Patents by Inventor Chun Jung Hsu

Chun Jung Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12141624
    Abstract: A method of stabilizing performance of a processing device may include determining a maximum operational temperature of any number of cores of a processing device from a thermal control circuit of the processing device; setting a maximum power based on a maximum thermal capacity of the processing device to a power lower than the maximum operational temperature; increasing the power provided to the processing device when the maximum thermal capacity is below a set temperature; and placing the power provided to the processing device to an intermediate power level relative to the operational temperature and the maximum thermal capacity when operations of the processing device are to exceed the operational temperature of any of the cores of the processing device.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: November 12, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chun Jung Hsu, Hsih Sung Hsu
  • Publication number: 20240084954
    Abstract: A support platform is configured to support at least a portion of the weight of an associated semiconductor manufacturing tool, such as a furnace, when the associated semiconductor manufacturing tool is disposed on the support platform. The support platform comprises a base, a support plate disposed on the base and configured to move respective to the base, a brake plate arranged in fixed position respective to the base, and a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate. The track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion. The inclined track portions are each inclined with respect to the central track portion.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Chuan-Chieh Chiang, Chun-Jung Hsu
  • Patent number: 11852291
    Abstract: A support platform is configured to support at least a portion of the weight of an associated semiconductor manufacturing tool, such as a furnace, when the associated semiconductor manufacturing tool is disposed on the support platform. The support platform comprises a base, a support plate disposed on the base and configured to move respective to the base, a brake plate arranged in fixed position respective to the base, and a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate. The track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion. The inclined track portions are each inclined with respect to the central track portion.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chuan-Chieh Chiang, Chun-Jung Hsu
  • Patent number: 11262831
    Abstract: An example non-transitory computer-readable medium storing machine-readable instructions that, when executed by a processor, cause the processor to: set a graphical processing unit (GPU) power allocation, the GPU power allocation indicating power available for use by a GPU. The processor sets a processor power allocation, the processor power allocation indicating power available for use by the processor. The processor receives a GPU usage value and modifies the GPU power allocation to a modified GPU power allocation based on the GPU usage value. The processor modifies the processor power allocation to a modified processor power allocation based on the modification of the GPU power allocation.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: March 1, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chun Jung Hsu, Lung Chi Huang
  • Publication number: 20210326188
    Abstract: A method of stabilizing performance of a processing device may include determining a maximum operational temperature of any number of cores of a processing device from a thermal control circuit of the processing device; setting a maximum power based on a maximum thermal capacity of the processing device to a power lower than the maximum operational temperature; increasing the power provided to the processing device when the maximum thermal capacity is below a set temperature; and placing the power provided to the processing device to an intermediate power level relative to the operational temperature and the maximum thermal capacity when operations of the processing device are to exceed the operational temperature of any of the cores of the processing device.
    Type: Application
    Filed: January 8, 2019
    Publication date: October 21, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chun Jung Hsu, Hsih Sung Hsu
  • Publication number: 20210157383
    Abstract: An example non-transitory computer-readable medium storing machine-readable instructions that, when executed by a processor, cause the processor to: set a graphical processing unit (GPU) power allocation, the GPU power allocation indicating power available for use by a GPU. The processor sets a processor power allocation, the processor power allocation indicating power available for use by the processor. The processor receives a GPU usage value and modifies the GPU power allocation to a modified GPU power allocation based on the GPU usage value. The processor modifies the processor power allocation to a modified processor power allocation based on the modification of the GPU power allocation.
    Type: Application
    Filed: August 17, 2018
    Publication date: May 27, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chun Jung Hsu, Lung Chi Huang