Abstract: Methods for isolating two adjacent transistors are disclosed. A substrate has a first semiconducting fin on a first region and a second semiconducting fin on a second region, and the first semiconducting fin and the second semiconducting fin contact each other at a jog region. A dummy gate within or adjacent the jog region is removed to expose a portion of the first semiconducting fin and form an isolation volume. Etching is performed to remove the exposed portion of the first semiconducting fin and create a trench in the substrate. The trench and the isolation volume are filled with at least one dielectric material to form an electrically isolating structure between the first region and the second region. Additional dummy gates in each region can be removed and replaced with an electrically conductive material to form two adjacent transistors electrically isolated from each other.

Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.

Abstract: The integrated automated cell culture device includes a main body, a cover, a connection seat, a gas module, a temperature module, at least one slide track, and a clamping member. The main body encloses a culture room for receiving a culture bag. The cover is disposed on the opening of the culture room. The connection seat is received in a receiving slot of the main body and is adapted for a pipe to penetrate. The gas module detects the carbon dioxide's concentration and selectively injects gas into the culture room. The temperature module detects the temperature in the culture room and selectively heats the culture room. The slide track is disposed on the bottom of the culture room. The clamping member is slidably disposed on the slide track and clamps the culture bag to make the fluid in the culture bag move to one side of the culture bag.

Abstract: A method includes: receiving a composite substrate including a first region and a second region, the composite substrate including a semiconductor substrate and an insulator layer over the semiconductor substrate; forming a trench through the insulator layer, the trench exposing a surface of the semiconductor substrate in the first region; growing an initial epitaxial layer in the trench and over an upper surface of the second region; thickening the initial epitaxial layer to form an epitaxial layer; forming a transistor layer over the epitaxial layer, the transistor layer including a first transistor and a second transistor in the first region and the second region, respectively; and forming an interconnect layer over the transistor layer and electrically coupling the first transistor to the second transistor.

Abstract: A planarization method is provided and includes the following steps. A substrate having a main surface is provided. A protruding structure is formed on the main surface. An insulating layer is formed conformally covering the main surface and the top surface and the sidewall of the protruding structure. A stop layer is formed on the insulating layer and at least covers the top surface of the protruding structure. A first dielectric layer is formed blanketly covering the substrate and the protruding structure and a chemical mechanical polishing process is then performed to remove a portion of the first dielectric layer until a portion of the stop layer is exposed thereby obtaining an upper surface. A second dielectric layer having a pre-determined thickness is formed covering the upper surface.

Abstract: The present invention provides a wafer polishing pad, the wafer polishing pad includes a polishing material layer, a plurality of recesses are formed on the top surface of the polishing material layer, and a warning element disposed within the polishing material layer, the warning element and the polishing material layer have different colors. The feature of the invention is that forming a warning element in the polishing material layer, when the visible state of the warning element is changed, for example, when the warning element appears, disappears or changes the shapes, it means that the wafer polishing pad needs to be replaced. In this way, the user can confirm the destroying situation of the wafer polishing pad easily, and also improving the manufacturing process efficiency.

Abstract: The present invention provides a wafer polishing pad, the wafer polishing pad includes a polishing material layer, a plurality of recesses are formed on the top surface of the polishing material layer, and a warning element disposed within the polishing material layer, the warning element and the polishing material layer have different colors. The feature of the invention is that forming a warning element in the polishing material layer, when the visible state of the warning element is changed, for example, when the warning element appears, disappears or changes the shapes, it means that the wafer polishing pad needs to be replaced. In this way, the user can confirm the destroying situation of the wafer polishing pad easily, and also improving the manufacturing process efficiency.

Abstract: A planarization method is provided and includes the following steps. A substrate having a main surface is provided. A protruding structure is formed on the main surface. An insulating layer is formed conformally covering the main surface and the top surface and the sidewall of the protruding structure. A stop layer is formed on the insulating layer and at least covers the top surface of the protruding structure. A first dielectric layer is formed blanketly covering the substrate and the protruding structure and a chemical mechanical polishing process is then performed to remove a portion of the first dielectric layer until a portion of the stop layer is exposed thereby obtaining an upper surface. A second dielectric layer having a pre-determined thickness is formed covering the upper surface.

Abstract: A method for manufacturing metal interconnects. The method includes following steps. A substrate including a dielectric layer formed thereon is provided, and a plurality of trenches are formed in the dielectric layer. Next, a seed layer is formed in the trenches and on the dielectric layer and followed by masking regions of the seed layer to define a plurality of masked regions and a plurality of exposed regions for the seed layer. Subsequently, a surface treatment is performed to the exposed regions of the seed layer to form a plurality of rough surfaces on the exposed regions of the seed layer. Then, a metal layer is formed on the substrate, and the trenches are filled up with the metal layer.

Abstract: A flatbed scanning device of a paper feeding scanning equipment includes a device casing and a scanning module. The device casing includes a first glass plate, and a second glass plate spaced apart from the first glass plate and having a bottom surface. The scanning module is disposed in the device casing, and including a module body, a scanning assembly disposed in the module body, and at least one contact assembly disposed on the module body. When the scanning module is in an initial position, the scanning assembly is located below the first glass plate, and the at least one contact assembly abuttingly contacts the bottom surface of the second glass plate.

Abstract: A flatbed scanning device of a paper feeding scanning equipment includes a device casing and a scanning module. The device casing includes a first glass plate, and a second glass plate spaced apart from the first glass plate and having a bottom surface. The scanning module is disposed in the device casing, and including a module body, a scanning assembly disposed in the module body, and at least one contact assembly disposed on the module body. When the scanning module is in an initial position, the scanning assembly is located below the first glass plate, and the at least one contact assembly abuttingly contacts the bottom surface of the second glass plate.

