Patents by Inventor Chun NG

Chun NG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060190860
    Abstract: A method and system for debugging using replicated logic and trigger logic is described. A representation of a circuit is compiled. One or more signals are selected for triggering and trigger logic is inserted into the circuit. A portion of the circuit is selected for replication. The selected portion of the circuit is replicated and delay logic is inserted to delay the inputs into the replicated portion of the circuit. The representation of the circuit is recompiled and programmed into a hardware device. A debugger may then be invoked. One or more of the triggering signals are selected. For each selected triggering signal, one or more states are selected to setup a trigger condition. The hardware device may then be run. The replicated portion of the circuit will be paused when the trigger condition occurs. The states of registers in the replicated portion of the circuit and the sequence of steps that led to the trigger condition may then be recorded.
    Type: Application
    Filed: April 22, 2005
    Publication date: August 24, 2006
    Inventors: Chun Ng, Mario Larouche
  • Publication number: 20050059295
    Abstract: A multiport connector which includes a housing having at least two aligned compartments, each compartment being structured and arranged to receive respective plugs. A multilayer printed wiring board separates the two compartments, the printed wiring board having circuit patterns on opposite sides of opposed non-conductive layers and a metal shielding layer intermediate the non-conductive layers. A first plurality of conductive contact fingers is disposed in one of the compartments, the first plurality of fingers having first portions for making electrical contact with one of the plugs and second portions for making contact with the circuit pattern on one of the non-conductive layers of the multilayer printed wiring board.
    Type: Application
    Filed: September 8, 2003
    Publication date: March 17, 2005
    Inventors: John Chen, Kwok Lai, Kuok Leong, Man Yip, Wai Leung, Chun NG, Quincy Lee