Patents by Inventor Chun-Nan HUANG

Chun-Nan HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371688
    Abstract: Semiconductor devices and methods of manufacture are described herein. A method includes forming an opening through an interlayer dielectric (ILD) layer to expose a contact etch stop layer (CESL) disposed over a conductive feature in a metallization layer. The opening is formed using photo sensitive materials, lithographic techniques, and a dry etch process that stops on the CESL. Once the CESL is exposed, a CESL breakthrough process is performed to extend the opening through the CESL and expose the conductive feature. The CESL breakthrough process is a flexible process with a high selectivity of the CESL to ILD layer. Once the CESL breakthrough process has been performed, a conductive fill material may be deposited to fill or overfill the opening and is then planarized with the ILD layer to form a contact plug over the conductive feature in an intermediate step of forming a semiconductor device.
    Type: Application
    Filed: July 17, 2024
    Publication date: November 7, 2024
    Inventors: Yu-Shih Wang, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen, Ming-Hsi Yeh, Kuo-Bin Huang
  • Patent number: 12136566
    Abstract: Semiconductor devices and methods of manufacture are described herein. A method includes forming an opening through an interlayer dielectric (ILD) layer to expose a contact etch stop layer (CESL) disposed over a conductive feature in a metallization layer. The opening is formed using photo sensitive materials, lithographic techniques, and a dry etch process that stops on the CESL. Once the CESL is exposed, a CESL breakthrough process is performed to extend the opening through the CESL and expose the conductive feature. The CESL breakthrough process is a flexible process with a high selectivity of the CESL to ILD layer. Once the CESL breakthrough process has been performed, a conductive fill material may be deposited to fill or overfill the opening and is then planarized with the ILD layer to form a contact plug over the conductive feature in an intermediate step of forming a semiconductor device.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: November 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Shih Wang, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen, Ming-Hsi Yeh, Kuo-Bin Huang
  • Patent number: 12105006
    Abstract: A gas detection system for gynecological disease detection and a detection method using the same are provided. The gas detection system is configured to detect an analyte from a female vagina and includes a main body, a sleeve, a detector, a pump, and a controller. The main body includes a body portion and a head portion having an intake channel. The body portion includes a detection chamber and an exhaust channel. The detector includes at least one sensor configured to detect at least one target of the analyte and produce at least one detection signal. The pump is communicated with the detection chamber and the exhaust channel. The controller includes a processing unit and a first communication unit. The processing unit receives the at least one detection signal and controls the first communication unit to send the at least one detection signal.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 1, 2024
    Assignee: AINOS, INC.
    Inventors: Chia-Nan Liao, Chia-Pin Huang, Tzu-Ting Weng, Yu-Hsuan Liao, Chun-Hsien Tsai, Ting-Chuan Lee, Chun-Jung Tsai
  • Patent number: 12092832
    Abstract: A device for adjusting the degree of tightness is provided. The device is for a first strap element and a second strap element. The device includes an outer adjustment element, an inner adjustment element, and an intermediate adjustment element. The inner adjustment element is disposed inside the outer adjustment element. The intermediate adjustment element is disposed between the inner adjustment element and the outer adjustment element. The first strap element includes a first hollow region, and the second strap element includes a second hollow region. The inner adjustment element passes through the first hollow region and the second hollow region to adjust the degree of overlapping of the first hollow region and the second hollow region.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: September 17, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun-Feng Yeh, Chun-Lung Chen, Chun-Nan Huang, Bing-Kai Huang, Jia-Cheng Chang
  • Publication number: 20240304705
    Abstract: A semiconductor device includes a gate structure on a substrate, a first spacer on a sidewall of the gate structure, a second spacer on a sidewall of the first spacer, a third spacer on a sidewall of the second spacer, and first and second stacks of an epitaxial layer and a cap layer respectively disposed at first and second sides of the gate structure. Preferably, a part of the second spacer comprises an I-shape, the cap layer includes a planar top surface and an inclined sidewall, the cap layer contacts the second spacer and the third spacer directly, and the cap layer includes a vertical sidewall connected to the inclined sidewall.
