Abstract: A substrate treatment apparatus according to an aspect of the present invention includes: a support plate that supports a substrate and is provided with a heater member for heating the substrate; and a cooling unit for forcedly cooling the support plate, wherein the cooling unit includes: a cooling housing to provide a cooling space; a plurality of gas feed nozzles that is arranged in the cooling housing and supplies cooling gas toward the heater member; and a plurality of gas feed lines that is directly connected to the gas feed nozzles and supplies the cooling gas transferred from the outside to the gas feed nozzles.

Abstract: Disclosed are a plastic micro packer for repairing cracks of structure and a method for repairing middle or low pressure cracks using the plastic micro packer: The micro packer is connected to a hole formed in a crack to inject, repairing solution into the crack of a concrete structure, and includes: a hollow rubber sleeve having a screw portion formed on the inner surface thereof; a hollow packer body having a screw coupling portion screwed with the screw portion and a nozzle portion connected to a repairing solution injector; and a cove; member connected to the nozzle portion to prevent leakage of repairing solution. The screw portion of the rubber sleeve has a wide top and a narrow bottom, and thereby, is closely contacted to the hole while the lower portion of the screw portion is expanded in a radial direction when the screw: coupling portion is screwed with the screw portion.