Patents by Inventor Chun-Mu Chen

Chun-Mu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11248124
    Abstract: Molybdenum-silicon carbide composite powder and a fabrication method thereof are provided. The molybdenum-silicon carbide composite powder includes a micro-scale silicon carbide powder and a plurality of submicron-scale molybdenum particles bonding on the surface of the silicon carbide powder.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: February 15, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Chang Fann, Chun-Mu Chen
  • Publication number: 20200199370
    Abstract: Molybdenum-silicon carbide composite powder and a fabrication method thereof are provided. The molybdenum-silicon carbide composite powder includes a micro-scale silicon carbide powder and a plurality of submicron-scale molybdenum particles bonding on the surface of the silicon carbide powder.
    Type: Application
    Filed: October 22, 2019
    Publication date: June 25, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Yuan-Chang Fann, Chun-Mu Chen
  • Patent number: 8928218
    Abstract: A dielectric barrier discharge lamp includes a lamp tube, a discharge gas, a support member, a first electrode, and a second electrode. The lamp tube has a first and a second sealed end. The discharge gas is filled in the lamp tube. The support member is disposed at the first sealed end and extended toward the inside of the lamp tube. The support member has an accommodating space with its opening facing the inside of the lamp tube. The first electrode is disposed in the lamp tube. A first terminal of the first electrode passes through the opening of the accommodating space. A gap exists between an end of the first terminal of the first electrode and a closed end of the accommodating space. A second terminal of the first electrode penetrates and is closely fitted with the second sealed end. The second electrode is disposed outside the lamp tube.
    Type: Grant
    Filed: April 3, 2013
    Date of Patent: January 6, 2015
    Assignee: Industrial Technology Research Institute
    Inventors: Bee-Yu Wei, Jen-Hung Hsu, Ming-Kai Hsu, Chun-Mu Chen
  • Patent number: 8921679
    Abstract: The disclosure provides a thermoelectric module and a method for fabricating the same. The thermoelectric module includes a plurality of p-type and n-type segmented thermoelectric elements disposed in a planar array, wherein the p-type and n-type segmented thermoelectric elements are coupled in series via a plurality of first electrodes and second electrodes. Each segmented thermoelectric element includes at least two vertically homogeneous thermoelectric segments, and at least two adjacent thermoelectric segments have a fusion-bonding layer therebetween. The fusion-bonding layer includes a tin-containing material and a plurality of spacers disposed among the tin-containing material, wherein the melting point of the spacers is higher than the liquidus temperature of the tin-containing material.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: December 30, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Chih-Hao Chang, Tse-Hsiao Lee
  • Patent number: 8865997
    Abstract: The invention provides a thermoelectric material, a method for fabricating the same, and a thermoelectric module employing the same. The thermoelectric material is composed of Zn4Sb(3-x)Rex, wherein 0<x<0.02. Further, the thermoelectric module includes a first electrode, and a thermoelectric element, wherein the thermoelectric element includes the thermoelectric material composed of Zn4Sb(3-x)Rex and contacts to the first electrode; and a second electrode contacting to the thermoelectric element, wherein the first and second electrodes are separated by the thermoelectric element.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: October 21, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Chia-Chan Hsu, Chun-Mu Chen, Shan-Haw Chiou
  • Publication number: 20140125217
    Abstract: A dielectric barrier discharge lamp includes a lamp tube, a discharge gas, a support member, a first electrode, and a second electrode. The lamp tube has a first and a second sealed end. The discharge gas is filled in the lamp tube. The support member is disposed at the first sealed end and extended toward the inside of the lamp tube. The support member has an accommodating space with its opening facing the inside of the lamp tube. The first electrode is disposed in the lamp tube. A first terminal of the first electrode passes through the opening of the accommodating space. A gap exists between an end of the first terminal of the first electrode and a closed end of the accommodating space. A second terminal of the first electrode penetrates and is closely fitted with the second sealed end. The second electrode is disposed outside the lamp tube.
