Patents by Inventor Chun-Ming Laio

Chun-Ming Laio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating electronic package and carrier structure thereof
    Patent number: 11545385
    Abstract: A carrier structure having a strengthening layer is provided. The strengthening layer comprises 5 to 30% by weight polysiloxane, 1 to 20% by weight silicon dioxide, and 60 to 85% by weight polyethylene terephthalate (PET) film. The carrier structure is used in a semiconductor packaging process for improving the process reliability.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: January 3, 2023
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Tse-Yuan Lin, Chun-Ming Laio, Yu-Chih Cheng
  • METHOD FOR FABRICATING ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF
    Publication number: 20220028721
    Abstract: A carrier structure having a strengthening layer is provided. The strengthening layer comprises 5 to 30% by weight polysiloxane, 1 to 20% by weight silicon dioxide, and 60 to 85% by weight polyethylene terephthalate (PET) film. The carrier structure is used in a semiconductor packaging process for improving the process reliability.
    Type: Application
    Filed: March 23, 2021
    Publication date: January 27, 2022
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Tse-Yuan Lin, Chun-Ming Laio, Yu-Chih Cheng