Patents by Inventor Chun-Jen Hsieh

Chun-Jen Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8091504
    Abstract: A method of cleaning a spin coater apparatus is provided. In one embodiment, the method comprises providing a spin coater apparatus having a coater cup comprising a basin with sidewalls, a rotatable platform situated inside the cup adapted for holding and rotating a wafer to be coated, and a solvent dispensing means mounted under the rotatable platform; placing the substrate on the rotatable platform; rotating the rotatable platform; continuously dispensing a cleaning solvent from the solvent dispensing means to rinse the backside of the wafer with the cleaning solvent and to pre-wet an interior surface of the sidewalls; and dispensing a coating material upon the wafer, the substrate mounted on the rotatable platform.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: January 10, 2012
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Jen Hsieh, Chi-Kang Peng, Wen-Hao Yang, Hung-Tai Tsao
  • Publication number: 20080066786
    Abstract: A method of cleaning a spin coater apparatus is provided. In one embodiment, the method comprises providing a spin coater apparatus having a coater cup comprising a basin with sidewalls, a rotatable platform situated inside the cup adapted for holding and rotating a wafer to be coated, and a solvent dispensing means mounted under the rotatable platform; placing the substrate on the rotatable platform; rotating the rotatable platform; continuously dispensing a cleaning solvent from the solvent dispensing means to rinse the backside of the wafer with the cleaning solvent and to pre-wet an interior surface of the sidewalls; and dispensing a coating material upon the wafer, the substrate mounted on the rotatable platform.
    Type: Application
    Filed: September 19, 2006
    Publication date: March 20, 2008
    Inventors: Chun-Jen Hsieh, Chi-Kang Peng, Wen-Hao Yang, Hung-Tai Tsao