    Type: Application
    Filed: May 16, 2024
    Publication date: September 12, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wei-Chih Chuang, Chia-Jong Liu, Kuang-Hsiu Chen, Chung-Ting Huang, Chi-Hsuan Tang, Kai-Hsiang Wang, Bing-Yang Jiang, Yu-Lin Cheng, Chun-Jen Chen, Yu-Shu Lin, Jhong-Yi Huang, Chao-Nan Chen, Guan-Ying Wu
  • Publication number: 20240297138
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first substrate and through vias formed through the first substrate. The package further includes redistribution layers formed over the first substrate and connected to the through vias and a first pillar layer formed over the redistribution layers. The package further includes a first barrier layer formed over the first pillar layer and a first cap layer formed over the first barrier layer. The package further includes an underfill layer formed over the redistribution layers and surrounding the first pillar layer, the first barrier layer, and the first cap layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first sidewall surface of the first pillar layer and a second sidewall surface of the first cap layer.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung CHEN, Yu-Nu HSU, Chun-Chen LIU, Heng-Chi HUANG, Chien-Chen LI, Shih-Yen CHEN, Cheng-Nan HSIEH, Kuo-Chio LIU, Chen-Shien CHEN, Chin-Yu KU, Te-Hsun PANG, Yuan-Feng WU, Sen-Chi CHIANG
  • Patent number: 12051619
    Abstract: Semiconductor devices and methods of manufacture are described herein. A method includes forming an opening through an interlayer dielectric (ILD) layer to expose a contact etch stop layer (CESL) disposed over a conductive feature in a metallization layer. The opening is formed using photo sensitive materials, lithographic techniques, and a dry etch process that stops on the CESL. Once the CESL is exposed, a CESL breakthrough process is performed to extend the opening through the CESL and expose the conductive feature. The CESL breakthrough process is a flexible process with a high selectivity of the CESL to ILD layer. Once the CESL breakthrough process has been performed, a conductive fill material may be deposited to fill or overfill the opening and is then planarized with the ILD layer to form a contact plug over the conductive feature in an intermediate step of forming a semiconductor device.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: July 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Shih Wang, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen, Ming-Hsi Yeh, Kuo-Bin Huang
  • Publication number: 20240243466
    Abstract: A wireless briefing device includes a first antenna, a second antenna, and a ground plane. Each of the first antenna and the second antenna couples out a frequency band. A distance between the first antenna and the ground plane is between 0.2 and 0.3 times of a wavelength of the frequency band, and a distance between the second antenna and the ground plane is between 0.2 and 0.3 times of the wavelength of the frequency band.
    Type: Application
    Filed: June 19, 2023
    Publication date: July 18, 2024
    Applicant: BENQ CORPORATION
    Inventors: Yu-Ping Huang, Chun-Han Lin, Chen-Chi Wu, Chia-Nan Shih, Cheng-Pu Lin
  • Patent number: 12001026
    Abstract: A head-mounted display includes a display device, a connecting structure and a head abutting portion. The connecting structure is in a shape of strip. The connecting structure has two opposite ends. The ends are respectively connected with the display device. The connecting structure and the display device define an accommodation space. The accommodation space is configured to accommodate a head of a user. The head abutting portion is pivotally connected with the connecting structure. The head abutting portion is at least partially located between the connecting structure and the display device. The head abutting portion is configured to abut against the head of the user.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 4, 2024
    Assignee: Quanta Computer Inc.
    Inventors: Hung-Yu Lin, Chun-Feng Yeh, Jia-Cheng Chang, Bing-Kai Huang, Chun-Nan Huang, Chun-Lung Chen
  • Publication number: 20230288709
    Abstract: A device for adjusting the degree of tightness is provided. The device is for a first strap element and a second strap element. The device includes an outer adjustment element, an inner adjustment element, and an intermediate adjustment element. The inner adjustment element is disposed inside the outer adjustment element. The intermediate adjustment element is disposed between the inner adjustment element and the outer adjustment element. The first strap element includes a first hollow region, and the second strap element includes a second hollow region. The inner adjustment element passes through the first hollow region and the second hollow region to adjust the degree of overlapping of the first hollow region and the second hollow region.
    Type: Application
    Filed: June 21, 2022
    Publication date: September 14, 2023
    Inventors: Chun-Feng YEH, Chun-Lung CHEN, Chun-Nan HUANG, Bing-Kai HUANG, Jia-Cheng CHANG
  • Patent number: 11632997
    Abstract: A headband adjustment structure includes a base, a wearing unit, a rotary adjusting assembly, a linkage member and an elastic element. The wearing unit includes a first end portion and a second end portion that overlap with each other. The first end portion and the second end portion are movably located in the base to define an adjustable accommodation space. The rotary adjusting assembly is pivotally located within the base, and provided with a gear body meshed with a first toothed rack of the first end portion and a second toothed rack of the second end portion so as to simultaneously move the first end portion and the second end portion in opposite directions for adjusting the adjustable accommodation space. The linkage member is connected to the rotary adjusting assembly. The elastic element abutting against the linkage member and the base, respectively.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: April 25, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chun-Wen Wang, Chun-Nan Huang, Chun-Lung Chen, Heng-Min Hu
  • Publication number: 20220413304
    Abstract: A head-mounted display includes a display device, a connecting structure and a head abutting portion. The connecting structure is in a shape of strip. The connecting structure has two opposite ends. The ends are respectively connected with the display device. The connecting structure and the display device define an accommodation space. The accommodation space is configured to accommodate a head of a user. The head abutting portion is pivotally connected with the connecting structure. The head abutting portion is at least partially located between the connecting structure and the display device. The head abutting portion is configured to abut against the head of the user.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 29, 2022
    Applicant: Quanta Computer Inc.