Abstract: An image scanning device includes a bottom wall, a surrounding wall extending upwardly from the bottom wall, a frame connected to the surrounding wall and having a first side plate, and a transparent panel fixed to the frame and having a lateral side supported by an upper part of the first side plate. A contact image sensor module is disposed on the bottom wall transverse to the first side plate, and includes a housing having a first short side wall spaced apart from the first side plate by a first distance less than or equal to 2 mm, and a plurality of sensors, one of which that is closest to the first short side wall is spaced apart from an outer surface of the first short side wall by a second distance less than or equal to 2.5 mm.

Abstract: An image scanning apparatus includes a base, a transparent plate, a guide rod disposed between the base and the transparent plate, an optical sensor module, and a carrier mounted on the guide rod and including a first support bracket to place the optical sensor module thereto and having a first pivot connecting portion, a second support bracket having a second pivot connecting portion connected pivotally to the first pivot connecting portion, and an elastic member disposed between the first and second support brackets and biasing upwardly the first support bracket so as to keep the optical sensor module in constant contact with the transparent plate.

Abstract: An image scanning apparatus includes a base, a transparent plate, a guide rod disposed between the base and the transparent plate, an optical sensor module, and a carrier mounted on the guide rod and including a first support bracket to place the optical sensor module thereto and having a first pivot connecting portion, a second support bracket having a second pivot connecting portion connected pivotally to the first pivot connecting portion, and an elastic member disposed between the first and second support brackets and biasing upwardly the first support bracket so as to keep the optical sensor module in constant contact with the transparent plate.

Abstract: An image scanning device includes a bottom wall, a surrounding wall extending upwardly from the bottom wall, a frame connected to the surrounding wall and having a first side plate, and a transparent panel fixed to the frame and having a lateral side supported by an upper part of the first side plate. A contact image sensor module is disposed on the bottom wall transverse to the first side plate, and includes a housing having a first short side wall spaced apart from the first side plate by a first distance less than or equal to 2 mm, and a plurality of sensors, one of which that is closest to the first short side wall is spaced apart from an outer surface of the first short side wall by a second distance less than or equal to 2.5 mm.

Abstract: A follower roller mounting mechanism for a paper feeding apparatus is provided, which has at least one follower roller and a shaft passing through the follower roller. The follower roller mounting mechanism includes a base having a trough and a hole on a top surface thereof. The trough has a back wall, a bottom wall, and two opposite lateral walls. The bottom wall and the back wall are adjacent to each other. Each of the lateral walls has a sliding slot. The shaft is disposed inside the base passing through the trough via the sliding slot for making the follower roller protruding from the top surface through the hole. An elastic element is disposed between the shaft and the back wall for generating elastic force, pushing the shaft sliding along the sliding slot, and making the follower roller to constantly rise above the top surface through the hole.

Abstract: A paper grabbing assembly is provided. The paper grabbing assembly includes: a base with a pivot seat disposed thereon, wherein the shaft is pivotally disposed on the pivot seat; a bearing plate, pivotally disposed on the base corresponding to the paper grabbing roller; a driven member, connected to one end of the shaft; a cam member and an elastic member, rotatablely fitted on the shaft. The elastic member frictionally contacts the cam member and the driven member respectively, such that the driven member rotates the cam member via the elastic member, for pressing the bearing plate away from the paper grabbing roller. Further, when the cam member is stopped, the elastic member slides relative to the cam member, such that the driven member may not be affected by the cam member, but continue driving the paper grabbing roller to rotate.

Abstract: A paper pressing device disposed on one side of a paper track of a sheet feed scanner, corresponding to a scanning module on the other side of the paper track is provided. The paper pressing device includes two pivot seats, a pressing block, and an elastic element. The two pivot seats are respectively disposed at two lateral edges of the paper track. The pressing block is located across and above the paper track, and is pivotally disposed between the two pivot seats for being rotated and slid. The elastic element, pressing against the pressing block, is used to provide a normal force to push the pressing block to move linearly and rotate. By adjusting the position and angle of the pressing block, the paper is flattened onto the scanning module.

Abstract: In an apparatus for water-pipe smoking, a liquid container and a bowl unit are disposed in a hollow base. The liquid container includes a container body to be partially filled with a liquid body, a smoke guide duct having first and second duct portions that respectively extend out of and into the container body, and a smoke passage accessible via a radial access hole in the hollow base. The bowl unit is coupled to the first duct portion, holds combustible smoking material therein, and allows smoke that results from combustion of the smoking material in the bowl unit to flow into the smoke guide duct. An electric heating unit is mounted to a top cover that covers a top side of the hollow base, and is operable so as to generate heat for causing the smoking material in the bowl unit to combust.

Abstract: A scanning apparatus includes a body, a transparent plate, a scanning module, and a color reference slice. A paper-feeding track is formed within the body, and a scanning window is formed at a side wall of the paper-feeding track. A coupling groove is formed at an edge of the scanning window. Both the transparent plate and the color reference slice have an edge being inserted into the coupling groove, such that the transparent plate covers the scanning window while the color reference slice leans against a side surface of the transparent plate facing the paper-feeding track. The scanning module is disposed within the body corresponding to the scanning window, such that a paper to be scanned and the color reference slice are located in the same plane, and the color reference slice and the paper are scanned under the same optical conditions.