Abstract: An electronic device is disclosed. The electronic component has a front side and a backside opposite to the front side. The front side is configured to receive a first power. The backside is configured to receive a second power greater than the first power.

Abstract: An air conditioning system is provided with an integrated heat exchanger. The air conditioning system generates heating air or cooling air through the integrated heat exchanger that adjusts the temperature of conditioning air by circulating coolant, thus securing cooling and heating efficiency. The air conditioning system adjusts temperature by the coolant circulated in the integrated heat exchanger such that a temperature adjustment door for adjusting the temperature of the conditioning air is eliminated, the number of components is decreased, and the size of an overall package is reduced.

Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.

Abstract: The disclosure discloses a data writing operation method and device of a resistive random access memory, and the method includes: applying a first pulse voltage to the resistive random access memory, and adding one to a corresponding number to obtain a first number; if the current first number is greater than a first set upper limit value and a current second number is smaller than or equal to a second set upper limit value, obtaining a test value; if the test value does not satisfy a preset condition, applying a second pulse voltage to the resistive random access memory, and adding one to the corresponding number to obtain a second number until the test value satisfies the preset condition or the current second number is greater than the second set upper limit value, thereby improving the writing efficiency.

Abstract: The present disclosure relates to a hydrogen tank support apparatus, and the hydrogen tank support apparatus according to the present disclosure includes: a hydrogen storage tank; a frame portion on which the hydrogen storage tank is seated; and a sliding block portion configured to fix a nozzle portion of the hydrogen storage tank to the frame portion, wherein the sliding block portion includes a lower block portion fixed to the frame portion, an upper block portion coupled to the lower block portion in a concave-convex manner so that movement of the hydrogen storage tank is limited in a longitudinal direction and a width direction of the hydrogen storage tank, and a slide ball portion configured to surround an outer side surface of the nozzle portion, interposed between the lower block portion and the upper block portion, and configured to rotatably support the nozzle portion.

Abstract: A method includes irradiating debris deposited in an extreme ultraviolet (EUV) lithography system with laser, controlling one or more of a wavelength of the laser or power of the laser to selectively vaporize the debris and limit damage to the EUV) lithography system, and removing the vaporized debris.

Abstract: The present disclosure provides an electronic device, which includes a circuit structure, a processing component, a first storage unit, and a second storage unit. The processing component is disposed over the circuit structure. The first storage unit is supported by the circuit structure, and electrically connected to the processing component. The second storage unit is disposed under the circuit structure and electrically connected to the processing component via the circuit structure.

Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

Abstract: In some examples, a touch and force sensitive device includes integrated circuitry configured to attenuate noise in a first period of operation, and sense force of an object contacting the device in a second period of operation. In some examples, a touch and force sensitive device includes integrated circuitry formed from a same material layer, the material layer configured to detect a force of an object contacting the device in first one or more regions of the material layer, and configured to couple touch detection circuitry in second one or more regions of the material layer.

Abstract: A semiconductor device and a manufacturing method therefor are provided. The method includes: depositing a first dielectric layer material on a semiconductor substrate, and etching the first dielectric layer material to form a trench corresponding to each via in the semiconductor substrate in a first dielectric layer; the via being filled with a metal material; depositing a bottom electrode material in the trench, and etching the bottom electrode material to form a bottom electrode covering a bottom of the trench; depositing a resistive layer material to form a resistive layer covering an upper surface of the bottom electrode and a sidewall of the trench; and depositing a top electrode material in a groove of the resistive layer, such that the groove is filled with the top electrode material to form a top electrode which is arranged in the groove and fills the groove.

Abstract: A semiconductor integrated circuit device includes a resistive layer having a trench-like structure with an upward opening, a first electrode located on an outer side of the resistive layer, and a second electrode located on an inner side of the resistive layer; the first electrode and the second electrode are opposite to each other on two sides of a sidewall of the resistive layer; and the resistive layer, the first electrode and the second electrode form a first memory cell. A manufacturing method includes forming a first electrode on a substrate, the substrate including a first via connected with a first metal layer; etching a recess in the first electrode at a position staggered from the first via and forming a resistive layer in the recess; and forming a second electrode in the opening of the resistive layer to obtain a first memory cell.

Abstract: Provided is a device for executing an application including a graphics user interface (GUI) for receiving an input value of an input field, the device including an audio output unit, a user input unit receiving a user input to request execution of the application, and a control unit configured to output, through the audio output unit, an audio signal indicating an induced inquiry corresponding to the input field, based on whether the user input is a voice input, to receive a voice input indicating a response to the induced inquiry, and to execute the application by setting an input value for the input field based on the voice input indicating the response to the induced inquiry.

