent to be divided into an input section and an output section. The bending member is moved together with a roller, during rolling of the roller, to indirectly scrape an adhering component from the carrier tape so as to facilitate attachment of the adhering component to the base component.

Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.

Abstract: A bonding apparatus for attaching an adhering pad to a base component includes a feeding and holding frame for feeding and holding the base component in a conveying route, a suspending carrier mounted above the conveying route, and a bonding device disposed on and movable with the suspending carrier. The bonding device has a feeding reel on which the tape assembly is disposed and from which the tape assembly is pulled and fed along a feeding route, and an attaching head which is disposed at said feeding route to divide the pulled section into an input side and an output side. When the attaching head is moved toward the input side, the adhering pad is removed from the carrier tape while attached to the base component.

Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.

Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.

Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.

Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.

Abstract: A plurality of BIOS default configurations may be is stored in a BIOS of the computer system. A particular BIOS default configuration may be selected from the plurality of BIOS default configurations based at least in part on a server identification (ID) of the computer system or a user command. The computer system is initialized with the particular BIOS default configuration.