Abstract: An acoustic wave element includes: a substrate; a bonding structure on the substrate; a support layer on the bonding structure; a first electrode including a lower surface on the support layer; a cavity positioned between the support layer and the first electrode and exposing a lower surface of the first electrode; a piezoelectric layer on the first electrode; and a second electrode on the piezoelectric layer, wherein at least one of the first electrode and the second electrode includes a first layer and a second layer that the first layer has a first acoustic impedance and a first electrical impedance, the second layer has a second acoustic impedance and a second electrical impedance, wherein the first acoustic impedance is higher than the second acoustic impedance, and the second electrical impedance is lower than the first electrical impedance.

Abstract: A light module and a manufacturing method are provided. The light module comprises a first and a second substrate separated from a prefabricated substrate along a closed curve, the first substrate is detachable connected and/or fixed with the second substrate; light emitting elements mounted on one of the first and second substrate; and a drive element mounted on the other one of the first and second substrate. The method comprises: determining a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region and a second region; providing light emitting elements and first electronic element on first surface of the prefabricated substrate; providing second electronic element on second surface of the prefabricated substrate; separating a first and second substrate from the prefabricated substrate along the closed curve; and assembling and connecting the second substrate with the first substrate at a separation opening.

Abstract: A light module and a manufacturing method are provided. The light module comprises a first and a second substrate separated from a prefabricated substrate along a closed curve, the first substrate is detachable connected and/or fixed with the second substrate; light emitting elements mounted on one of the first and second substrate; and a drive element mounted on the other one of the first and second substrate. The method comprises: determining a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region and a second region; providing light emitting elements and first electronic element on first surface of the prefabricated substrate; providing second electronic element on second surface of the prefabricated substrate; separating a first and second substrate from the prefabricated substrate along the closed curve; and assembling and connecting the second substrate with the first substrate at a separation opening.

Abstract: A light module and a manufacturing method are provided. The light module comprises a first and a second substrate separated from a prefabricated substrate along a closed curve, the first substrate is detachable connected and/or fixed with the second substrate; light emitting elements mounted on one of the first and second substrate; and a drive element mounted on the other one of the first and second substrate. The method comprises: determining a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region and a second region; providing light emitting elements and first electronic element on first surface of the prefabricated substrate; providing second electronic element on second surface of the prefabricated substrate; separating a first and second substrate from the prefabricated substrate along the closed curve; and assembling and connecting the second substrate with the first substrate at a separation opening.

Abstract: A light module and a manufacturing method are provided. The light module comprises a first and a second substrate separated from a prefabricated substrate along a closed curve, the first substrate is detachable connected and/or fixed with the second substrate; light emitting elements mounted on one of the first and second substrate; and a drive element mounted on the other one of the first and second substrate. The method comprises: determining a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region and a second region; providing light emitting elements and first electronic element on first surface of the prefabricated substrate; providing second electronic element on second surface of the prefabricated substrate; separating a first and second substrate from the prefabricated substrate along the closed curve; and assembling and connecting the second substrate with the first substrate at a separation opening.

Abstract: Examples disclose a method, executable by a processor, to assign a metric of vulnerability to a virtual machine. Based on the metric of vulnerability, the method places the virtual machine into a detection phase. Additionally, the examples disclose the method is to receive an alert corresponding to the virtual machine and based this received alert, the method implements a countermeasure.

Abstract: A circuit board assembly includes a printed circuit board, at least one wire, at least one wire fixing device, and a plurality of electronic components. A wire fixing method includes following steps. Firstly, the wire fixing device is inserted into a conductive hole of the printed circuit board. Then, the wire fixing device is fixed on the printed circuit board via a soldering material. Then, a conducting terminal of the wire is introduced into an accommodation space of the wire fixing device through the first opening of the wire fixing device. Then, at least one concave structure is formed in an external surface of a first conducting part of the wire fixing device by a jig. Consequently, the conducting terminal of the wire is fixed on the wire fixing device, and the wire is electrically connected with the printed circuit board through the wire fixing device.

Abstract: Examples disclose a method, executable by a processor, to assign a metric of vulnerability to a virtual machine. Based on the metric of vulnerability, the method places the virtual machine into a detection phase. Additionally, the examples disclose the method is to receive an alert corresponding to the virtual machine and based this received alert, the method implements a countermeasure.