Patents by Inventor Chun-Hway Hsueh

Chun-Hway Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10408752
    Abstract: A plasmonic sensor includes at least a substrate and a thin film metallic glass formed on the substrate. The dielectric constant (?r) of the thin film metallic glass is negative. Since the thin film metallic glass with negative ?r is used in the plasmonic sensor, the material cost can be significantly reduced, the mechanical property can be improved, and the optoelectronic property can be increased. Since the thin film metallic glass is a kind of supercooled alloy with amorphous structure, it can be applied for imprinting deformation and amorphous without grain boundary scattering.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: September 10, 2019
    Assignee: National Taiwan University
    Inventors: Cheng Wang, Li-Wei Nien, Chun-Hway Hsueh, Hsin-Chia Ho, Yi-Chen Lai
  • Publication number: 20180106721
    Abstract: A plasmonic sensor includes at least a substrate and a thin film metallic glass formed on the substrate. The dielectric constant (?r) of the thin film metallic glass is negative. Since the thin film metallic glass with negative ?r is used in the plasmonic sensor, the material cost can be significantly reduced, the mechanical property can be improved, and the optoelectronic property can be increased. Since the thin film metallic glass is a kind of supercooled alloy with amorphous structure, it can be applied for imprinting deformation and amorphous without grain boundary scattering.
    Type: Application
    Filed: September 27, 2017
    Publication date: April 19, 2018
    Applicant: National Taiwan University
    Inventors: Cheng Wang, Li-Wei Nien, Chun-Hway Hsueh, Hsin-Chia Ho, Yi-Chen Lai
  • Patent number: 8225675
    Abstract: A test fixture for simultaneously testing two material test samples is provided. The fixture provides substantially equal shear and tensile stresses in each test specimens. By gradually applying a load force to the fixture only one of the two specimens fractures. Upon fracture of the one specimen, the fixture and the load train lose contact and the second specimen is preserved in a state of upset just prior to fracture. Particular advantages of the fixture are (1) to control the tensile to shear load on the specimen for understanding the effect of these stresses on the deformation behavior of advanced materials, (2) to control the location of fracture for accessing localized material properties including the variation of the mechanical properties and residual stresses across the thickness of advanced materials, (3) to yield a fractured specimen for strength measurement and an unfractured specimen for examining the microstructure just prior to fracture.
    Type: Grant
    Filed: September 8, 2009
    Date of Patent: July 24, 2012
    Assignee: UT-Battelle, LLC
    Inventors: Chun-Hway Hsueh, Chain-tsuan Liu, Easo P. George
  • Publication number: 20110056304
    Abstract: A test fixture for simultaneously testing two material test samples is provided. The fixture provides substantially equal shear and tensile stresses in each test specimens. By gradually applying a load force to the fixture only one of the two specimens fractures. Upon fracture of the one specimen, the fixture and the load train lose contact and the second specimen is preserved in a state of upset just prior to fracture. Particular advantages of the fixture are (1) to control the tensile to shear load on the specimen for understanding the effect of these stresses on the deformation behavior of advanced materials, (2) to control the location of fracture for accessing localized material properties including the variation of the mechanical properties and residual stresses across the thickness of advanced materials, (3) to yield a fractured specimen for strength measurement and an unfractured specimen for examining the microstructure just prior to fracture.
    Type: Application
    Filed: September 8, 2009
    Publication date: March 10, 2011
    Inventors: Chun-hway Hsueh, Chain-tsuan Liu, Easo P. George