Patents by Inventor Chun-Min Chuang

Chun-Min Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System for providing IC bonding diagram via network
    Patent number: 6795746
    Abstract: The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to store lead frame information. A job database is coupled to the processing unit to store information forwarded by a potential client, wherein the job database includes buyer satisfaction data provided by said user. A bonding diagram generator is coupled to the processing unit to generate a layout of bonding diagram in accordance with the information provided by the user. A forwarding module is responsive to the bonding diagram generator to forward the layout of bonding diagram to the user.
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: September 21, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun-Min Chuang, I-Liang Lin, Chun-Kuang Lin, Yung-I Yeh
  • Thermal data automatic service system
    Patent number: 6751781
    Abstract: An internet thermal data analysis system comprises a processing unit to process an information sent by a user via a network, wherein the information comprises a package information. A job database is coupled to the processing unit to store the package information sent by the user, a thermal analysis module is coupled to the processing unit to analysis the information sent by the user. A thermal data report generator is coupled to the processing unit to generate a thermal data simulation in accordance with the information sent by the user. A forwarding module is responsive to the thermal data report generator to forward the thermal data simulation to the user.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: June 15, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: I-Liang Lin, Chun-Min Chuang, Yung-I Yeh
  • Thermal data automatic service system
    Publication number: 20030140321
    Abstract: An internet thermal data analysis system comprises a processing unit to process an information sent by a user via a network, wherein the information comprises a package information. A job database is coupled to the processing unit to store the package information sent by the user, a thermal analysis module is coupled to the processing unit to analysis the information sent by the user. A thermal data report generator is coupled to the processing unit to generate a thermal data simulation in accordance with the information sent by the user. A forwarding module is responsive to the thermal data report generator to forward the thermal data simulation to the user.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: I-Liang Lin, Chun-Min Chuang, Yung-I Yeh
  • System for providing IC bonding diagram via network
    Publication number: 20020188371
    Abstract: The internet bonding diagram system comprises a processing unit to process the information send by a user via a network. A blank lead frame/substrate database is coupled to the processing unit to store lead frame information. A job database is coupled to the processing unit to store information forwarded by a potential client, wherein the job database includes buyer satisfaction data provided by said user. A bonding diagram generator is coupled to the processing unit to generate a layout of bonding diagram in accordance with the information provided by the user. A forwarding module is responsive to the bonding diagram generator to forward the layout of bonding diagram to the user.
    Type: Application
    Filed: March 22, 2001
    Publication date: December 12, 2002
    Inventors: Chun-Min Chuang, I-Liang Lin, Chun-Kuang Lin, Yung-I Yeh