Abstract: The present invention provides a chemical mechanical polishing pad dresser, which comprises: a substrate having an upper surface; and an abrasive layer covering the upper surface of the substrate, and the abrasive layer including a bonding layer and a plurality of abrasive particles embedded in the bonding layer.

Abstract: The present invention provides a chemical mechanical polishing pad dresser, which comprises: a substrate having an upper surface; and a abrasive layer covering the upper surface of the substrate, and the abrasive layer including a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a tip height (H), which is a distance between the highest point of each abrasive particle and a surface of the bonding layer, and there is an average pitch (P) between these abrasive particles; wherein the dresser has a leveling value (R), which is a ratio (H/P) of the tip height (H) to the average pitch (P) of 0.05 to 0.3.

Abstract: The present invention provides a chemical mechanical polishing pad dresser, which comprises: a substrate having an upper surface; and an abrasive layer covering the upper surface of the substrate, and the abrasive layer including a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a tip height (H), which is a distance between the highest point of each abrasive particle and a surface of the bonding layer, and the abrasive particles have a particle size(S) of 40 ?m to 800 ?m; wherein the dresser has a leveling value (R) of 0.1 to 0.7 for the ratio of the tip height (H) to the particle size(S).

Abstract: The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.