Abstract: A semiconductor device may include a semiconductor fin, a source/drain region extending from the semiconductor fin, and a gate electrode over the semiconductor fin. The semiconductor fin may include a first well and a channel region over the first well. The first well may have a first dopant at a first dopant concentration and the channel region may have the first dopant at a second dopant concentration smaller than the first dopant concentration. The first dopant concentration may be in range from 1017 atoms/cm3 to 1019 atoms/cm3.

Abstract: A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.

Abstract: The present disclosure provides a toughened resin composition, which includes: (A) a toughened and modified compound, which includes a styrene maleic anhydride compound, an anhydride grafted olefin polymer, and a diisocyanate compound; (B) a thermosetting polymer; and (C) a toughening resin; wherein, in the toughened and modified compound, the diisocyanate compound forms a polyimide bond with the styrene maleic anhydride compound and the anhydride grafted olefin polymer, respectively. The present disclosure has high toughness and excellent mechanical properties; thus, it may have a wide range of applications in the fields of electronics, aerospace and the like.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.

Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.

Abstract: A shielding film comprises multiple layers including one or more of a structured adhesive layer, an electrically conductive layer, an electrically insulative thermally conductive layer, and an electrically conductive adhesive layer. The electrically conductive shielding layer extends laterally beyond the structured adhesive layer. The electrically insulative thermally conductive layer is disposed between the electrically conductive shielding layer and the structured adhesive layer and is coextensive with the structured adhesive layer. The electrically conductive adhesive layer is disposed between the electrically conductive shielding layer and the thermally conductive layer and is coextensive with the electrically conductive shielding layer.

Abstract: A transparent multilayer assembly, including a transparent organic polymeric flexible substrate, a transparent conductive layer on the first major surface of the substrate and an antireflective layer on the second major surface of the substrate.

Abstract: A multi-frequency antenna (1) includes a grounding portion (1) extending along a transversal direction; a radiating arm (11) extending along a transversal direction and disposed above the grounding portion; a connecting arm (12) connected to the grounding portion and the radiating arm; a capacitor (13) connected to the radiating portion and the connecting arm; and a cable (15) having an inner conductor connected to the connecting arm and an outer conductor connected to the grounding portion.

Abstract: A multi-band antenna includes a grounding element, a first antenna working on a wireless wide area network, a second antenna working on a wireless local area network, and a third antenna operating on a wireless local area network. The first antenna includes a first conductive piece, a first radiating element extending from the first conductive arm, a coupling radiating element and a feeding line. The second antenna includes a second conductive piece, a first resonant element extending from the second conductive piece, a second resonant element and a feeding line. The third antenna includes a third conductive element, a first conductive arm extending from the third conductive element and a second conductive arm and a feeding line. The first conductive piece is connected to the second conductive piece.

Abstract: A multi-band antenna (1), comprising a grounding element (10) extending horizontally along a longitudinal direction, comprising a side edge (101) with a connecting point (102) and a grounding point (103) distanced from the connecting point by a length; a radiating element (11) disposed at an upper level parallel to the grounding element and defining a first end and a second end, and operating in a first frequency band; a connecting element (12) located between the radiating element and the grounding element, comprising a first portion (121) connecting to the first end of the radiating element and a second portion (122) linking to said connecting point of the grounding element; a parasitic element (13) extending from the second portion of the connecting element towards the second end of the radiating element along the longitudinal direction, and operating in a second frequency band; a feeding point (141) disposed on the second portion of the connecting element and under the parasitic element; and a feeding lin

Abstract: A multi-band antenna (1) includes a grounding element (10) extending along a horizontal direction and including a side edge (101) with a connecting point (102) and a grounding point (103) distanced from the connecting point by a length, a first radiating element (11) disposed above and parallel to the grounding element (10), a second radiating element (12) apart from the first radiating element and extending upwardly from the side edge of the grounding portion, a connecting element (13) located between the first radiating element and the grounding element, a feeding point (134) disposed on the connecting element (13), and a feeding line (14) including an inner conductor (141) connected to the feeding point and an outer conductor (142) connected to the grounding point. The first radiating element operates in a first frequency band. The second radiating element defines a L-shaped configuration in a side view and operates in a second frequency band.

Abstract: A multi-band antenna includes a grounding portion (300), a number of radiating members and a short-circuit portion (200). The short-circuit portion comprises a first short-circuit piece (210) connecting with the grounding portion and located in a first plane, a third short-circuit piece (230) located in a third plane and connecting with the radiating members, and a second short-circuit piece (220) connecting the first short-circuit piece with the third short-circuit piece and located in a second plane, with the first and third short-circuit pieces disposed on the same side of the second short-circuit piece. The radiating members comprises a first radiating member (110, 140) in the third plane and a second radiating member (120, 140) extending towards the first plane.

Abstract: A monopole antenna includes a base board with a first side and a second side, a radiating element, a grounding element and a feeding line. The radiating element and the grounding element are located on the first side of the base board. The grounding element is two times longer than the radiating element. The feeding line includes an inner conductor connected to the radiating element and an outer conductor connected to the grounding element.

Abstract: A multi-band antenna includes a grounding element, a first antenna working on a wireless wide area network, a second antenna working on a wireless local area network, and a third antenna operating on a wireless local area network. The first antenna includes a first conductive piece, a first radiating element extending from the first conductive arm, a coupling radiating element and a feeding line. The second antenna includes a second conductive piece, a first resonant element extending from the second conductive piece, a second resonant element and a feeding line. The third antenna includes a third conductive element, a first conductive arm extending from the third conductive element and a second conductive arm and a feeding line. The first conductive piece is connected to the second conductive piece.

Abstract: A monopole antenna includes a base board having a first side and a second side, a grounding element attached on the first side of the base board, a coupling element attached on the first side of the base board and being spaced apart from the grounding element, and a radiating element connected to the coupling element and exposed out the base board.

Abstract: A multi-band antenna includes a grounding element having a first side, a radiating element separated form the first side of the grounding element, and a connecting element. The connecting element connects the grounding element to the radiating element and includes a first end slantwise extending from the grounding to form a first angle except a right angle between the connecting element and the grounding element.

Abstract: A multi-frequency antenna (1) includes a grounding portion (1) extending along a transversal direction; a radiating arm (11) extending along a transversal direction and disposed above the grounding portion; a connecting arm (12) connected to the grounding portion and the radiating arm; a capacitor (13) connected to the radiating portion and the connecting arm; and a cable (15) having an inner conductor connected to the connecting arm and an outer conductor connected to the grounding portion.