Abstract: Disclosed is a system and method for producing a sound having a certain frequency range to maintain laying hens in more stable and comfortable conditions. The system comprises a basic wave generator for generating a pair of first basic waves having the same phase and a pair of second basic waves having opposite phases, a relaxation wave generator for generating a pair of relaxation waves by combining the pair of first basic waves and the pair of second basic waves with time, a modulator for generating a pair of relaxation sounds by modulating the pair of relaxation waves with a sound wave having an audible frequency, and an audio output unit composed of two left and right parts such that stereo sound is outputted, for receiving the pair of relaxation sounds and outputting the pair of relaxation sounds to the left and right parts, respectively.

Abstract: An apparatus for detecting an arc fault.

Abstract: An apparatus for detecting an arc fault.

Abstract: The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes a polymeric tape having windows patterned therein, metal patterns formed on the lower surface of the polymeric tape at either sides of said windows. The metal patterns have pad connection portions exposed through the window. Lead connection portions extend outwardly from said polymeric tape. An adhesive layer is formed on the lower surface of the tape. A lower chip is attached to a lower surface of the die pad. The lower chip includes an active surface having a plurality of electrode pads at approximately the center and a rear surface attached to the lower surface of the die pad. An upper chip is attached to an upper surface of the die pad.

Abstract: The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes a polymeric tape having windows patterned therein, metal patterns formed on the lower surface of the polymeric tape at either sides of said windows. The metal patterns have pad connection portions exposed through the window. Lead connection portions extend outwardly from said polymeric tape. An adhesive layer is formed on the lower surface of the tape. A lower chip is attached to a lower surface of the die pad. The lower chip includes an active surface having a plurality of electrode pads at approximately the center and a rear surface attached to the lower surface of the die pad. An upper chip is attached to an upper surface of the die pad.

Abstract: The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes a polymeric tape having windows patterned therein, metal patterns formed on the lower surface of the polymeric tape at either sides of said windows. The metal patterns have pad connection portions exposed through the window. Lead connection portions extend outwardly from said polymeric tape. An adhesive layer is formed on the lower surface of the tape. A lower chip is attached to a lower surface of the die pad. The lower chip includes an active surface having a plurality of electrode pads at approximately the center and a rear surface attached to the lower surface of the die pad. An upper chip is attached to an upper surface of the die pad.

Abstract: The present invention discloses a method of manufacturing a dual chip package using tape wiring boards. According to the method, an upper tape wiring board, a lower tape wiring board, and a lead frame are prepared. Each of the tape wiring boards includes a polymeric tape having windows patterned therein, metal patterns formed on the lower surface of the polymeric tape at either sides of said windows. The metal patterns have pad connection portions exposed through the window. Lead connection portions extend outwardly from said polymeric tape. An adhesive layer is formed on the lower surface of the tape. A lower chip is attached to a lower surface of the die pad. The lower chip includes an active surface having a plurality of electrode pads at approximately the center and a rear surface attached to the lower surface of the die pad. An upper chip is attached to an upper surface of the die pad.