Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.

Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.

Abstract: A compatibilizer and thermoplastic resin employing the same are provided. The compatibilizer includes about 100 parts by weight of polyolefin having at least one reactive functional group, and about 80-120 parts by weight of a copolymer, wherein the copolymer has x number of repeat units represented by y number of repeat units represented by z number of repeat units represented by and at least one terminal group represented by x, y, and z are independent and can be an integer larger than or equal to 1; and x/(x+y+z) is from about 0.5 to 0.7, y/(x+y+z) is from about 0.1 to 0.2, and z/(x+y+z) is from about 0.1 and 0.4.