Patents by Inventor Chun-Kai CHENG

Chun-Kai CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10995179
    Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: May 4, 2021
    Assignee: ETERNAL MATERIALS CO., LTD
    Inventors: Shun-Jen Chiang, Chung-Jen Wu, Po-Yu Huang, Meng-Yen Chou, Chang-Hong Ho, Chun-Kai Cheng
  • Publication number: 20160369053
    Abstract: The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.
    Type: Application
    Filed: June 17, 2016
    Publication date: December 22, 2016
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: Shun-Jen CHIANG, Chung-Jen WU, Po-Yu HUANG, Meng-Yen CHOU, Chang-Hong HO, Chun-Kai CHENG