Abstract: The present disclosure relates to a wind outlet structure having a case, at least one wind outlet part, at least one windshield and at least one controller. Interior of the wind outlet part forms a wind outlet channel, and another one surface of the wind outlet part opposite to one surface of wind outlet part which is connected to the case has wind outlet holes. The windshield is disposed in the wind outlet channel of the wind outlet part, and the windshield perforations. The controller is disposed in the wind outlet channel of the wind outlet part and connected to the windshield, and the controller controls the windshield o move laterally, such that the perforations are communicated with or offset to the wind outlet holes. Therefore, an appropriate number of the wind outlet holes for wind supply operation can be controlled according to a size of the glass.

Abstract: A multi-stage heating apparatus includes a cover, plural driving modules and plural heating modules to form a manufacture area that covers most of the different sized workpieces. With the integration of a control circuit, users simply reset or selecting control parameters of each driving module and each heating module through the control circuit to generate a heating mode for workpieces of different sizes. This apparatus not just fulfills the operating requirement of different sized workpieces only, but also lowers the equipment cost effectively.

Abstract: A light emitting semiconductor device is provided, wherein the light emitting semiconductor device comprises a substrate, a plurality of flip chips, a heat conductive board and an insulating board. These flip chips are electrically connected on the substrate. The heat conductive board has a protruding portion used to support the substrate. The insulating board has a plurality of connecting pads and an opening, wherein the protruding portion is sheathed in the opening, so as to expose the substrate. The exposed substrate is then electrically connected to the connecting pads.

Abstract: A light emitting semiconductor device is provided, wherein the light emitting semiconductor device comprises a substrate, a plurality of flip chips, a heat conductive board and an insulating board. These flip chips are electrically connected on the substrate. The heat conductive board has a protruding portion used to support the substrate. The insulating board has a plurality of connecting pads and an opening, wherein the protruding portion is sheathed in the opening, so as to expose the substrate. The exposed substrate is then electrically connected to the connecting pads.