Patents by Inventor Chun-Min He

Chun-Min He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240076407
    Abstract: It is demonstrated herein that inhibitors of immune checkpoints and CHI3L1 are synergistic. Accordingly, described herein are methods and compositions relating to combinatorial therapies for cancer, e.g., comprising an inhibitor of CHI3L1; and an inhibitor of an immune checkpoint protein. In some embodiments, the CHI3L1 inhibitor can be an antibody or antibody reagent as described herein.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 7, 2024
    Inventors: Jack A. ELIAS, Chun Geun LEE, Chuan Hua HE, Bing MA, Suchitra Kamle, Chang-Min LEE
  • Patent number: 11833589
    Abstract: Method of forming a switch bracket of a hinge for a two-body information handling system, including mixing metal powders and binders to form a blended mix; pelletizing the blended mix to form feedstock; injecting the feedstock into a switch bracket mold cavity to form a first article of the switch bracket; de-binding the first article to remove the binders from the first article forming a second article of the switch bracket; and sintering the second article by shrinking the second article to form the switch bracket.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: December 5, 2023
    Assignee: Dell Products L.P.
    Inventors: Chih-Chieh Chang, Wei-Yi Li, Chun-Min He
  • Patent number: 11832393
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: November 28, 2023
    Assignee: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Publication number: 20230286044
    Abstract: Method of forming a switch bracket of a hinge for a two-body information handling system, including mixing metal powders and binders to form a blended mix; pelletizing the blended mix to form feedstock; injecting the feedstock into a switch bracket mold cavity to form a first article of the switch bracket; de-binding the first article to remove the binders from the first article forming a second article of the switch bracket; and sintering the second article by shrinking the second article to form the switch bracket.
    Type: Application
    Filed: March 11, 2022
    Publication date: September 14, 2023
    Inventors: CHIH-CHIEH CHANG, WEI-YI LI, CHUN-MIN HE
  • Patent number: 11757216
    Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: September 12, 2023
    Assignee: Dell Products L.P.
    Inventors: Fong-An Kan, Ming Chu Kuo, Yi-Chu Hsieh, Chun-Min He
  • Publication number: 20230253723
    Abstract: In one embodiment, a clip pin of a secondary printed circuit board removably coupled to a primary printed circuit board and a backplate in an information handling system includes: an open end configured to receive a guide pin of the backplate within a clip pin hole of the primary printed circuit board, the guide pin configured to removably couple to the clip pin via the open end; a bulbous portion disposed proximate to the open end, the guide pin causing the bulbous portion to apply an outward force on an inner wall of the clip pin hole; and a plurality of signal pins disposed within the bulbous portion, the outward force causing the plurality of signal pins to communicably couple to the inner wall to transmit a signal from the secondary printed circuit board to the primary printed circuit board.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Inventors: Fong-An Kan, Ming Chu Kuo, Yi-Chu Hsieh, Chun-Min He
  • Publication number: 20220322591
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Application
    Filed: June 21, 2022
    Publication date: October 6, 2022
    Applicant: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Patent number: 11432447
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: August 30, 2022
    Assignee: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Patent number: 11294845
    Abstract: An information handling system couples a solid state drive assembly having plural solid state drives to a motherboard with a single M.2 connector coupled to the motherboard by interfacing the plural solid state drives with an adapter circuit board having an M.2 interface defined at one end to insert into the motherboard connector and having plural M.2 connectors to interface with the plural solid state drives in a desired configuration, such as a stacked vertical configuration that more efficiently uses motherboard footprint to include persistent memory.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: April 5, 2022
    Assignee: Dell Products L.P.
    Inventors: Yao-Fu Huang, Chun Min He, Yi-Ning Shen
  • Publication number: 20210326291
    Abstract: An information handling system couples a solid state drive assembly having plural solid state drives to a motherboard with a single M.2 connector coupled to the motherboard by interfacing the plural solid state drives with an adapter circuit board having an M.2 interface defined at one end to insert into the motherboard connector and having plural M.2 connectors to interface with the plural solid state drives in a desired configuration, such as a stacked vertical configuration that more efficiently uses motherboard footprint to include persistent memory.
    Type: Application
    Filed: April 21, 2020
    Publication date: October 21, 2021
    Applicant: Dell Products L.P.
    Inventors: Yao-Fu Huang, Chun Min He, Yi-Ning Shen
  • Publication number: 20200390012
    Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.
    Type: Application
    Filed: June 5, 2019
    Publication date: December 10, 2020
    Applicant: Dell Products L.P.
    Inventors: Yu-Lin Tsai, Chia-Hsien Lu, Chun-Min He, RungLung Lin, Chin-Chung Wu
  • Publication number: 20110074835
    Abstract: This invention provides a display module, an electronic device using the same, and a display method thereof. The display module used in the electronic device is used for displaying a status of an electronic element of the electronic device. The display module includes a light guiding unit, a plurality of light emitting units, and a control unit. The light guiding unit has a light incident surface and a light output surface. The light emitting units are disposed adjacent to the light incident surface. The control unit is coupled with the light emitting units and selectively uses one of a plurality of current combinations to control the light emitting units. Light emitted from the light emitting units enters into the light guiding unit from the light incident surface and passes through the light output surface to present a continuous display effect.
    Type: Application
    Filed: September 13, 2010
    Publication date: March 31, 2011
    Inventors: Chun-Min He, Yu-Te Lin, Sin-Shun Wu
  • Patent number: 7471510
    Abstract: The invention relates to an apparatus for fastening a data storage device, which is used to fasten a data storage device or module with a plurality of fixing holes. The apparatus for fastening a data storage device of the invention includes a housing, a driving plate, at least one lateral fastening plate, and an elastic member. As the driving plate moves, the lateral fastening plate is pushed to move laterally, whereby the locating pins move into or out of the locating holes on the sidewalls of housing to remove or fasten the data storage device. The data storage device can be fastened to a housing of a computer without screws, and a user can operate more conveniently.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: December 30, 2008
    Assignee: Asustek Computer Inc.
    Inventor: Chun-Min He
  • Publication number: 20080174950
    Abstract: The invention relates to an apparatus for fastening a data storage device, which is used to fasten a data storage device or module with a plurality of fixing holes. The apparatus for fastening a data storage device of the invention includes a housing, a driving plate, at least one lateral fastening plate, and an elastic member. As the driving plate moves, the lateral fastening plate is pushed to move laterally, whereby the locating pins move into or out of the locating holes on the sidewalls of housing to remove or fasten the data storage device. The data storage device can be fastened to a housing of a computer without screws, and a user can operate more conveniently.
    Type: Application
    Filed: December 19, 2007
    Publication date: July 24, 2008
    Applicant: ASUSTEK COMPUTER INC.
    Inventor: Chun-Min He