Abstract: Disclosed in embodiments of the present application are a linear resistive element and a preparation method therefor. The linear resistive element includes a substrate unit, a function unit and an electrode unit. The substrate unit includes a substrate layer, which is configured to connect the function unit and the electrode unit. The electrode unit includes a first electrode and a second electrode. The first and second electrodes are deposited on the substrate layer, and the function unit is connected between the first and second electrodes. The function unit includes first dielectric layers and resistive layers. The first dielectric layers and the resistive layers are deposited on the substrate layer in an alternately stacked manner. A number of the resistive layers is at least two, and a conductive filament for conductively connecting the first and second electrodes is formed in each of the resistive layers.

Abstract: A tool box includes a base element and a cover. The base element and the cover form a box interior for receiving at least one hand-held power tool. The tool box further includes a locking tab for locking the cover to the base element. The locking tab includes an insertion tool holding device for holding at least one insertion tool.

Abstract: An apparatus for transporting a plurality of semiconductor dies comprises a first tape having a top side and a bottom side opposite of the top side, the top side including a plurality of protrusions, wherein subsets of the plurality of protrusions are grouped together and each subset is spaced apart from adjacent subsets at a predetermined interval; and a second tape having a front side and a back side opposite of the front side, the front side including a plurality of pockets, each of the plurality of pockets configured for receiving a semiconductor die, wherein each of the plurality of pockets is spaced apart from adjacent pocket at the predetermined interval. The subsets of the plurality of protrusions are configured to vertically align with the plurality of pockets.

Abstract: The present disclosure discloses a method for manufacturing a resistive switching element, including: performing an etching process, a deposition process and a polishing process alternately to prepare the bottom electrode, the resistive switching layer and the top electrode; and optimizing at least one of the bottom electrode, the resistive switching materials and the oxygen storage layer by using the sidewall process when preparing the bottom electrode and the resistive switching materials, so as to reduce a contact area between the bottom electrode and the resistive switching materials, and/or reduce a contact area between the resistive switching materials and the oxygen storage layer. The method could form conductive filaments in the resistive switching layer, and a low resistive state and high resistive state are realized by forming and breaking conductive filaments.

Abstract: A lens driving apparatus is for driving a lens assembly and includes a base, a metal cover, a carrier, a first coil, at least one first magnet, at least one second magnet, a frame and a spring set. At least one lower leaf spring of the spring set includes a frame connecting section, a carrier connecting section and a resilient section. The carrier connecting section and the second magnet are arranged along the first direction. The carrier connecting section includes an opening portion and a shielding portion, and the opening portion and the shielding portion both corresponding to the second magnet along the first direction are respectively for a part of the second magnet to be exposed through the opening portion and another part of the second magnet to be shielded by the shielding portion.

Abstract: Provided are a device and a method for providing a response message to a voice input of a user. The method, performed by a device, of providing a response message to a voice input of a user includes: receiving the voice input of the user; determining a destination of the user and an intention of the user, by analyzing the received voice input; obtaining association information related to the destination; generating the response message that recommends a substitute destination related to the intention of the user, based on the obtained association information; and displaying the generated response message.

Abstract: The application discloses a virtual reality (VR) head-mounted display (HMD) device, and the VR HMD is worn on a head of a user, and includes a body and a fixing assembly. The fixing assembly includes a support arm set, two pivot pieces and two audio elements. The support arm set has a first end portion and a second end portion respectively located on two opposite sides of the body. The two pivot pieces are respectively connected to the first end portion and the second end portion, and are respectively pivotally connected to the two opposite sides of the body. The two audio elements are respectively disposed between the first end portion and one of the two pivot pieces and between the second end portion and another of the two pivot pieces. Each of the two audio elements has a sound guide hole facing an ear of the user.

Abstract: A reflective cholesteric liquid crystal display includes a display unit. The display unit includes a upper transparent substrate, a lower substrate, a upper transparent electrode pattern formed on the upper transparent substrate, a lower transparent electrode pattern formed on the lower substrate, a cholesteric liquid crystal layer sandwiched between the upper transparent electrode pattern and the lower transparent electrode pattern, and a light absorbing layer formed on the upper transparent substrate. The cholesteric liquid crystal layer is used for generating a visible light including a wavelength range. The light absorbing layer is used for absorbing light outside the wavelength range, so that the visible light in the wavelength range passes through the light absorbing layer and the upper transparent substrate.