Patents by Inventor Chun-Kai Tai

Chun-Kai Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Advanced polishing system
    Patent number: 10160088
    Abstract: A method for polishing a polishing pad includes detecting a presence of a defect formed on a groove of a polishing pad; removing the defect from the groove of the polishing pad; after removing the defect, measuring a remaining depth of the groove; and based on the measured remaining depth of the groove, applying a polishing condition on the groove.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: December 25, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Che-Liang Chung, Chun-Kai Tai, Shich-Chang Suen, Wei-Chen Hsiao
  • Advanced Polishing System
    Publication number: 20180043495
    Abstract: A method for polishing a polishing pad includes detecting a presence of a defect formed on a groove of a polishing pad; removing the defect from the groove of the polishing pad; after removing the defect, measuring a remaining depth of the groove; and based on the measured remaining depth of the groove, applying a polishing condition on the groove.
    Type: Application
    Filed: October 30, 2017
    Publication date: February 15, 2018
    Inventors: Che-Liang Chung, Chun-Kai Tai, Shich-Chang Suen, Wei-Chen Hsiao
  • Advanced polishing system
    Patent number: 9802292
    Abstract: A method for polishing a polishing pad includes detecting, by a first sensor, a presence of a defect formed on a groove of a polishing pad; removing, by a polishing disc, the defect from the groove of the polishing pad; after removing the defect, measuring, by a second sensor, a remaining depth of the groove; and based on the measured remaining depth of the groove, applying, through the polishing disc, a polishing condition on the groove.
    Type: Grant
    Filed: February 19, 2016
    Date of Patent: October 31, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Che-Liang Chung, Shich-Chang Suen, Chun-Kai Tai, Wei-Chen Hsiao
  • Advanced Polishing System
    Publication number: 20170239777
    Abstract: A method for polishing a polishing pad includes detecting, by a first sensor, a presence of a defect formed on a groove of a polishing pad; removing, by a polishing disc, the defect from the groove of the polishing pad; after removing the defect, measuring, by a second sensor, a remaining depth of the groove; and based on the measured remaining depth of the groove, applying, through the polishing disc, a polishing condition on the groove.
    Type: Application
    Filed: February 19, 2016
    Publication date: August 24, 2017
    Inventors: Che-Liang Chung, Shich-Chang Suen, Chun-Kai Tai, Wei-Chen Hsiao