Patents by Inventor Chun-Lin Ko

Chun-Lin Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9577308
    Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: February 21, 2017
    Assignee: NATIONAL CHAIO TUNG UNIVERSITY
    Inventors: Chun-Hsing Li, Chien-Nan Kuo, Chun-Lin Ko
  • Publication number: 20150068024
    Abstract: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.
    Type: Application
    Filed: March 11, 2014
    Publication date: March 12, 2015
    Applicant: National Chiao Tung University
    Inventors: Chun-Hsing Li, Chien-Nan Kuo, Chun-Lin Ko