Patents by Inventor Chun-Jui Hsu

Chun-Jui Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972972
    Abstract: A method for forming an isolation structure includes: forming a trench at a surface of a substrate; forming a mask pattern on the substrate, wherein the mask pattern has an opening communicated with the trench; filling a first isolation material layer in the opening and the trench, wherein a surface of the first isolation material layer defines a first recess; filling a second isolation material layer into the first recess; partially removing the first and second isolation material layers, to form a second recess, performing first and second oblique ion implantation processes, to form damage regions in the first isolation material layer; performing a decoupled plasma treatment, to transform portions of the damage regions into a protection layer having etching selectivity with respect to the damage regions; and removing the damage regions.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: April 30, 2024
    Assignee: Winbond Electronics Corp.
    Inventors: Che-Jui Hsu, Ying-Fu Tung, Chun-Sheng Lu, Mu-Lin Li
  • Publication number: 20220332943
    Abstract: A thermoplastic vuicanizate material comprises: a continuous phase comprising polyester, wherein a melting point of the polyester is less than or equal to 180° C., a dispersant phase comprising cross-linked rubber, wherein an average particle diameter of the cross-linked rubber is less than or equal to 100 ?m.
    Type: Application
    Filed: April 14, 2022
    Publication date: October 20, 2022
    Inventors: WAN-TING TSAI, Chun-Jui Hsu, Ren-Hao Liu, Yu-Cheng Hsiao, Han-Liou Yi