Patents by Inventor Chun-Kai CHUANG

Chun-Kai CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160206835
    Abstract: A nebulizing device includes a medicament storage module, a nebulizing unit, and a first waterproof gasket. In the medicament storage module, a coupling part is connected with an outer surface of a tubular sidewall and aligned with an outlet of the tubular sidewall, and includes an extension wall and a first recess where the nebulizing unit is disposed. The first waterproof gasket is disposed within the first recess and located on a side of the nebulizing unit farther from the outlet. In the first waterproof gasket, a first opening is disposed adjacent to the nebulizing unit, a second opening is disposed opposite to the first opening and located on a side of the first opening farther from the nebulizing unit, the size of the second opening is greater than that of the first opening, and the annular wall structure is connected to the first opening and the second opening.
    Type: Application
    Filed: March 28, 2016
    Publication date: July 21, 2016
    Inventors: Kuo-Liang LEE, Chun-Kai CHUANG
  • Publication number: 20150062058
    Abstract: A touch panel capable of detecting a stylus is disclosed. At least one self scan cycle and at least one mutual scan cycle are performed in each scan frame, and touch identification of the stylus is affirmed when both touch identifications via the self scan cycle and the mutual scan cycle are detected.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Applicant: Himax Technologies Limited
    Inventors: Chung-Wen Chang, Shen-Feng Tai, Jui-Min Liu, Chun-Kai Chuang
  • Publication number: 20140251668
    Abstract: An automatic manufacturing process for providing buffer pads (40) for a PCB (10), includes a) providing the PCB (10); b) providing an automatic dispensing device and an adhesive (30); c) using the automatic dispensing device to dispense the adhesive (30) to a buffer zone (12) on the PCB (10); d) providing a pick-and-place machine and the buffer pads (40); e) using the pick-and-place machine to place the buffer pads (40) on the buffer zone (12) moistened with the adhesive (30); and f) curing the adhesive (30) to attach the buffer pads (40) to the PCB (10). Thus, labor is saved and manufacturing time is reduced.
    Type: Application
    Filed: August 19, 2013
    Publication date: September 11, 2014
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Chun-Kai CHUANG, Yu-Wei LEE, Kuo-Liang LEE