Abstract: A zone heater assembly of a reflow solder tool includes a gas deflector having a single-layer structure. The single-layer structure may include one or more gas-permeating patterns through which a process gas is to flow from one or more gas outlets to a gas exhaust of the zone heater assembly. The one or more gas-permeating patterns in the single-layer structure promote uniformity of gas flow through the gas exhaust and into a heating zone of the reflow solder tool. The uniformity of the gas flow of the process gas enables convection heat provided by the process gas to be uniformly distributed across the heating zone. In this way, the gas deflector described herein may decrease hot spots and/or cold spots in the heating zone, which enables greater flexibility in placement of semiconductor package substrates on a conveyor device of the reflow solder tool.

Abstract: A detection element of biological subcutaneous features and a wearable device thereof are provided. The element for detecting biological subcutaneous features has a substrate, a light-detecting semiconductor chip, a grid structure, and a cover. The light-detecting semiconductor chip is located on the substrate for detecting red light or near-infrared light signals. The grid structure including a plurality of opaque light-absorbing blocking walls is located on the light-detecting semiconductor chip for blocking side light and increasing the proportion of near-vertical incident light. The cover is located on the grid structure and serves as a protection lid. The wearable device for detecting biological subcutaneous features has more than one light source of red light or near-infrared light and a plurality of detection elements. The arrangement of the opaque light-absorbing blocking walls that are parallel to each other are substantially parallel to the light-emitting directions of the light source.

Abstract: A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.

Abstract: Semiconductor die assemblies with sidewall protection, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die with a low-k dielectric layer and a stack of semiconductor dies attached to the interface die. The semiconductor die assembly also includes a molding structure that protects sidewalls of the interface die and sidewalls of the semiconductor dies. In some embodiments, the semiconductor die assembly includes a passivation layer attached to the interface die opposite to the stack of semiconductor dies. Further, the passivation layer may include a sidewall surface coplanar with an outer sidewall surface of the molding structure. The passivation layer may include a ledge underneath the molding structure, which is uncovered by the interface die. The semiconductor die assembly may include a NCF material at the sidewalls of the stack of semiconductor dies, where the molding structure surrounds the NCF material.

Abstract: A semiconductor package structure includes a first package including a bonding region and a periphery region surrounding the bonding region, at least one insulating structure disposed in the bonding region of the first package, a second package disposed over the first package and the insulating structure in the bonding region, and a plurality of connectors disposed between the first package and the second package. The plurality of connectors provide electrical connection between the first package and the second package. Further, the insulating structure penetrates the first package and is spaced apart from the plurality of connectors.

Abstract: A lighting device is disclosed, including an LED die, a light-transmissive encapsulant and a light-transmissive wall. The light-transmissive encapsulant covers the light-emitting side surfaces and the top surface, and the light-transmissive wall surrounds the light-transmissive encapsulant and covers the side surfaces of the light-transmissive encapsulant. Furthermore, the refractive index of the light-transmissive encapsulant is not greater than the refractive index of the light-transmissive wall. A lighting module is further disclosed, including a circuit substrate and the lighting devices, as described above, which are disposed on the circuit substrate. Therefore, when lights generated from the LED die are transmitted into the light-transmissive wall from the light-transmissive encapsulant, the lights will be deflected towards the lateral direction, thereby increasing the viewing angle of the lighting device.

Abstract: A semiconductor package structure includes a first package including a bonding region and a periphery region surrounding the bonding region, at least one insulating structure disposed in the bonding region of the first package, a second package disposed over the first package and the insulating structure in the bonding region, and a plurality of connectors disposed between the first package and the second package. The plurality of connectors provide electrical connection between the first package and the second package. Further, the insulating structure penetrates the first package and is spaced apart from the plurality of connectors.

Abstract: A light emitting diode (LED) device and a method of manufacturing the LED device aforementioned are provided. The LED device (400) includes a LED chip (430), an encapsulant (440) and a ring-shape barrier (450?). The LED chip has a first surface and a reflection surface, and the encapsulant covers the LED chip. Wherein the reflection surface (450a) is inclined with respect to a side surface (430b) of the LED chip. A light output angle can be effectively adjusted, and the needs to re-design lenses when market demand changes may be reduced.

Abstract: A light emitting device including a first work circuit and a second work circuit is provided. The first work circuit includes a first LED chip and a first bonding adhesive. The first LED chip and the first bonding adhesive are electrically connected in series. The second work circuit includes a second LED chip. When an operation current of the first work circuit and an operation current of the second work circuit are the same, the first work circuit has a first voltage VW1 and the second work circuit has a second voltage VW2, wherein VW1?VW2.

Abstract: A solar cell with high-reflectivity region and narrow etch mark is disclosed. The solar cell includes a semiconductor substrate having a first surface and a second surface, a low-reflectivity region in and on the semiconductor substrate, and an annular etch mark disposed on the first surface and surrounding the low-reflectivity region. The etch mark is located along the perimeter of the first surface and has an average width that is not greater than 2 mm. The second surface is a surface with high reflectivity.