Patents by Inventor Chun-Lan Tseng

Chun-Lan Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9000098
    Abstract: Polymer spheres are fabricated. Dispersing polymerization and a two-stage swelling procedure are processed. The polymer spheres fabricated have uniform granular sizes and are highly cross-linking. Thus, the polymer spheres are heat-resistant and solvent-resistant.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Ming-Hsiung Wei, Yu-Wei Hou, Hui Chen, Chun-Lan Tseng
  • Publication number: 20130303703
    Abstract: Polymer spheres are fabricated. Dispersing polymerization and a two-stage swelling procedure are processed. The polymer spheres fabricated have uniform granular sizes and are highly cross-linking. Thus, the polymer spheres are heat-resistant and solvent-resistant.
    Type: Application
    Filed: May 14, 2012
    Publication date: November 14, 2013
    Applicant: Chung-Shan Institute of Science and Technology, Armaments,Bureau, Ministry of National Defense
    Inventors: Ming-Hsiung Wei, Yu-Wei Hou, Hui Chen, Chun-Lan Tseng
  • Publication number: 20030113251
    Abstract: A method for preparing shape-changed nanosize colloidal silica comprising the following steps: a). providing a nanosize spherical colloidal silica solution having an average diameter no more than 100 nm; b). adding a coagulant having a concentration no more than 5 wt % and an active silicic acid to the colloidal silica solution, and raising the reaction temperature; and c). keeping addition of said active silicic acid to said solution obtained from step b) continuously until the concentration of SiO2 reaches 6 to 50% by weight.
    Type: Application
    Filed: December 6, 2002
    Publication date: June 19, 2003
    Applicant: Chung Shan Institute of Science & Technology
    Inventors: Zong-Whie Shih, Kai-Yia Chang, Chun-Lan Tseng, Chun-Yuan Ro