Patents by Inventor Chun-Ming TING

Chun-Ming TING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081730
    Abstract: A display may include an array of pixels such as light-emitting diode pixels. The pixels may include multiple circuitry decks that each include one or more circuit components such as transistors, capacitors, and/or resistors. The circuitry decks may be vertically stacked. Each circuitry deck may include a planarization layer formed from a siloxane material that conforms to underlying components and provides a planar upper surface. In this way, circuitry components may be vertically stacked to mitigate the size of each pixel footprint. The circuitry components may include capacitors that include both a high-k dielectric layer and a low-k dielectric layer. The display pixel may include a via with a width of less than 1 micron.
    Type: Application
    Filed: June 26, 2024
    Publication date: March 6, 2025
    Inventors: Andrew Lin, Alper Ozgurluk, Chao Liang Chien, Cheuk Chi Lo, Chia-Yu Chen, Chien-Chung Wang, Chih Pang Chang, Chih-Hung Yu, Chih-Wei Chang, Chin Wei Hsu, ChinWei Hu, Chun-Kai Tzeng, Chun-Ming Tang, Chun-Yao Huang, Hung-Che Ting, Jung Yen Huang, Lungpao Hsin, Shih Chang Chang, Tien-Pei Chou, Wen Sheng Lo, Yu-Wen Liu, Yung Da Lai
  • Patent number: 10828745
    Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: November 10, 2020
    Assignee: IV Technologies CO., Ltd.
    Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
  • Publication number: 20180200864
    Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.
    Type: Application
    Filed: January 12, 2018
    Publication date: July 19, 2018
    Applicant: IV Technologies CO., Ltd.
    Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
  • Publication number: 20170174877
    Abstract: A compatibilizer and thermoplastic resin employing the same are provided. The compatibilizer includes about 100 parts by weight of polyolefin having at least one reactive functional group, and about 80-120 parts by weight of a copolymer, wherein the copolymer has x number of repeat units represented by y number of repeat units represented by z number of repeat units represented by and at least one terminal group represented by x, y, and z are independent and can be an integer larger than or equal to 1; and x/(x+y+z) is from about 0.5 to 0.7, y/(x+y+z) is from about 0.1 to 0.2, and z/(x+y+z) is from about 0.1 and 0.4.
    Type: Application
    Filed: March 30, 2016
    Publication date: June 22, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yao-Chu CHUNG, Wen-Faa KUO, Chun-Ming TING, Chien-Ming CHEN, Tien-Jung HUANG