Abstract: A device for treating a user's skin using plasma is provided. The device comprises a plasma generation assembly and a power supply. The plasma generation assembly comprises a discharge electrode including a first surface; a first dielectric material layer provided on the first surface of the discharge electrode and the first surface, a ground electrode surrounding the discharge electrode, and an insulation member spacing around the discharge electrode from the ground electrode. The power supply configured to apply power to the plasma generation assembly so that plasma is generated from the first surface of the discharge electrode to the ground electrode and between the first dielectric material layer and the user's skin.

Abstract: The present application discloses a semiconductor structure. The semiconductor structure a top die and a bottom die, and the maximum die size is constrained to reticle dimension. Each die includes (1) core: computation circuits, (2) phy: analog circuit connecting to memory, (3) I/O: analog circuit connecting output elements, (4) SERDES: serial high speed analog circuit, (5) intra-stack connection circuit, and (6) cache memory. This semiconductor structure can be chapleted design for high wafer yield with least tape out masks for cost saving. The intra-stack connection circuit connects the top die and the bottom die in the shortest distance (about tens of micrometers), so as to provide high signal quality and power efficiency.

Abstract: The present application discloses a semiconductor structure and methods for manufacturing semiconductor structures. The semiconductor structure includes a plurality of bottom dies and a top die stacked on the bottom dies. The bottom dies receive power supplies through tiny through silicon vias (TSVs) formed in backside substrates of the bottom dies, while the top die receives power supplies through dielectric vias (TDVs) formed in a dielectric layer that covers the bottom dies. By enabling backside power delivery to the bottom die, more space can be provided for trace routing between stacked dies. Therefore, greater computation capability can be achieved within a smaller chip area with less power loss.

Abstract: In a method for manufacturing an optical element disclosed by the present invention, at least one atomized surface forming member corresponding to an atomized surface of the optical element is provided in an injection mold for molding the optical element. Through loading surface 3D parameters of the atomized surface forming member as well as laser pattern processing parameters, the method forms a rough surface having uniform roughness at a non-planar part of at least one curved or arched plane. Thus, an atomized surface may be disposed at a non-planar part of a curved or arched plane of the optical element, and a uniform atomization level may be achieved at the entire atomized surface. The method allows the optical element to produce preferred optical performance and effects, facilitates reducing material costs of the optical element, and promotes maintaining the expected mechanical structural strength of the optical element.

Abstract: A method and a structure for improving the uniformity of light emitted from a backlight module are provided. In accordance with the present invention, a plurality of optical microstructures are intermittently distributed on an LGP of a backlight module. Each of the microstructures further includes a plurality of optical sub-microstructures. The optical microstructures and the optical sub-microstructures are distributed on the LGP with varied distribution intensities in three dimensions, such that at where the optical microstructures and the optical sub-microstructures are distributed with a larger distribution intensities the LGP refracts and reflects more light, and at where the optical microstructures and the optical sub-microstructures are distributed with a smaller distribution intensities the LGP refracts and reflects less light.

Abstract: A method and a structure for improving the uniformity light emitted from a backlight module are provided. In accordance with the present invention, a plurality of optical microstructures are intermittently distributed on an LGP of a backlight module. Each of the microstructures further includes a plurality of optical sub-microstructures. The optical microstructures and the optical sub-microstructures are distributed on the LGP with varied distribution intensities in three dimensions, such that at where the optical microstructures and the optical sub-microstructures are distributed with a larger distribution intensities the LGP refracts and reflects more light, and at where the optical microstructures and the optical sub-microstructures are distributed with a smaller distribution intensities the LGP refracts and reflects less light. In such a way, by designing particular distribution intensities of the optical microstructures and the optical sub-microstructures, the light emitted from the LGP can be uniformed.

Abstract: The present invention discloses a method for automatically detecting a nasal tumor from the MR (magnetic resonance) images. First, the pixels that have specific trends and are affected by contrast agents with specific level will be filtered according to the developing coefficient and control coefficient of grey prediction. Then the tumor area would be detected by using Fuzzy C-means clustering technique to distinguish the differences between normal tissue and tumor. Owing to the work of grey prediction, calculation in the Fuzzy C-means clustering technique can be dramatically reduced and the result of tumor detection is enhanced.