Abstract: A system and a method for parameter optimization with adaptive search space and a user interface using the same are provided. The system includes a data acquisition unit, an adaptive adjustment unit and an optimization search unit. The data acquisition unit obtains a set of executed values of several operating parameters and a target parameter. The adaptive adjustment unit includes a parameter space transformer and a search range definer. The parameter space transformer performs a space transformation on a parameter space of the operating parameters according to the executed values. The search range definer defines a parameter search range in a transformed parameter space based on the sets of the executed values. The optimization search unit takes the parameter search range as a limiting condition and takes optimizing the target parameter as a target to search for a set of recommended values of the operating parameters.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A semiconductor structure is provided and includes a first gate structure, a second gate structure, and at least one local interconnect that extend continuously across a non-active region from a first active region to a second active region. The semiconductor structure further includes a first separation spacer disposed on the first gate structure and first vias on the first gate structure. The first vias are arranged on opposite sides of the first separation spacer are isolated from each other and apart from the first separation spacer by different distances.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: The invention comprises a light emitting diode chip and a package substrate. The light emitting diode chip is provided with a semiconductor epitaxial structure, a lateral extending interface structure, a chip conductive structure, an N-type electrode located above the semiconductor epitaxial structure and a P-type bypass detection electrode located on the lateral extending interface structure. The chip conductive structure is provided with a P-type main electrode located on a lower side. The package substrate comprises a plurality of electrode contacts through which the N-type electrode, the P-type bypass detection electrode and the P-type main electrode are connected, and a process quality of a alternative substrate adhesive layer in one of the semiconductor epitaxial structure and the chip conductive structure and a chip-substrate bonding adhesive layer between the P-type main electrode and the package substrate is evaluated by detecting electrical characteristics.

Abstract: A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: The invention comprises a light emitting diode chip and a package substrate. The light emitting diode chip is provided with a semiconductor epitaxial structure, a lateral extending interface structure, a chip conductive structure, an N-type electrode located above the semiconductor epitaxial structure and a P-type bypass detection electrode located on the lateral extending interface structure. The chip conductive structure is provided with a P-type main electrode located on a lower side. The package substrate comprises a plurality of electrode contacts through which the N-type electrode, the P-type bypass detection electrode and the P-type main electrode are connected, and a process quality of a alternative substrate adhesive layer in one of the semiconductor epitaxial structure and the chip conductive structure and a chip-substrate bonding adhesive layer between the P-type main electrode and the package substrate is evaluated by detecting electrical characteristics.

Abstract: A package substrate comprises first, second and third electrical test contacts, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane on two sides. The side edge of the upper element plane is provided with first and second electrodes of the main element and first and second electrodes of the secondary element. The main element of LED chip is electrically connected between the first and second electrodes of the main element, a parallel circuit secondary element is electrically connected between the first and second electrodes of the secondary element. The electrical characteristics of the main element of LED chip and the parallel circuit secondary element are measured through the first, second, and third electrical test contacts when electrically connected.

Abstract: A flip-chip light-emitting diode structure capable of emitting trichromatic spectrum and a manufacturing method thereof, including a blue-green light layer with a light-stimulated green light-emitting structure and an electron-stimulated blue light-emitting structure, a bonding layer and a red light layer with a light-stimulated red light-emitting structure. The manufacturing method uses a sapphire bonding layer as the bonding layer, and forming the blue-green light layer and the red light layer by growing epitaxy on two sides of the sapphire bonding layer; or, after growing the blue-green light layer and the red light layer by epitaxy respectively, uses the bonding layer to connect.

Abstract: A surface light source LED device includes a circuit board, at least one power input and at least two LED bar elements, the at least two LED bar elements are arranged in a staggered manner, and each of the LED bar elements includes a plurality of LED bars arranged linearly on the circuit board. Each of the LED bars has a straight strip structure and has a plurality of LED dies of the same type provided inside. The plurality of LED dies is arranged linearly at equal intervals.

Abstract: A surface light source LED device includes a circuit board, at least one power input and at least two LED bar elements, the at least two LED bar elements are arranged in a staggered manner, and each of the LED bar elements includes a plurality of LED bars arranged linearly on the circuit board. Each of the LED bars has a straight strip structure and has a plurality of LED dies of the same type provided inside. The plurality of LED dies is arranged linearly at equal intervals.

