Abstract: The present invention relates to a mouse, including a base, a cover plate provided with a hole, a circuit board, a button switch, an elastic cover, and an upper cover. The cover plate covers the base, and the circuit board is disposed on the base and located between the base and the cover plate. The button switch is disposed on the circuit board. The elastic cover covers the button switch, and extends into the hole together with the button switch, so as to prevent the button switch from being exposed out of the hole. The upper cover covers the cover plate, and the upper cover is capable of oscillating relative to the cover plate to abut against the elastic cover, so as to trigger the button switch.

Abstract: The present invention provides a mouse, including a mouse body, a button input component, and an idle stroke eliminating part. The button input component includes a button sensing element and a pressing member. The button sensing element is installed in the mouse body. The pressing member covers the outside of the mouse body, and the pressing member includes a connecting pole, where the connecting pole is inserted into the mouse body to abut against the button sensing element. The idle stroke eliminating part is disposed outside the mouse body, and the idle stroke eliminating part includes a pivot and an interference member. The pivot is pivotally connected to the mouse body; and the interference member is crimped on an upper surface of the mouse body, so that an idle stroke is eliminated.

Abstract: A keyboard device includes three detachable keyboard modules. In a stored state, a first base of a keyboard module and a second base of a second keyboard module are located over a third base of a third keyboard module. Moreover, plural key structures of the third keyboard module are accommodated within an accommodation space that is defined by a receiving recess of the first keyboard module and a receiving recess of the second keyboard module. In a usage state, the first keyboard module and the second keyboard module are horizontally combined with two lateral sides of the third keyboard module, plural key structures of the first keyboard module are supported by a first side of the third base and the first base collaboratively, and plural key structures of the second keyboard module are supported by a second side of the third base and the second base collaboratively.

Abstract: A bridge structure for use in a semiconductor device includes a semiconductor substrate and a semiconductor structure layer. The semiconductor structure layer is formed on a surface of the semiconductor substrate and a lattice difference is formed between the semiconductor structure layer and the semiconductor substrate. The semiconductor structure layer includes at least a first block, at least a second block and at least a third block, wherein the first block and the third block are bonded on the surface of the semiconductor substrate, the second block is floated over the semiconductor substrate and connected with the first block and the third block.

Abstract: A germanium (Ge) structure includes a substrate, a Ge layer and at least a Ge spatial structure. The Ge layer is formed on the substrate, and a surface of the Ge layer is a Ge {110} lattice plane. The Ge spatial structure is formed in the Ge layer and includes a top surface and a sidewall surface, wherein the top surface is a Ge {110} lattice plane and the sidewall surface is perpendicular to the top surface. An axis is formed at a junction of the sidewall surface and the top surface, and an extensive direction of the axis is parallel to a Ge [112] lattice vector on the surface of the Ge layer, therefore the sidewall surface is a Ge {111} lattice plane. Because Ge {111} surface channels have very high electron mobility, this Ge spatial structure may be applied for fabricating high-performance Ge semiconductor devices.

Abstract: A bridge structure for use in a semiconductor device includes a semiconductor substrate and a semiconductor structure layer. The semiconductor structure layer is formed on a surface of the semiconductor substrate and a lattice difference is formed between the semiconductor structure layer and the semiconductor substrate. The semiconductor structure layer includes at least a first block, at least a second block and at least a third block, wherein the first block and the third block are bonded on the surface of the semiconductor substrate, the second block is floated over the semiconductor substrate and connected with the first block and the third block.