    Inventors: Hung-Yu Lin, Chun-Feng Yeh, Jia-Cheng Chang, Bing-Kai Huang, Chun-Nan Huang, Chun-Lung Chen
  • Publication number: 20220413545
    Abstract: A head-mounted display includes a face-abutting frame, a first adjustable structure, a second adjustable structure and a display module. The face-abutting frame has a first side and a second side opposite to each other. The first side abuts against a face of a user. The face-abutting frame defines a space corresponding to eyes of the user. The first adjustable structure connects with the second side. The second adjustable structure connects with the second side and defines the space with the first adjustable structure. The second adjustable structure movably and mechanically connects with the first adjustable structure. The display module corresponds to the space and movably and mechanically connects with the first adjustable structure. The first and the second adjustable structures can move close to or away from each other. The display module and the first adjustable structure can move close to or away from each other.
    Type: Application
    Filed: September 21, 2021
    Publication date: December 29, 2022
    Applicant: Quanta Computer Inc.
    Inventors: Hung-Yu Lin, Chun-Feng Yeh, Jia-Cheng Chang, Bing-Kai Huang, Chun-Nan Huang, Chun-Lung Chen
  • Publication number: 20210315301
    Abstract: A headband adjustment structure includes a base, a wearing unit, a rotary adjusting assembly, a linkage member and an elastic element. The wearing unit includes a first end portion and a second end portion that overlap with each other. The first end portion and the second end portion are movably located in the base to define an adjustable accommodation space. The rotary adjusting assembly is pivotally located within the base, and provided with a gear body meshed with a first toothed rack of the first end portion and a second toothed rack of the second end portion so as to simultaneously move the first end portion and the second end portion in opposite directions for adjusting the adjustable accommodation space. The linkage member is connected to the rotary adjusting assembly. The elastic element abutting against the linkage member and the base, respectively.
    Type: Application
    Filed: July 15, 2020
    Publication date: October 14, 2021
    Applicant: Quanta Computer Inc.
    Inventors: Chun-Wen Wang, Chun-Nan Huang, Chun-Lung Chen, Heng-Min Hu
  • Patent number: 11099357
    Abstract: An electronic device with camera assembly which can be deployed and can be retracted allows a maximum size of display screen on a front surface of the device. The device includes a housing and at least a first lens module if not an additional and second lens module. The housing includes a front surface with a display screen and a back surface. The back surface defines a receiving groove receiving the first lens module. The first lens module is received in the receiving groove and capable of being stretching out of the receiving groove to face a front side of the electronic device when deployed, to capture a scene in front of the device. A controlling method suitable for a first lens module and/or a second lens module to capture a front scene and a rear scene is also provided.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: August 24, 2021
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventor: Chun-Nan Huang
  • Publication number: 20200081227
    Abstract: An electronic device with camera assembly which can be deployed and can be retracted allows a maximum size of display screen on a front surface of the device. The device includes a housing and at least a first lens module if not an additional and second lens module. The housing includes a front surface with a display screen and a back surface. The back surface defines a receiving groove receiving the first lens module. The first lens module is received in the receiving groove and capable of being stretching out of the receiving groove to face a front side of the electronic device when deployed, to capture a scene in front of the device. A controlling method suitable for a first lens module and/or a second lens module to capture a front scene and a rear scene is also provided.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 12, 2020
    Inventor: CHUN-NAN HUANG
  • Publication number: 20170180850
    Abstract: A waterproof electronic device that is waterproof and has pressure-equilibrium functions is provided. The waterproof electronic device includes a housing, a microphone, an elastic element, and a waterproof element. The housing has a chamber and an acoustic hole communicating with the chamber. The microphone is disposed in the chamber. The elastic element is disposed on the microphone. The elastic element includes a through hole facing the microphone, and a ventilation groove communicating with the through hole. The waterproof element is connected to the elastic element and the housing, and is configured to block liquid. The waterproof element includes pores communicating with the acoustic hole and the through hole.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Inventors: Chia-Ju HSU, Yu-Liang CHEN, Ko-Chun WANG, Chun-Nan HUANG, Zih-Yun WANG, Chun-Wen WANG, Chiung-Chang TSAI, Ji-Dein WU, Chun-Lung CHEN, Chen-Hsiang LIN