Abstract: A layout pattern of a magnetoresistive random access memory (MRAM) includes a substrate having a first cell region, a second cell region, a third cell region, and a fourth cell region and a diffusion region on the substrate extending through the first cell region, the second cell region, the third cell region, and the fourth cell region. Preferably, the diffusion region includes a H-shape according to a top view.

Abstract: Provided is a buckle locking device for the tonneau cover of pick-up trucks (II), which mainly comprises a load-bearing cross bar, a slider, a handle, a buckle block, a slide fixing block, a T-bar and an extruded aluminum frame, characterized in that: when the load-bearing cross bar and the slider is pressed by the handle of the buckle locking mechanism for buckling, it can generate a downward pulling force, which can be transmitted by the load-bearing cross bar to force the whole tonneau cover frame to generate a downward pressure, so that it can cover the truck bed tightly. Moreover, through the design of the slider mechanism, the T-bar can offer better stability and better positioning. When the buckle locking mechanism is not used, it can also be hidden inside the groove of the slider.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.

Abstract: A cable assembly and a cable connection component are provided. The cable assembly includes a cable and a cable connection component. The cable connection component includes a first outer metal member, a second outer metal member and a holding component. The second outer metal member has an end for interlocking with an end of the first outer metal member. The holding component is disposed between the first outer metal member and the second outer metal member. The holding component includes two inner metal members that are fixed to each other by a fixing member. Each inner metal member includes a wire slot, the wire slot includes an end section and two branch sections, the two end sections jointly hold a portion of the cable in place, and each branch section of the two inner metal members jointly hold one of core wires of the cable in place.

Abstract: An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.

Abstract: The present disclosure provides a semiconductor device package and a method of manufacturing the same. The semiconductor device package includes a substrate, an interconnection structure, a package body, and a first electronic component. The interconnection structure is disposed on the substrate. The package body is disposed on the substrate and partially covers the interconnection structure. The package body has a position limiting structure around the interconnection structure. The first electronic component is disposed on the interconnection structure and electrically connected to the interconnection structure.