Abstract: A semiconductor structure includes: a channel layer; an active layer over the channel layer, wherein the active layer is configured to form a two-dimensional electron gas (2DEG) to be formed in the channel layer along an interface between the channel layer and the active layer; a gate electrode over a top surface of the active layer; and a source/drain electrode over the top surface of the active layer; wherein the active layer includes a first layer and a second layer sequentially disposed therein from the top surface to a bottom surface of the active layer, and the first layer possesses a higher aluminum (Al) atom concentration compared to the second layer. An HEMT structure and an associated method are also disclosed.

Abstract: A device includes a buried well region and a first HVW region of the first conductivity, and an insulation region over the first HVW region. A drain region of the first conductivity type is disposed on a first side of the insulation region and in a top surface region of the first HVW region. A first well region and a second well region of a second conductivity type opposite the first conductivity type are on the second side of the insulation region. A second HVW region of the first conductivity type is disposed between the first and the second well regions, wherein the second HVW region is connected to the buried well region. A source region of the first conductivity type is in a top surface region of the second HVW region, wherein the source region, the drain region, and the buried well region form a JFET.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor structure, a dielectric layer, a metal-semiconductor compound film and a cover layer. The semiconductor structure has an upper surface and a lateral surface. The dielectric layer encloses the lateral surface of the semiconductor structure and exposes the upper surface of the semiconductor structure. The metal-semiconductor compound film is on the semiconductor structure, wherein the dielectric layer exposes a portion of a surface of the metal-semiconductor compound film. The cover layer encloses the portion of the surface of the metal-semiconductor compound film exposed by the dielectric layer, and exposes the dielectric layer.

Abstract: A keyboard device and an operating method thereof are provided. The keyboard device includes a microcontroller, a drive circuit, a backlight module, and a plurality of key units. The microcontroller is coupled to a computer device. A detection module of the computer device detects an input mode of the computer device. The plurality of key units is disposed on the backlight module. The plurality of key units each has a plurality of character symbols corresponding to different input modes. The microcontroller outputs a control signal to the drive circuit according to the input mode. The drive circuit drives the backlight module according to the control signal to selectively illuminate one of the plurality of character symbols of each of at least a portion of the plurality of key units.

Abstract: A gate oxide forming process includes the following steps. A substrate including a first area and a second area is provided. A first oxide layer, a silicon containing cap layer and a second oxide layer on the substrate of the first area and the second area are sequentially and blanketly formed. The silicon containing cap layer and the second oxide layer in the first area are removed. An oxidation process is performed to oxidize the silicon containing cap layer and a gate oxide layer is formed in the second area.

Abstract: A gate oxide forming process includes the following steps. A substrate including a first area and a second area is provided. A first oxide layer, a silicon containing cap layer and a second oxide layer on the substrate of the first area and the second area are sequentially and blanketly formed. The silicon containing cap layer and the second oxide layer in the first area are removed. An oxidation process is performed to oxidize the silicon containing cap layer and a gate oxide layer is formed in the second area.

Abstract: A key module includes a base plate, a circuit layer and a lifting mechanism. The circuit layer is disposed on the base plate. The lifting mechanism is pivotally connected with the base plate relative to the circuit layer, and the lifting mechanism has an abutment element. The abutment element could interfere with the circuit layer to reduce the noise generated by the key module during operation.

Abstract: A key assembly including a base plate, a keycap, an elastic member, and a link member is provided. The base plate includes a body and a hook portion, the hook portion including a hole. The keycap is disposed on the base plate. The elastic member is disposed between the base plate and the keycap. The link member includes a connecting portion, a rod portion, and an end portion, the rod portion being assembled to the keycap, the connecting portion being connected between the rod portion and the end portion, and the end portion penetrating the hole, wherein an included angle between the end portion and the connecting portion is an obtuse angle.

Abstract: The present invention provides a modified rubber containing silicon and phosphorus, and a composition and manufacturing method thereof. The present invention provides the modified rubber structured as formula (1), wherein X is selected from a C1-C12 alkylene group, a C2-C12 alkenylene group, a C3-C12 alicyclic group, and a C6-C12 aromatic group; and A1, A2, A3, Y, and Z are each independently selected from an alkyl group, an alkoxy group, a halide group, and a conjugated diene rubber, wherein the conjugated diene rubber is a polymer composed of a conjugated diene monomer or the conjugated diene monomer with a vinyl aromatic monomer, A1, A2, A3, Y, and Z are the same or different from each other, and at least one of A1, A2, A3, Y, and Z is the conjugated diene rubber.

Abstract: A key module including a key cap, a bottom plate, and a scissors structure is provided. The scissors structure has a first supporting member and a second supporting member pivoted to the key cap and the bottom plate respectively. The first supporting member has a plurality of protruding shafts, the second supporting member has a plurality of axle holes, and the protruding shafts are movably pivoted to the axle holes respectively.

Abstract: A keyboard device and an operating method thereof are provided. The keyboard device includes a microcontroller, a drive circuit, a backlight module, and a plurality of key units. The microcontroller is coupled to a computer device. A detection module of the computer device detects an input mode of the computer device. The plurality of key units is disposed on the backlight module. The plurality of key units each has a plurality of character symbols corresponding to different input modes. The microcontroller outputs a control signal to the drive circuit according to the input mode. The drive circuit drives the backlight module according to the control signal to selectively illuminate one of the plurality of character symbols of each of at least a portion of the plurality of key units.

