Patents by Inventor Chun-Kai Tang

Chun-Kai Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220111488
    Abstract: The present invention relates to a polishing pad conditioner and a manufacturing method thereof. The polishing pad conditioner includes a substrate, an abrasive layer and a protective layer. The abrasive layer covers the surface of the substrate. The abrasive layer includes a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a protrusion exposed out of the bonding layer, and the protrusion is insulated. The protective layer covers the surface of the bonding layer, and the protrusion is exposed out of the protective layer. The polishing pad conditioner of the present invention can protect the bonding layer from being damaged by abrasion and hold the abrasive particles, avoid the abrasive particles from falling off or out of position, and maintain the polishing effect and service life of the polishing pad conditioner.
    Type: Application
    Filed: June 30, 2021
    Publication date: April 14, 2022
    Inventors: Jui-Lin Chou, Min-Hung Wu, Chin-Chung Chou, Pin-Hsien Wang, Chun-Kai Tang