Abstract: A microelectromechanical system (MEMS) device is provided. In one embodiment, the MEMS device includes a transparent substrate, and a plurality of interferometric modulators. The plurality of interferometric modulators includes an optical stack coupled to the transparent substrate, in which the optical stack includes a first light absorbing area. The plurality of interferometric modulators further includes a reflective layer over the optical stack, and one or more posts to support the reflective layer. Each of the one or more posts includes a second light absorbing area integrated in the post.

Abstract: A microelectromechanical system (MEMS) is provided. In one embodiment, the MEMS includes a transparent substrate, and a plurality of interferometric modulators. The plurality of interferometric modulators includes an optical stack coupled to the transparent substrate, in which the optical stack includes a first light absorbing area. The plurality of interferometric modulators further includes a reflective layer over the optical stack, and one or more posts to support the reflective layer. Each of the one or more posts includes a second light absorbing area integrated in the post.

Abstract: A microelectromechanical system (MEMS) is provided. In one embodiment, the MEMS includes a transparent substrate, and a plurality of interferometric modulators. The plurality of interferometric modulators includes an optical stack coupled to the transparent substrate, in which the optical stack includes a first light absorbing area. The plurality of interferometric modulators further includes a reflective layer over the optical stack, and one or more posts to support the reflective layer. Each of the one or more posts includes a second light absorbing area integrated in the post.

Abstract: Systems and methods for encapsulation of chemically amplified resist template for low pH electroplating are disclosed. In a first method embodiment, a resist template structure is formed on a wafer. Substantially all surfaces of the resist template structure are encapsulated to form an encapsulated structure. Magnetic materials are plated onto the encapsulated structure.

Abstract: In one illustrative example, a method of making a read sensor of a magnetic head involves forming a barrier structure which surrounds a central mask formed over a plurality of read sensor layers; etching the read sensor layers to form the read sensor below the mask; and depositing, with use of the mask and the barrier structure, hard bias and lead layers to form around the read sensor. The barrier structure may be formed by, for example, depositing one or more barrier structure layers over the read sensor layers and performing a photolithography process. The barrier structure physically blocks materials being deposited at relatively low angles (e.g. angles at or below 71 degrees) so as to reduce their formation far underneath the mask (e.g. when using a bridged mask), which could otherwise form an electrical short, and/or to improve the symmetry of the deposited materials around the read sensor.

Abstract: In one illustrative example, a method of making a read sensor of a magnetic head involves forming a barrier structure which surrounds a central mask formed over a plurality of read sensor layers; etching the read sensor layers to form the read sensor below the mask; and depositing, with use of the mask and the barrier structure, hard bias and lead layers to form around the read sensor. The barrier structure may be formed by, for example, depositing one or more barrier structure layers over the read sensor layers and performing a photolithography process. The barrier structure physically blocks materials being deposited at relatively low angles (e.g. angles at or below 71 degrees) so as to reduce their formation far underneath the mask (e.g. when using a bridged mask), which could otherwise form an electrical short, and/or to improve the symmetry of the deposited materials around the read sensor.