Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different surface areas is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.

Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.

Abstract: A method for manufacturing an integrally-formed alloy structure having a brazing surface includes the following steps. Firstly, a magnesium-containing alloy is provided. Next, the magnesium-containing alloy is heat treated to obtain a vacuum heat-treated alloy structure. Then, the top surface of the vacuum heat-treated alloy structure is reduced to expose the brazing surface. Finally, the integrally-formed alloy structure having the brazing surface is formed.

Abstract: A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.

Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a first polymer composite layer, a second polymer composite layer, a first ceramic layer, a second ceramic layer, and a heat dissipation layer. The first ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the first layer of chips, and the second ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the second layer of chips.

Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.

Abstract: An alloy structure having a low magnesium content surface includes an alloy layer having an original magnesium content and a magnesium-deficient layer formed on the alloy layer, and the magnesium-deficient layer has a low magnesium content surface.

Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a first polymer composite layer, a second polymer composite layer, a first ceramic layer, a second ceramic layer, and a heat dissipation layer. The first ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the first layer of chips, and the second ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the second layer of chips.

Abstract: A copper-alloy heat-dissipation structure with a milled surface includes a heat-dissipation main body. The heat-dissipation main body has a first milled surface and a second milled surface that are opposite to each other, where heat-dissipation fins are formed on the first milled surface, and the maximum height roughness Rz of the second milled surface ranges from 1.5 ?m to 5.4 ?m.

Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.

Abstract: An IGBT module with an improved heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a polymer composite layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on the heat dissipation layer. The polymer composite layer is disposed on the thermal spray layer. The thick copper layer is disposed on the polymer composite layer. The bonding layer is disposed on the thick copper layer. The layer of IGBT chips is disposed on the bonding layer.

Abstract: An IGBT module with an improved heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a polymer composite layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on the heat dissipation layer. The polymer composite layer is disposed on the thermal spray layer. The thick copper layer is disposed on the polymer composite layer. The bonding layer is disposed on the thick copper layer. The layer of IGBT chips is disposed on the bonding layer.

Abstract: An IGBT heat dissipation structure includes a layer of IGBT chips, a bonding layer, a cold spray layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on top of the heat dissipation layer. The cold spray layer is disposed on top of the thermal spray layer. The bonding layer is disposed on top of the cold spray layer, and the layer of IGBT chips is disposed on top of the bonding layer.

Abstract: An IGBT heat dissipation structure includes a layer of IGBT chips, a bonding layer, a cold spray layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on top of the heat dissipation layer. The cold spray layer is disposed on top of the thermal spray layer. The bonding layer is disposed on top of the cold spray layer, and the layer of IGBT chips is disposed on top of the bonding layer.

Abstract: A heat dissipating device includes a thermal conductive substance, a plurality of heat-radiating protrusions and a plurality of turbulence-generating structures. The thermal conductive substance has a first surface and a second surface opposite to the first surface. The heat-radiating protrusions are integrally formed with the thermal conductive substance on the first surface. At least one of the turbulence-generating structures is formed on the first surface of the thermal conductive substance in concaved manner, and arranged around a bottom periphery of the heat-radiating protrusions, so as to obstruct a development of a boundary layer around the bottom of the heat-radiating protrusions.

Abstract: A heat dissipating device includes a thermal conductive substance, a plurality of heat-radiating protrusions and a plurality of turbulence-generating structures. The thermal conductive substance has a first surface and a second surface opposite to the first surface. The heat-radiating protrusions are integrally formed with the thermal conductive substance on the first surface. At least one of the turbulence-generating structures is formed on the first surface of the thermal conductive substance in concaved manner, and arranged around a bottom periphery of the heat-radiating protrusions, so as to obstruct a development of a boundary layer around the bottom of the heat-radiating protrusions.