    Type: Application
    Filed: April 3, 2013
    Publication date: May 8, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Bee-Yu Wei, Jen-Hung Hsu, Ming-Kai Hsu, Chun-Mu Chen
  • Publication number: 20130160805
    Abstract: The invention provides a thermoelectric material, a method for fabricating the same, and a thermoelectric module employing the same. The thermoelectric material is composed of Zn4Sb(3-x)Rex, wherein 0<x<0.02. Further, the thermoelectric module includes a first electrode, and a thermoelectric element, wherein the thermoelectric element includes the thermoelectric material composed of Zn4Sb(3-x)Rex and contacts to the first electrode; and a second electrode contacting to the thermoelectric element, wherein the first and second electrodes are separated by the thermoelectric element.
    Type: Application
    Filed: May 3, 2012
    Publication date: June 27, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Chan Hsu, Chun-Mu Chen, Shan-Haw Chiou
  • Patent number: 8373991
    Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: February 12, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Cheng-Chou Wong, Chih-Tsung Tu, Jen-Dong Hwang
  • Publication number: 20120167937
    Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.
    Type: Application
    Filed: August 1, 2011
    Publication date: July 5, 2012
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Hsu-Shen Chu, Cheng-Chuan Wang, Jenn-Dong Hwang
  • Patent number: 8161604
    Abstract: A 360° bi-directional rotary hinge formed of a fixed bracket, a rotary bracket, a limiter plate, a stop plate, a positioning plate, a spring ring and a fastening member for use in a folding electronic device is disclosed. Subject to matching between bottom blocks of the limiter plate and arched sliding grooves of the stop plate, movement of the stop plate is constrained by the fixed bracket, and therefore rotation of the rotary bracket of the 360° bi-directional rotary hinge is limited to a forward and backward 360° angle. Further, the stop plate carries an index block corresponding to a ?180° angle indication hole and a 180° angle indication hole on the base member of the folding electronic device for giving an indication when the rotary bracket is rotated to +180° or ?180° angle relative to the fixed bracket.
    Type: Grant
    Filed: June 15, 2010
    Date of Patent: April 24, 2012
    Assignees: Lianhong Art Co., Ltd., Wistron Corporation
    Inventors: Tsu-Yu Lin, Cheng-Yo Hsiao, Chun-Meng Hsu, Chun-Mu Chen
  • Publication number: 20110252601
    Abstract: A 360° bi-directional rotary hinge formed of a fixed bracket, a rotary bracket, a limiter plate, a stop plate, a positioning plate, a spring ring and a fastening member for use in a folding electronic device is disclosed. Subject to matching between bottom blocks of the limiter plate and arched sliding grooves of the stop plate, movement of the stop plate is constrained by the fixed bracket, and therefore rotation of the rotary bracket of the 360° bi-directional rotary hinge is limited to a forward and backward 360° angle. Further, the stop plate carries an index block corresponding to a ?180° angle indication hole and a 180° angle indication hole on the base member of the folding electronic device for giving an indication when the rotary bracket is rotated to +180° or ?180° angle relative to the fixed bracket.
    Type: Application
    Filed: June 15, 2010
    Publication date: October 20, 2011
    Inventors: Tzu-Yu Lin, Cheng-Yo Hsiao, Chun-Meng Hsu, Chun-Mu Chen
  • Publication number: 20090135567
    Abstract: The invention provides a metal thermal interface material (TIM) with through-holes in its body and/or zigzags or wave shapes on its border, which is suitable for use at thermal interfaces of a thermal conduction path from an integrated circuit die to its associated heat sink in a packaged microelectronic component. The invention also includes a thermal module and a packaged microelectronic component including the metal thermal interface material.
    Type: Application
    Filed: July 11, 2008
    Publication date: May 28, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Cheng-Chou Wong, Chih-Tsung Tu, Jen-Dong Hwang
  • Patent number: 5524698
    Abstract: A one-body hollow precision cast metal golf club head is fabricated by casting metal about a head core to form a shell, and melting and flowing out the head core. The head core is made of low melting point alloys having a melting point lower than that of the metal used for casting the shell and is coated with an aqueous solution prior to the casting process of the shell. The aqueous solution is a composition including inorganic powders, binders and solvent. The ratio of components should be inorganic powder:binder:solvent=(40-80):(1-10):(10-59) based on weight.
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: June 11, 1996
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Mu Chen, Chih-Chao Yang