Patents by Inventor Chun-Ling Chang

Chun-Ling Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220102943
    Abstract: A method of fabricating a laser diode with a reflective layer which is applied to an epitaxial structure of the laser diode where initially the laser diode is placed in a coating device. The laser diode is then coated with additional layers of insulation, metal and a protective layer. A rapid thermal annealing process is applied to the layered laser diode. The insulation layer, metal layer and protective layer form a reflective structure on one side of the laser diode.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 31, 2022
    Inventors: MENG-HSIN CHEN, HSUEH-HUI YANG, CHUN-LING CHANG
  • Patent number: 11105726
    Abstract: Calibrated particle analysis apparatus and method are provided. In the calibrated particle analysis apparatus, a gas exchange device and several flow controllers are disposed in front of a particle analyzer. Therefore, when the calibrated particle analysis apparatus is used, gases of a sample can be exchanged with a carrier gas suggested to be used with the particle analyzer. Hence, the accuracy of analyzing the particles can be increased, and possible hazards from dangerous or toxic materials can be avoided.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: August 31, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Ling Chang, I-Hsiang Hsu, Fang-Hsin Lin, Yi-Hung Liu
  • Publication number: 20190219493
    Abstract: Calibrated particle analysis apparatus and method are provided. In the calibrated particle analysis apparatus, a gas exchange device and several flow controllers are disposed in front of a particle analyzer. Therefore, when the calibrated particle analysis apparatus is used, gases of a sample can be exchanged with a carrier gas suggested to be used with the particle analyzer. Hence, the accuracy of analyzing the particles can be increased, and possible hazards from dangerous or toxic materials can be avoided.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 18, 2019
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Ling Chang, I-Hsiang Hsu, Fang-Hsin Lin, Yi-Hung Liu
  • Patent number: 10170291
    Abstract: An apparatus for on-line monitoring particle contamination in special gas includes a single particle inductively coupled plasma mass spectrometry (sp-ICPMS) and a gas exchange device (GED). The gas exchange device is coupled to the sp-ICPMS. The gas exchange device includes a corrosion resistant outer tube and a polytetrafluoroethylene (PTFE) inner tube. A gap is formed between the corrosion resistant outer tube and the PTFE inner tube. The length of the PTFE inner tube is 1 meter or more. The argon gas flows in the gap, and the special gas flow in the PTFE inner tube.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: January 1, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: I-Hsiang Hsu, Fang-Hsin Lin, Yi-Hung Liu, Chun-Ling Chang
  • Publication number: 20120199177
    Abstract: The present disclosure provides a solar cell device. The device has solar cells having multijunction. A supplemental current source is connected with one of the solar cells having a smallest current in the device. Thus, through providing required current by the supplemental current source, usage performance of the device is enhanced.
    Type: Application
    Filed: February 9, 2011
    Publication date: August 9, 2012
    Applicant: ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Chih-kang Chao, Chih-Hung Wu, Ying-Ru Chen, Min-De Yang, Keng-Shen Liu, Chun-Ling Chang
  • Patent number: 7928009
    Abstract: A method for making semiconductor electrodes includes provided a wafer. The wafer includes at least one conductive unit, a plurality of first connective units connected to the conductive unit, a plurality of first metal layers connected to the first connective units and a plurality of second connective units connected to the first metal layers. Photo-resist is provided on the first and second connective units. A second metal layer is provided on each of the first metal layers via using an electroplating device. The wafer is cut through the photo-resist, thus forming semiconductor electrodes.
    Type: Grant
    Filed: April 23, 2008
    Date of Patent: April 19, 2011
    Assignee: Atomic Energy Council-Institute of Nuclear Energy Research
    Inventors: Chih-Hung Wu, Keng-Shen Liu, Chun-Ling Chang, Ying-Ru Chen
  • Publication number: 20100215866
    Abstract: There is disclosed a method for coating an electrode on a wafer. Firstly, there is provided a wafer. Secondly, a metal area is defined in an upper surface of the wafer. Thirdly, the metal area is roughened via etching. Finally, an electrode is coated on the metal area via deposition.
    Type: Application
    Filed: November 29, 2007
    Publication date: August 26, 2010
    Applicant: ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Chih-Hung Wu, Chih-Kang Chao, Shen-Liu Kenh, Chun-Ling Chang