Abstract: A method for producing a porous structure electrode with gas permeability and liquid impermeability, includes the following steps: Step 1: mixing a catalytic material having hydrophilicity, a carbon nanotube material, a material with a hydrophilic group, and a carbon black material to form a first slurry, wherein the carbon nanotube material has a specific surface area equal to or greater than the carbon black material; Step 2: mixing the first slurry with an emulsified material to form a second slurry; Step 3: obtaining a film material through a film forming process; Step 4: heating the film material to a first temperature to remove solvent in the film material; Step 5: Repeating steps 3 to 4; and Step 6: heating the film material to a second temperature to remove liquid in the film material, thereby leaving pores in the film material, and allowing the film material to solidify.

Abstract: An exposure device and method for semiconductor manufacturing, focusing on the creation of exposure patterns with High Dynamic Range (HDR) capabilities, is disclosed. The exposure device includes a laser source, a first spatial light modulator (SLM), specifically a Liquid Crystal on Silicon (LCOS) device, and a second SLM, specifically a Digital Micromirror Device (DMD). The LCOS is positioned upstream in the optical path and is optimized for modulating the phase of the laser. It also directs the laser light towards specific areas on the DMD, crucial for enhancing detail and contrast in exposure patterns. The DMD, placed downstream, is composed of micromirrors that modulate the amplitude of the reflected laser, essential for achieving HDR in exposure patterns. This cooperative interaction between the LCOS and DMD allows for the creation of exposure patterns with a wide range of light intensities, from very bright to very dark, thereby achieving high dynamic range.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: A method and system for effectively removing particles from semiconductor surfaces using a multi-beam laser-based approach. The invention employs a plurality of laser beams generated by a spatial light modulator, which create multiple light spots on a particle at various locations across its surface. By adjusting the phase of these laser beams, alternating clockwise and counterclockwise torsional forces are induced, generating rotational movement that weakens the adhesion between the particles and the semiconductor surface. The system utilizes a liquid crystal spatial light modulator to precisely control beam parameters, enhancing the ability to reduce adhesion forces due to van der Waals interactions or electrostatic forces. An automated optical inspection system provides real-time monitoring and feedback, ensuring precise manipulation and complete removal of particles.

Abstract: In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Abstract: The present application discloses an anti-electromagnetic interference wafer structure in the wafer processing stage; the anti-electromagnetic interference wafer structure comprises a digital processing unit area with a digital processing unit, an insulating layer, a conducting layer and a plurality of information connectivity points wherein the digital processing unit has a top surface on which the insulating layer and the information connectivity points are designed, the insulating layer has a top surface on which the conducting layer is coated, and the conducting layer is capable of absorbing electromagnetic interferences passed on to the conducting layer.

Abstract: An adjustable pillow has: a lower member, an upper member, and a lifting mechanism; the lower member having a neck supporting section at one end and an assembly space adjacent to the neck supporting section, the upper member having an assembly protrusion and a head supporting section extending from the assembly protrusion; wherein the assembly protrusion is capable of being correspondingly disposed in the assembly space such that the head supporting section is lower than the neck supporting section, and the assembly protrusion further comprises an accepting space at a bottom side for accepting the lifting mechanism for mounting between the lower member and the upper member.

Abstract: A method for cleaning semiconductor process equipment and a system thereof are provided. The method is adapted to apply to an object with at least one pollutant thereon and includes steps of providing multi-channel optical tweezers to irradiate the pollutant and locations where the pollutant is neighbor to, in order to let the optical tweezers generate a resultant force to the pollutant; and providing an airflow to the object. The resultant force is greater than a maximum static friction between the pollutant and the object so as to remove the pollutant.

Abstract: An optical calibration tool includes a first body, a light emitter, a light receiver, a second body, and a light reflecting member. The first body has a first engaging port and a second engaging port. The light emitter and the light receiver are disposed in the first body. The second body has a third engaging port and a channel communicated with each other. The third engaging port is configured to selectively engage one of the first engaging port and the second engaging port. When the third engaging port is engaged with the first engaging port, the light emitter is optically coupled to the light reflecting member. When the third engaging port is engaged with the second engaging port, the light receiver is optically coupled to the light reflecting member.