Abstract: A keyboard includes a plurality of key modules. Each key module includes a baseplate, a circuit membrane disposed on the baseplate, a metal dome disposed on the circuit membrane, an elastic member disposed on the metal dome, and a keycap. The elastic member and the linkage member are configured to be a movable switch mechanism. The circuit membrane has a conductive circuit. The metal dome has an opening corresponding to the conductive circuit of the circuit membrane. A trigger portion protrudes from an underside of the elastic member. When the keycap is pressed, the trigger portion passes through the opening of the metal dome, and moves downwards to abut against the conductive circuit to induce a conducting signal. The movable switch mechanism can be made by a double injection molding method.

Abstract: A key structure includes a key cap, a supporting board, a bridge assembly, a first supporting part, a second supporting part, an attractable element and a magnet. The bridge assembly includes first and second hinge parts. The first hinge part has a first pivot coupling portion. The second hinge part has a second pivot coupling portion. The first and second supporting parts are coupled to two ends of the first and second pivot coupling portions, respectively, wherein the first and the second supporting parts are disposed on the supporting board, a material of the first supporting part is different from a material of the supporting board, and a material of the second supporting part is different from the material of the supporting board. The attractable element is disposed on the second hinge part. The magnet is correspondingly located under the attractable element.

Abstract: A key structure including a base, a pivoting structure and a cap is provided. The base includes a plate, a first limiting unit and a second limiting unit. The pivoting structure includes a first pivoting part and a second pivoting part, the first pivoting part has a connecting shaft, and the second pivoting part has a shaft hole in which the connecting shaft is received and slidable. The cap has a first pivoting unit and a second pivoting unit, one side of the first pivoting part and one side of the second pivoting part are pivotally connected to the first pivoting unit and the second pivoting unit respectively, and the other side of the first pivoting part and the other side of the second pivoting part are slidably disposed in the first limiting unit and the second limiting unit respectively.

Abstract: A unit type backlight module including a circuit board, a plurality of light emitting units and a plurality of light guide plates is provided. The circuit board is disposed under the key structures. The light emitting units is disposed on the circuit board. The light guide plates are disposed on the circuit board and are separated from each other. The light emitting units and their corresponding light guide plates are disposed under the key structures for each key structure.

Abstract: A key module including a key cap, a bottom plate, and a scissors structure is provided. The scissors structure has a first supporting member and a second supporting member pivoted to the key cap and the bottom plate respectively. The first supporting member has a plurality of protruding shafts, the second supporting member has a plurality of axle holes, and the protruding shafts are movably pivoted to the axle holes respectively.

Abstract: A key structure includes a key cap, a supporting board, a bridge assembly, a first supporting part, a second supporting part, an attractable element and a magnet. The bridge assembly includes first and second hinge parts. The first hinge part has a first pivot coupling portion. The second hinge part has a second pivot coupling portion. The first and second supporting parts are coupled to two ends of the first and second pivot coupling portions, respectively, wherein the first and the second supporting parts are disposed on the supporting board, a material of the first supporting part is different from a material of the supporting board, and a material of the second supporting part is different from the material of the supporting board. The attractable element is disposed on the second hinge part. The magnet is correspondingly located under the attractable element.

Abstract: The present invention provides a modified rubber containing silicon and phosphorus, and a composition and manufacturing method thereof. The present invention provides the modified rubber structured as formula (1), wherein X is selected from a C1-C12 alkylene group, a C2-C12 alkenylene group, a C3-C12 alicyclic group, and a C6-C12 aromatic group; and A1, A2, A3, Y, and Z are each independently selected from an alkyl group, an alkoxy group, a halide group, and a conjugated diene rubber, wherein the conjugated diene rubber is a polymer composed of a conjugated diene monomer or the conjugated diene monomer with a vinyl aromatic monomer, A1, A2, A3, Y, and Z are the same or different from each other, and at least one of A1, A2, A3, Y, and Z is the conjugated diene rubber.

Abstract: A unit type backlight module including a circuit board, a plurality of light emitting units and a plurality of light guide plates is provided. The circuit board is disposed under the key structures. The light emitting units is disposed on the circuit board. The light guide plates are disposed on the circuit board and are separated from each other. The light emitting units and their corresponding light guide plates are disposed under the key structures for each key structure.

Abstract: A key structure includes a key cap, a bridge assembly, a first supporting part, a second supporting part, an attractable element and a magnet. The bridge assembly includes first and second hinge parts. The first hinge part has a first pivot coupling portion and a first connecting portion. The second hinge part has a second pivot coupling portion and a second connecting portion, wherein the first and second connecting portions are connected on an axis, and the first and second hinge parts rotate with respect to the axis. The first and second supporting parts are coupled to two ends of the first and second pivot coupling portions, respectively. The attractable element is disposed on the second hinge part. The magnet is correspondingly located under the attractable element for providing a magnetic force, so that the attractable element is attracted and positioned by the magnetic force.