Patents by Inventor CHUN KAI MAO
CHUN KAI MAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240015446Abstract: A MEMS structure is provided. The MEMS structure includes a substrate and a backplate, the substrate has an opening portion, and the backplate is disposed on one side of the substrate and has acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate, and the diaphragm extends across the opening portion of the substrate and includes outer ventilation holes and inner ventilation holes arranged in a concentric manner. The outer ventilation holes and the inner ventilation holes are relatively arranged in a ring shape and surround the center of the diaphragm. The MEMS structure further includes a pillar disposed between the backplate and the diaphragm. The pillar prevents the diaphragm from being electrically connected to the backplate.Type: ApplicationFiled: October 28, 2022Publication date: January 11, 2024Inventors: Wen-Shan LIN, Chun-Kai MAO, Chih-Yuan CHEN, Jien-Ming CHEN, Feng-Chia HSU, Nai-Hao KUO
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Publication number: 20230339742Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes ventilation holes, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a coverage structure disposed on the sidewall of at least one ventilation hole.Type: ApplicationFiled: August 3, 2022Publication date: October 26, 2023Inventors: Jien-Ming CHEN, Wen-Shan LIN, Chun-Kai MAO, Feng-Chia HSU, Chih-Yuan CHEN, Nai-Hao KUO
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Publication number: 20230319486Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate. The opening portion of the substrate is under the diaphragm, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a pillar structure connected with the backplate and the diaphragm and a protection post structure extending from the backplate into the air gap. From a top view of the backplate, the protection post structure surrounds the pillar structure.Type: ApplicationFiled: October 3, 2022Publication date: October 5, 2023Inventors: Chun-Kai MAO, Chih-Yuan CHEN, Feng-Chia HSU, Jien-Ming CHEN, Wen-Shan LIN, Nai-Hao KUO
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Publication number: 20230319450Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a protrusion extending into the air gap.Type: ApplicationFiled: September 19, 2022Publication date: October 5, 2023Inventors: Chih-Yuan CHEN, Feng-Chia HSU, Chun-Kai MAO, Jien-Ming CHEN, Wen-Shan LIN, Nai-Hao KUO
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Publication number: 20230308809Abstract: A MEMS structure is provided. The MEMS structure includes a substrate having an opening portion and a backplate disposed on one side of the substrate and having acoustic holes. The MEMS structure also includes a diaphragm disposed between the substrate and the backplate and extending across the opening portion of the substrate. The diaphragm includes a ventilation hole, and an air gap is formed between the diaphragm and the backplate. The MEMS structure further includes a filler structure disposed on the diaphragm, and a portion of the filler structure is disposed in the ventilation hole.Type: ApplicationFiled: August 18, 2022Publication date: September 28, 2023Inventors: Chih-Yuan CHEN, Feng-Chia HSU, Chun-Kai MAO, Jien-Ming CHEN, Wen-Shan LIN, Nai-Hao KUO
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Patent number: 11137590Abstract: A tunable optical device including a substrate, at least one support unit, a flexible frame, an elastic component, a first reflector, and at least one actuator is provided. The support unit is fixed onto the substrate. The flexible frame is connected to the support unit and suspended above the substrate. The elastic component is connected to the flexible frame. A stiffness of the elastic component in the Z-axis is smaller than a stiffness of the flexible frame in the Z-axis. The Z-axis direction is parallel to a normal direction of the substrate. The first reflector is connected to the elastic component. The actuator is located between the flexible frame and the substrate or located between the first reflector and the substrate.Type: GrantFiled: March 11, 2016Date of Patent: October 5, 2021Assignee: Industrial Technology Research InstituteInventors: Chia-Jung Chang, Jing-Yuan Lin, Chun-Kai Mao, Jien-Ming Chen, Yu-Sheng Hsieh
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Publication number: 20170139200Abstract: A tunable optical device including a substrate, at least one support unit, a flexible frame, an elastic component, a first reflector, and at least one actuator is provided. The support unit is fixed onto the substrate. The flexible frame is connected to the support unit and suspended above the substrate. The elastic component is connected to the flexible frame. A stiffness of the elastic component in the Z-axis is smaller than a stiffness of the flexible frame in the Z-axis. The Z-axis direction is parallel to a normal direction of the substrate. The first reflector is connected to the elastic component. The actuator is located between the flexible frame and the substrate or located between the first reflector and the substrate.Type: ApplicationFiled: March 11, 2016Publication date: May 18, 2017Inventors: Chia-Jung Chang, Jing-Yuan Lin, Chun-Kai Mao, Jien-Ming Chen, Yu-Sheng Hsieh
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Patent number: 9249008Abstract: A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.Type: GrantFiled: December 2, 2013Date of Patent: February 2, 2016Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu Wen Hsu, Chin Fu Kuo, Chao Ta Huang, Chun Kai Mao, Chin Hung Wang
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Publication number: 20140175572Abstract: A MEMS device with a first electrode, a second electrode and a third electrode is disclosed. These electrodes are disposed on a substrate in such a manner that (1) a pointing direction of the first electrode is in parallel with a normal direction of the substrate, (2) a pointing direction of the third electrode is perpendicular to the pointing direction of the first electrode, (3) the second electrode includes a sensing portion and a stationary portion, (4) the first electrode and the sensing portion are configured to define a sensing capacitor, and (5) the third electrode and the stationary portion are configured to define a reference capacitor. This arrangement facilitates the MEMS device such as a differential pressure sensor, differential barometer, differential microphone and decoupling capacitor to be miniaturized.Type: ApplicationFiled: December 2, 2013Publication date: June 26, 2014Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: YU WEN HSU, CHIN FU KUO, CHAO TA HUANG, CHUN KAI MAO, CHIN HUNG WANG