Abstract: A chip package unit, a chip package stack module, and a method of manufacturing the chip package stack module are provided. The chip package stack module includes upper and lower chip package units stacked vertically. The chip package unit includes a plurality of conductive pillars each of which has an upper pad and a lower pad respectively on upper and lower ends of the conductive pillar. The upper and lower chip package units are stacked by the lower pads of the upper chip package unit and the upper pads of the lower chip package unit electrically connected with each other. The conductive pillars of the upper chip package unit are electrically connected with the conductive pillars of the lower chip package unit correspondingly so that a memory chip of the upper chip package unit and a memory chip of the lower chip package unit are electrically connected.

Abstract: The present application provides a process for manufacturing an orally disintegrating tablet (ODT) comprising a cytokine as an active pharmaceutical ingredient comprising: acidifying an excipient, conducting a first granulation step of the acidified excipient to obtain acidic powders, and conducting a second granulation step by mixing the acidic powders and the cytokine to obtain granules containing the cytokine. The present application also provides an ODT manufactured by the process.

Abstract: A method of stabilizing performance of a processing device may include determining a maximum operational temperature of any number of cores of a processing device from a thermal control circuit of the processing device; setting a maximum power based on a maximum thermal capacity of the processing device to a power lower than the maximum operational temperature; increasing the power provided to the processing device when the maximum thermal capacity is below a set temperature; and placing the power provided to the processing device to an intermediate power level relative to the operational temperature and the maximum thermal capacity when operations of the processing device are to exceed the operational temperature of any of the cores of the processing device.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: A device for detecting or identifying diseases or disorders in a human subject by collecting biological sample from the human subject comprises a pump unit, a first unit, a second unit, a gas permeable filter, and a collector. The first unit comprises a first chamber and a gas sensor unit. The second unit comprises a second chamber, an outlet portion and an inlet portion. The gas permeable filter is disposed in an upstream region of the second chamber. The collector is disposed in a downstream region of the second chamber. The pump unit is configured, when activated, to create a negative pressure in a gas flow pathway provided between the first chamber and second chamber through the outlet portion, thereby allowing an ambient gas stream forcedly flows from an exterior through the inlet portion into the second chamber and the first chamber.

Abstract: The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

Abstract: The present invention relates to a spring roll making apparatus comprising: a supply part for supplying rice paper; a moving part for moving the rice paper supplied by means of the supply part; a softening part for inducing softening of the rice paper moving by means of the moving part; a feeding part for feeding a filling onto the rice paper softened by means of the softening part; a folder part for folding the rice paper on which the filling is put; and a rotating part for rolling the rice paper folded by means of the folder part, and thus spring rolls can be mass-produced.

Abstract: A gas detection system for gynecological disease detection and a detection method using the same are provided. The gas detection system is configured to detect an analyte from a female vagina and includes a main body, a sleeve, a detector, a pump, and a controller. The main body includes a body portion and a head portion having an intake channel. The body portion includes a detection chamber and an exhaust channel. The detector includes at least one sensor configured to detect at least one target of the analyte and produce at least one detection signal. The pump is communicated with the detection chamber and the exhaust channel. The controller includes a processing unit and a first communication unit. The processing unit receives the at least one detection signal and controls the first communication unit to send the at least one detection signal.

Abstract: A wafer package for protection of an aluminum die pad of a die from damages during probe testing process is provided. Before performing the probe testing process on a plurality of dies of the wafer package, at least one bump is disposed on a surface of the aluminum die pad of the die of the wafer package by electroless plating. The bump is a metal stack structure having a certain thickness and composed of a nickel layer and a gold layer stacked over the aluminum die pad in turn, or a nickel layer, a palladium layer, and a gold layer stacked over the aluminum die pad in turn. Thus structural strength of the aluminum die pad of the die is increased to prevent damages during the probe testing process. Therefore, quality and reliability of the dies in following operations such as wire bonding are increased.

Abstract: A chip package unit with an outer protective layer and a method of manufacturing the same are provided. The chip package unit includes a rectangular die and at least one outer protective layer. The rectangular die has four sides. The outer protective layer is disposed on a surface of the rectangular die and having four sides. The chip package unit is divided from a wafer by a sawing process along cutting channels disposed on the wafer. The outer protective layer is formed on a surface of the wafer and covering the cutting channels completely. A cutting tool is firstly cutting the outer protective layer on the wafer and then moved downward continuously to cut the respective cutting channels. Thus the sides of the outer protective layer are flush with the sides of the rectangular die to avoid damages of the sides of the rectangular die during the sawing process.