Patents by Inventor Chun-Jen FANG

Chun-Jen FANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955312
    Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: April 9, 2024
    Assignee: MATERIALS ANALYSIS TECHNOLOGY INC.
    Inventors: Chien-Wei Wu, Keng-Chieh Chu, Yung-Sheng Fang, Chun-Wei Wu, Hung-Jen Chen
  • Patent number: 9531387
    Abstract: A handheld device and a frequency tracking method thereof are provided. The handheld device comprises an oscillator, a radio frequency (RF) chip, a modem module, a first thermal sensor and a thermal module. The oscillator generates an oscillation signal with an oscillation frequency. The RF chip is electrically connected to the oscillator and configured to receive a paging signal from a paging channel and an RF signal from a non-regular channel based on the oscillation signal. The modem module is electrically connected to the RF chip. The first thermal sensor disposed close to the oscillator measures a heat source temperature. The thermal module electrically connected to the modem module and the first thermal sensor enables the modem module to execute a frequency compensation process by using the RF signal of both the paging signal and the RF signal according to the heat source temperature.
    Type: Grant
    Filed: December 31, 2014
    Date of Patent: December 27, 2016
    Assignee: MEDIATEK INC.
    Inventors: Chun-Jen Fang, Ching-Sheng Wu, Meng-Lin Wu, Chih-Ming Wang, Chiao-Chih Chang
  • Publication number: 20150282156
    Abstract: A handheld device and a frequency tracking method thereof are provided. The handheld device comprises an oscillator, a radio frequency (RF) chip, a modem module, a first thermal sensor and a thermal module. The oscillator generates an oscillation signal with an oscillation frequency. The RF chip is electrically connected to the oscillator and configured to receive a paging signal from a paging channel and an RF signal from a non-regular channel based on the oscillation signal. The modem module is electrically connected to the RF chip. The first thermal sensor disposed close to the oscillator measures a heat source temperature. The thermal module electrically connected to the modem module and the first thermal sensor enables the modem module to execute a frequency compensation process by using the RF signal of both the paging signal and the RF signal according to the heat source temperature.
    Type: Application
    Filed: December 31, 2014
    Publication date: October 1, 2015
    Inventors: Chun-Jen FANG, Ching-Sheng WU, Meng-Lin WU, Chih-Ming WANG, Chiao-Chih CHANG
  • Patent number: D1026916
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: May 14, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hao-Jen Fang, Kung-Ju Chen, Wei-Yi Chang, Chun-Chieh Chen, Chih-Wen Chiang, Sheng-Hung Lee