Abstract: An automatic cleaning and spraying device includes a mixer connected in series with a gas pipeline of the spraying device. A cleaning liquid (such as a solvent) introduced by the mixer is guided to a controlled cleaning liquid valve installed at the front end of the cleaning liquid pipeline, so that the cleaning liquid can be mixed with a gas, and then the mixed liquid and gas flow towards a spray valve and an atomizer. During a normal spray operation, only the pressurized gas valve and spray valve are turned on for the actual spray operation. After a specific period of operation, the cleaning liquid valve may be controlled automatically to input the cleaning liquid to the mixer and then to the spray valve and atomizer in order to clean the surrounding and inner wall of the spray outlet and achieve the effect of cleaning the spraying device automatically.

Abstract: A liquid mixture supplying device is provided for mixing a liquid mixture of a liquid and a powder and supplying the liquid mixture to a spray valve for spraying. The device has a structural design consisting of a containing vessel, a driving device, a dip tube and a scraper. The containing vessel is provided for storing the liquid mixture, and the driving device drives the containing vessel to rotate while a scraper disposed on a side of a dip tube is being used for distributing the liquid mixture. The containing vessel is installed in a tiltable external cavity, and a flow barrier is formed on an inner wall of the containing vessel, and the driving device drives the containing vessel to move by a magnetic force or a transmission shaft, so as to achieve the effect of uniform mixing.

Abstract: The present invention is directed to a light emitting device that includes an elongated package defining a plurality of recesses and a plurality of light emitting units to be disposed in the recesses. The package includes at least three electrodes and a molded body. At least one light emitting unit is disposed in each recess. The molded body has at least one dividing portion separating two adjacent recesses. The dividing portion partially covers the electrode shared by the light emitting diodes respectively disposed in two adjacent recesses.

Abstract: An image processing method is provided. The image processing method includes the following steps: detecting an input sequence of image frames captured using an image capturing device to generate a detection result; referring to the detection result to selectively perform frame interpolation on the input sequence of image frames to generate a to-be-encoded sequence of image frames; and encoding the to-be-encoded sequence of image frames to generate an encoded video signal.

Abstract: An image processing method is provided. The image processing method includes the following steps: detecting an input sequence of image frames captured using an image capturing device to generate a detection result; referring to the detection result to selectively perform frame interpolation on the input sequence of image frames to generate a to-be-encoded sequence of image frames; and encoding the to-be-encoded sequence of image frames to generate an encoded video signal.

Abstract: The present invention discloses a spray coating system with constant pressure and stirring function. The spray coating system comprises a stirring barrel containing a mixture material, a stirrer stirring the mixture material, a control valve used for controlling a spray rate of the packaging material, a nozzle connected to the control valve for spouting the packaging material in spray form, a circulation pipe line connected between the stirring barrel and the control valve and a peristaltic pump mounted at the circulation pipe line. Thereby, the spray coating system is applied to the dispensing process of the LED to stir the packaging material and spout the packaging material in spray form, and can transmit the packaging material remained back to the stirring barrel by the peristaltic pump for avoiding the extraneous entering to the packaging material and blocking the nozzle to advance the spray coating quality and efficiency.

Abstract: The present invention discloses a feed system with a constant pressure. The feed system comprises a feed container which has a depressurize port mounted on its top, a intake port mounted at its side, and a feed port mounted on its bottom, contains a liquid material being a medicine or a liquid glue mixture; a intake structure which comprises a throttle pipeline and a throttle valve; a opening controller which connects to the throttle valve and the pressure sensor, for controlling the intake structure. The advantage of the feed system is to control the feed flow rate so as to maintain a constant during the feed process, particularly in the hybrid feed system. By steadily controlling the output flow rate, the mixed proportion is controlled to generate the product with the stable quality when two or more liquid materials must be mixed according to the specific proportion.

Abstract: The present invention discloses a spray coating system with constant pressure and stirring function. The spray coating system comprises a stirring barrel containing a mixture material, a stirrer stirring the mixture material, a control valve used for controlling a spray rate of the packaging material, a nozzle connected to the control valve for spouting the packaging material in spray form, a circulation pipe line connected between the stirring barrel and the control valve and a peristaltic pump mounted at the circulation pipe line. Thereby, the spray coating system is applied to the dispensing process of the LED to stir the packaging material and spout the packaging material in spray form, and can transmit the packaging material remained back to the stirring barrel by the peristaltic pump for avoiding the extraneous entering to the packaging material and blocking the nozzle to advance the spray coating quality and efficiency.