Patents by Inventor Chun-Ku Liao

Chun-Ku Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11735195
    Abstract: The present invention provides a signal transmission method for data transmission through an audio transmission interface. The method includes: receiving audio data and first control data that is generated based on at least one first human-machine interaction; packing the audio data into at least one first data unit; packing the first control data into at least one second data unit; and transmitting a bit stream including the first data unit and the second data unit at a transmission rate that is higher than a sampling rate of the audio data.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: August 22, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Chun-Ku Liao, Chia-Che Wu
  • Publication number: 20220068286
    Abstract: The present invention provides a signal transmission method for data transmission through an audio transmission interface. The method includes: receiving audio data and first control data that is generated based on at least one first human-machine interaction; packing the audio data into at least one first data unit; packing the first control data into at least one second data unit; and transmitting a bit stream including the first data unit and the second data unit at a transmission rate that is higher than a sampling rate of the audio data.
    Type: Application
    Filed: June 22, 2021
    Publication date: March 3, 2022
    Applicant: Realtek Semiconductor Corp.
    Inventors: Chun-Ku Liao, Chia-Che Wu